
AM1808BZWTD4 Embedded - Microprocessors by Texas Instruments
AM1808BZWTD4 is a Embedded - Microprocessors from Texas Instruments in manufacturer-listed packaging. It is commonly reviewed for IC MPU SITARA 456MHZ 361NFBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
AM1808BZWTD4
- Internal code
TCE000116893
- Package
-
- Manufacturer
- Texas Instruments
Key specifications
- Series
Sitara™
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Embedded - Microprocessors
- Description
IC MPU SITARA 456MHZ 361NFBGA
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for AM1808BZWTD4 before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: AM1808BZWTD4
- Package to verify: -
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for AM1808BZWTD4 from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
Cincon
Features
* Universal Input Range 90-264VAC
* Continuous Short Circuit Protection
* Over Voltage Protection
* Meets EN60601-1 and EN55011 Class B
* CEC Level IV Compliant (Output Cable Length≦ 1800mm) (TR30RAM050: Output Cable Length≦ 1500mm)
* Efficiency & Standby Power Meet Level V (Option) (Output Cable Length≦ 1800mm) (TR30RAM050、 TR30RAM090: Output Cable Length≦ 1220mm)
* Provide PSE Mark
Technical parameters
Parameters
Compare grouped AM1808BZWTD4 parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Parameter
Supply Voltage - Max
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Product Attribute
Packaging
Tray
Product Attribute
Lead Free
Lead Free
Product Attribute
Part Status
Obsolete
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Peak Reflow Temperature (Cel)
260
| Parameter | Value |
|---|---|
Supply Voltage - Max Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the application's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings, as exceeding this limit may cause permanent failure. | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Parameter | Value |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.8mm |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Copper, Silver, Tin |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | I2C, SPI, UART, USB |
Number Of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.3V |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microprocessors |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Sitara™ |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~90°C TJ |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | no |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 1.35V |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1.3V |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.35V |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 456MHz |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | AM1808 |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 361 |
Co-Processors/DSP Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements. | System Control; CP15 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 361 |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 361-LFBGA |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 950mV |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 361 |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 23 |
Connector Type Specifies the connector series or family, such as USB, RJ45, or D-Sub. This determines mechanical compatibility, pin layout, and mating standards. Verify against the datasheet to ensure the connector matches your board design and mating counterpart. | LPDDR, DDR2 |
Data Interface Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design. | LCD |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | AM1808BZWTD4 |
| Parameter | Value |
|---|---|
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Silver/Copper (Sn/Ag/Cu) |
UPs/UCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | MICROPROCESSOR, RISC |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 32 |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
Supply Voltage Limit-Max Specifies the absolute maximum supply voltage that can be applied to the device without causing damage or malfunction. Engineers must verify this limit against the datasheet to ensure safe operating conditions and avoid overvoltage stress in the application. | YES |
Integrated Cache Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet. | YES |
Peak Reflow Temperature-Max (S) Specifies the maximum duration in seconds that a component can withstand at its peak reflow temperature during soldering. Critical for PCB assembly process control to prevent thermal damage. Verify against the datasheet for your specific soldering profile. | ARM |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 8kB |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | FIXED POINT |
SATA Interface Indicates the SATA interface support on the component. Verify the SATA revision and port configuration against the datasheet to ensure compatibility with your storage devices and system design. | SATA 3Gbps (1) |
Frequency Compensation Method Technique used to ensure amplifier stability and prevent oscillation. Common methods include internal or external compensation. Choose the right method for your gain configuration and bandwidth needs. Verify stability in your circuit with the recommended compensation network from the datasheet. | 1 |
Number Of Ethernet Channels Indicates how many independent Ethernet interfaces the component supports. Compare this with your system's networking requirements to ensure sufficient connectivity. Verify against the datasheet for exact port configurations and supported protocols. | 10/100Mbps (1) |
Manufacturer Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity. | ARM926EJ-S |
Standby Voltage-Min Specifies the minimum supply voltage required for the device to maintain standby operation. This is crucial for low-power designs where the component must retain state or wake-up capability. Check this value against your power rail to ensure reliable standby performance and avoid unintended shutdown. | No |
Ti Ti is a specific parameter value for this component. Engineers compare it to datasheet specifications to ensure the part meets design requirements. Verify Ti against the manufacturer's datasheet for your application. | I2C, McASP, McBSP, SPI, MMC/SD, UART |
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e1 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for AM1808BZWTD4. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact AM1808BZWTD4 ordering code, packaging, stock, datasheet, and replacement path.
What does AM1808BZWTD4 mean?
AM1808BZWTD4 is the exact ordering code listed for a Embedded - Microprocessors component from Texas Instruments. The current package reference is -, with listed context including IC MPU SITARA 456MHZ 361NFBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the AM1808BZWTD4 ordering code?
Treat AM1808BZWTD4 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is AM1808BZWTD4 supplied in?
AM1808BZWTD4 is currently listed with package reference - from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is AM1808BZWTD4 currently available?
AM1808BZWTD4 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (95667), available quantity (64295), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare AM1808BZWTD4 alternatives?
A mapped alternative list is not currently published for AM1808BZWTD4. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





