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MIC59P60YN PMIC - Power Distribution Switches, Load Drivers by Microchip Technology

MIC59P60YN is a PMIC - Power Distribution Switches, Load Drivers from Microchip Technology in DIP packaging. It is commonly reviewed for IC DRVR LATCH 8BIT SER IN 20DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MIC59P60YN PMIC - Power Distribution Switches, Load Drivers by Microchip Technology | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

MIC59P60YN

Internal code

TCE000115710

Package

DIP

Key specifications

Series

-

Min Quantity

1

Description

IC DRVR LATCH 8BIT SER IN 20DIP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MIC59P60YN before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MIC59P60YN
  • Package to verify: DIP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped MIC59P60YN parameters from Microchip Technology, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Mounting Type

    Through Hole

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Packaging

    Tube

MIC59P60YN Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Through Hole
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2011
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

7 Weeks
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

5V
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C TA
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

25.9mm
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Microchip Technology
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

6.4mA
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

20-DIP (0.300, 7.62mm)
Polarity

Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.

Inverting
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - Power Distribution Switches, Load Drivers
Feature

This attribute highlights special characteristics or functions of the component, such as built-in protection, mounting style, or unique performance traits. Engineers compare these features to match specific application requirements. Always verify against the datasheet for complete specifications.

Status Flag
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

20
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

20
Minimum Supply Voltage

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

5V
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Through Hole
Number Of Circuits

Specifies the total number of independent electrical paths or circuits within the component. This is critical for connectors, switches, and relay arrays to match the required wiring scheme. Always verify against the datasheet to ensure the circuit count meets your application's needs.

1
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

NOT SPECIFIED
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

NOT SPECIFIED
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

6.35mm
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

2.54mm
Power Rating

Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits.

2W
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

15V
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

500mA
Output Type

Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.

Bipolar
Low Level Output Current

Specifies the current the device can sink when its output is driven to a low logic state. Compare this value with the input current of connected loads to ensure reliable logic levels. Verify against the datasheet for maximum ratings and temperature effects.

500mA
High Level Output Current

Specifies the maximum current the output can source when the logic level is high. This is critical for driving loads such as LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or damage.

500mA
Driver Number Of Bits

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

8
Output Characteristics

Review the output characteristics to understand how the device behaves under various load and supply conditions. This includes voltage, current, and timing parameters. Verify these against your application requirements and the datasheet to ensure proper operation.

OPEN-COLLECTOR
Switch Type

Specifies the mechanical construction or actuation method of the switch, such as toggle, pushbutton, or slide. This determines how the switch is operated and its suitability for your application. Verify the exact type against the datasheet to ensure proper fit and function.

Latched Driver
Max Output Voltage

Specifies the highest voltage the device can deliver at its output under specified conditions. Compare this limit with your application's supply and load requirements to ensure safe operation and avoid overvoltage damage.

80V
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

Strobe, Serial
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

TTL AND CMOS COMPATIBLE INPUTS
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

MIC59P60
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MIC59P60YN
MIC59P60YN Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
MIC59P60YN Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Matte Tin (Sn) - annealed
Output Configuration

Specifies the topology of the output stage, such as push-pull, open collector, or half-bridge. This determines how the device drives loads and interfaces with external circuitry. Verify against the datasheet to ensure compatibility with your application's requirements.

Low Side
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Current Limiting (Fixed), Over Temperature, UVLO
Number Of Output Lines

Specifies how many independent output channels or signal lines the component provides. Compare this when selecting drivers, regulators, or logic devices to ensure the part can drive all required loads. Verify against the datasheet output stage description.

8
Built-In Protections

Indicates protection features integrated into the component, such as overcurrent, overvoltage, or thermal shutdown. These safeguards help prevent damage during fault conditions. Verify which protections are included and their thresholds in the datasheet to ensure they meet your application's safety requirements.

UNDER VOLTAGE
Output Current Flow Direction

Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.

SINK
Logic Function

Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.

Latch, Shift Register
Voltage - Load

Specifies the voltage supplied to the load under normal operating conditions. Compare this value with your system's power supply and load requirements to ensure compatibility. Verify against the datasheet for exact tolerances and operating ranges.

5V~12V
MIC59P60YN Package Parameter
ParameterValue
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

3.7mm

Datasheet preview

Datasheet PDF viewer

Preview the MIC59P60YN datasheet from Microchip Technology to check package, electrical characteristics, application notes, and document evidence before RFQ.

Microchip Technology

MIC59P60YN

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MIC59P60YN. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MIC59P60YN ordering code, packaging, stock, datasheet, and replacement path.

What does MIC59P60YN mean?

MIC59P60YN is the exact ordering code listed for a PMIC - Power Distribution Switches, Load Drivers component from Microchip Technology. The current package reference is DIP, with listed context including IC DRVR LATCH 8BIT SER IN 20DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MIC59P60YN ordering code?

Treat MIC59P60YN as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Microchip Technology, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MIC59P60YN supplied in?

MIC59P60YN is currently listed with package reference DIP from Microchip Technology. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MIC59P60YN currently available?

MIC59P60YN is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (78134), available quantity (72429), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MIC59P60YN alternatives?

A mapped alternative list is not currently published for MIC59P60YN. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.