CY8CLED02-8SXI Embedded - Microcontrollers - Application Specific by Cypress Semiconductor
CY8CLED02-8SXI is a Embedded - Microcontrollers - Application Specific from Cypress Semiconductor in 8SOIC packaging. It is commonly reviewed for IC MCU 8BIT 4KB FLASH 8SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for CY8CLED02-8SXI before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: CY8CLED02-8SXI
Package to verify: 8SOIC
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped CY8CLED02-8SXI parameters from Cypress Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
CY8CLED02-8SXI Product Parameter
Parameter
Value
Oscillator Type
Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.
Internal
RAM Size
Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.
256 x 8
Terminal Finish
Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.
Matte Tin (Sn)
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
2.5/5V
Data Bus Width
Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.
8b
Time At Peak Reflow Temperature (Max)
Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.
20
Multiplexed Display Capability
Indicates whether the display can be driven in a multiplexed mode, reducing the number of I/O pins required. This is important for microcontroller-based designs with limited pins. Check the datasheet for maximum multiplexing ratio and refresh rate requirements.
NO
Manufacturer
Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity.
M8C
Peripherals
Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.
LVD, POR, PWM, WDT
Data Input Mode
Specifies how data is fed into the component, such as serial or parallel. This affects interface compatibility and system design. Verify the mode against your microcontroller or host interface to ensure proper communication and data transfer.
SERIAL
Voltage - Supply (Vcc/Vdd)
Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.
4kB
Speed
Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed.
FLASH (4KB)
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
2.4V~5.25V
CY8CLED02-8SXI Product Attribute
Parameter
Value
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tube
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2011
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Obsolete
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~85°C
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
High Level Output Current
Specifies the maximum current the output can source when the logic level is high. This is critical for driving loads such as LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or damage.
10mA
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
8-SOIC (0.154, 3.90mm Width)
Frequency
Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.
24MHz
Nominal Supply Current
Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.
4mA
Number Of Functions
Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.
1
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
4mm
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Cypress Semiconductor
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
5mm
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
1.27mm
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
8
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
8
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
8
Low Level Output Current
Specifies the current the device can sink when its output is driven to a low logic state. Compare this value with the input current of connected loads to ensure reliable logic levels. Verify against the datasheet for maximum ratings and temperature effects.
25mA
Memory Type
Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.
FLASH
Number Of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
6
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Display Drivers
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - Microcontrollers - Application Specific
Controller Series
Identifies the product family or series of the controller, which often indicates its feature set, performance level, and compatibility. Compare series to understand differences in capabilities and ensure the controller meets your application requirements. Always verify the exact series against the datasheet.
CY8CLED
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
CY8CLED02
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
1.63mm
Applications
Specify the typical end-use scenarios for this electronic component, such as consumer electronics, automotive, industrial, or telecommunications. This helps engineers quickly assess suitability for their design. Verify against the datasheet's application section.
HB LED Controller
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
EZ-Color™ CY8CLED
Interface
Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.
I2C, IrDA, SPI, UART/USART
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
2.55V
Max Supply Current
Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.
4kA
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
CY8CLED02-8SXI
Datasheet preview
Datasheet PDF viewer
Preview the CY8CLED02-8SXI datasheet from Cypress Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for CY8CLED02-8SXI. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Targeted answers for buyers verifying the exact CY8CLED02-8SXI ordering code, packaging, stock, datasheet, and replacement path.
What does CY8CLED02-8SXI mean?
CY8CLED02-8SXI is the exact ordering code listed for a Embedded - Microcontrollers - Application Specific component from Cypress Semiconductor. The current package reference is 8SOIC, with listed context including IC MCU 8BIT 4KB FLASH 8SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the CY8CLED02-8SXI ordering code?
Treat CY8CLED02-8SXI as the full ordering code during RFQ and engineering review. Confirm the listed 8SOIC package, manufacturer documentation from Cypress Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is CY8CLED02-8SXI supplied in?
CY8CLED02-8SXI is currently listed with package reference 8SOIC from Cypress Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is CY8CLED02-8SXI currently available?
CY8CLED02-8SXI is currently marked with stock availability on this page. Before ordering, confirm the package (8SOIC), listed stock (84234), available quantity (79727), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare CY8CLED02-8SXI alternatives?
A mapped alternative list is not currently published for CY8CLED02-8SXI. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.