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EP20K200BC356-1X Embedded - FPGAs (Field Programmable Gate Array) by Intel

EP20K200BC356-1X is a Embedded - FPGAs (Field Programmable Gate Array) from Intel in BGA packaging. It is commonly reviewed for IC FPGA 277 I/O 356BGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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EP20K200BC356-1X Embedded - FPGAs (Field Programmable Gate Array) by Intel | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

EP20K200BC356-1X

Internal code

TCE000109695

Package

BGA

Manufacturer
Intel

Key specifications

Series

APEX-20K®

Min Quantity

1

Description

IC FPGA 277 I/O 356BGA

key Attributes

-

Globally recognized certifications

4 certifications

Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.

  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

How to order EP20K200BC356-1X

Confirm the core buying details for this exact ordering code before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO Release

Part confirmation

  • Exact MPN confirmed: EP20K200BC356-1X
  • Package to verify: BGA

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical Details

Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.

Overview

This datasheet describes configuration devices for SRAM-based look-up table (LUT) devices.
Features Configuration devices for SRAM-based LUT devices offer the following features:
• Configures Altera ACEX 1K, APEX 20K (including APEX 20K, APEX 20KC, and APEX 20KE), APEX II, Arria GX, Cyclone, Cyclone II, FLEX 10K (including FLEX 10KE and FLEX 10KA) Mercury, Stratix, Stratix GX, Stratix II, and Stratix II GX devices
• Easy-to-use four-pin interface
• Low current during configuration and near-zero standby mode current
• Programming support with the Altera Programming Unit (APU) and programming hardware from Data I/O, BP Microsystems, and other third-party programmers
• Available in compact plastic packages
• 8-pin plastic dual in-line (PDIP) package
• 20-pin plastic J-lead chip carrier (PLCC) package
• 32-pin plastic thin quad flat pack (TQFP) package
• EPC2 device has reprogrammable flash configuration memory
• 5.0-V and 3.3-V in-system programmability (ISP) through the built-in IEEE Std. 1149.1 JTAG interface
• Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1
• Supports programming through Serial Vector Format File (.svf), Jam Standard Test and Programming Language (STAPL) Format File (.jam), JAM Byte Code File (.jbc), and the Quartus II and MAX+PLUS II softwares using the USB-Blaster, MasterBlaster, ByteBlaster II, EthernetBlaster, or ByteBlasterMV download cable
• Supports programming through Programmer Object File (.pof) for EPC1 and EPC1441 devices
• nINIT_CONF pin allows INIT_CONF JTAG instruction to begin FPGA configuration

Popular Specs Surfaced First

Open The Official Datasheet

Review the latest datasheet for EP20K200BC356-1X from Intel in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.

View EP20K200BC356-1X Datasheet
  • Product Attribute

    Part Status

    Active

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    Lead Free

    Contains Lead

  • Product Attribute

    Published

    2001

  • Product Attribute

    Factory Lead Time

    10 Weeks

  • Product Attribute

    Max Operating Temperature

    85°C

EP20K200BC356-1X Product Attribute
ParameterValue
Part StatusActive
REACH StatusREACH Unaffected
Lead FreeContains Lead
Published2001
Factory Lead Time10 Weeks
Max Operating Temperature85°C
CategoriesIntegrated Circuits (ICs)
TechnologyCMOS
Length35mm
Terminal FormBALL
HTS Code8542.39.00.01
Max Supply Voltage2.625V
Min Supply Voltage2.375V
ECCN3A001A2A
Pbfree Codeno
Reflow Temperature-Max (S)30
Radiation HardeningNo
Supply Voltage2.5V
MountSurface Mount
Terminal Pitch1.27mm
Terminal PositionBOTTOM
Peak Reflow Temperature (Cel)220
Operating Supply Voltage2.5V
Min Operating Temperature0°C
Frequency250MHz
Width35mm
Sub-CategoriesEmbedded - FPGAs (Field Programmable Gate Array)
SubcategoryField Programmable Gate Arrays
Temperature GradeOTHER
Number Of Dedicated Inputs4
ManufacturerIntel
Number Of Outputs271
Package / CaseBGA
Number Of Terminations356
Number Of I/O277
Number Of Pins356
Pin Count356
SeriesAPEX-20K®
Manufacturer'S Part No.EP20K200BC356-1X
EP20K200BC356-1X Product Parameter
ParameterValue
Power Supplies2.52.5/3.3V
Terminal FinishTin/Lead (Sn63Pb37)
Propagation Delay2.5 ns
Output FunctionMACROCELL
Programmable Logic TypeLOADABLE PLD
Frequency (Max)180MHz
Number Of Gates526000
Number Of Logic Blocks (LABs)832
RAM Size13kB
Number Of Logic Elements/Cells8320
Memory Size13kB
EP20K200BC356-1X Export Classifications & Environmental
ParameterValue
RoHS StatusRoHS Compliant
JESD-609 Codee0
HTSUS8542.39.0001
Moisture Sensitivity Level (MSL)3 (168 Hours)
ECCN Code3A991
EP20K200BC356-1X Package Parameter
ParameterValue
Height Seated (Max)1.63mm

Product FAQ

Targeted answers for buyers verifying the exact EP20K200BC356-1X ordering code, packaging, stock, datasheet, and replacement path.

What does EP20K200BC356-1X mean?

EP20K200BC356-1X is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Intel. The current package reference is BGA, with listed context including IC FPGA 277 I/O 356BGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

Is EP20K200BC356-1X the same as EP20K200BC356-1X?

EP20K200BC356-1X may share the same base part family as EP20K200BC356-1X, but the suffix can identify ordering, reel, tape, packing, or logistics details. Confirm the BGA package, manufacturer code from Intel, datasheet ordering table, and reel quantity before treating the two codes as interchangeable.

What package is EP20K200BC356-1X supplied in?

EP20K200BC356-1X is currently listed with package reference BGA from Intel. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is EP20K200BC356-1X currently available?

EP20K200BC356-1X is currently marked with stock availability on this page. Before ordering, confirm the package (BGA), listed stock (11120), available quantity (11120), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare EP20K200BC356-1X alternatives?

A mapped alternative list is not currently published for EP20K200BC356-1X. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.