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EP2C8F256C8N Embedded - FPGAs (Field Programmable Gate Array) by Intel

EP2C8F256C8N is a Embedded - FPGAs (Field Programmable Gate Array) from Intel in manufacturer-listed packaging. It is commonly reviewed for IC FPGA 182 I/O 256FBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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EP2C8F256C8N Embedded - FPGAs (Field Programmable Gate Array) by Intel | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

EP2C8F256C8N

Internal code

TCE000109689

Package

-

Manufacturer
Intel

Key specifications

Series

Cyclone® II

Min Quantity

1

Description

IC FPGA 182 I/O 256FBGA

key Attributes

-

Globally recognized certifications

4 certifications

Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.

  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

How to order EP2C8F256C8N

Confirm the core buying details for this exact ordering code before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO Release

Part confirmation

  • Exact MPN confirmed: EP2C8F256C8N
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical Details

Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.

Product Overview

IntroductionFollowing the immensely successful first-generation Cyclone® device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements (LEs) and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are manufactured on 300-mm wafers using TSMCs 90-nm low-k dielectric process to ensure rapid availability and low cost.
Features
The Cyclone II device family offers the following features:
• High-density architecture with 4,608 to 68,416 LEs ● M4K embedded memory blocks ● Up to 1.1 Mbits of RAM available without reducing available logic ● 4,096 memory bits per block (4,608 bits per block including 512 parity bits) ● Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36 ● True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes ● Byte enables for data input masking during writes ● Up to 260-MHz operation
• Embedded multipliers ● Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance ● Optional input and output registers
• Advanced I/O support ● High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL ● Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL ● Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces ● PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function ● 133-MHz PCI-X 1.0 specification compatibility ● High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use ● Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register ● Programmable bus-hold feature ● Programmable output drive strength feature ● Programmable delays from the pin to the IOE or logic array ● I/O bank grouping for unique VCCIO and/or VREF bank settings ● MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces ● Hot-socketing operation support ● Tri-state with weak pull-up on I/O pins before and during configuration ● Programmable open-drain outputs ● Series on-chip termination support(Continue ...)

Open The Official Datasheet

Review the latest datasheet for EP2C8F256C8N from Intel in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.

View EP2C8F256C8N Datasheet

Popular Specs Surfaced First

  • Export Classifications & Environmental

    RoHS Status

    RoHS non-compliant

  • Export Classifications & Environmental

    HTSUS

    8542.39.0001

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Export Classifications & Environmental

    JESD-609 Code

    e1

  • Export Classifications & Environmental

    ECCN Code

    EAR99

  • Package Parameter

    Height Seated (Max)

    1.55mm

EP2C8F256C8N Export Classifications & Environmental
ParameterValue
RoHS StatusRoHS non-compliant
REACH SVHCUnknown
HTSUS8542.39.0001
Moisture Sensitivity Level (MSL)3 (168 Hours)
JESD-609 Codee1
ECCN CodeEAR99
EP2C8F256C8N Package Parameter
ParameterValue
Height Seated (Max)1.55mm
EP2C8F256C8N Product Attribute
ParameterValue
Part StatusActive
REACH StatusREACH Unaffected
Lead FreeLead Free
Published2007
Factory Lead Time8 Weeks
TerminationSMD/SMT
Max Operating Temperature85°C
CategoriesIntegrated Circuits (ICs)
Peak Reflow Temperature (Cel)260
TechnologyCMOS
Supply Voltage1.2V
Terminal FormBALL
Radiation HardeningNo
Reflow Temperature-Max (S)40
MountSurface Mount
Pbfree Codeyes
Terminal PositionBOTTOM
Length17mm
Min Operating Temperature0°C
Width17mm
Terminal Pitch1mm
Operating Supply Voltage1.2V
Number Of Pins256
Number Of Terminations256
Package / CaseFBGA
Pin Count256
Min Supply Voltage1.15V
Sub-CategoriesEmbedded - FPGAs (Field Programmable Gate Array)
SubcategoryField Programmable Gate Arrays
Temperature GradeOTHER
ManufacturerIntel
ECCN3A991D
Max Supply Voltage1.25V
SeriesCyclone® II
Manufacturer'S Part No.EP2C8F256C8N
Additional FeatureALSO REQUIRES 3.3 SUPPLY
Number Of I/O182
Number Of Outputs174
Frequency155.5MHz
EP2C8F256C8N Product Parameter
ParameterValue
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Power Supplies1.21.5/3.33.3V
RAM Size20.3kB
Number Of Logic Blocks (LABs)516
Number Of Logic Elements/Cells8256
Number Of CLBs516
Memory Size20.3kB
Speed Grade8
Frequency (Max)260MHz

Product FAQ

Targeted answers for buyers verifying the exact EP2C8F256C8N ordering code, packaging, stock, datasheet, and replacement path.

What does EP2C8F256C8N mean?

EP2C8F256C8N is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Intel. The current package reference is -, with listed context including IC FPGA 182 I/O 256FBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the EP2C8F256C8N ordering code?

Treat EP2C8F256C8N as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Intel, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is EP2C8F256C8N supplied in?

EP2C8F256C8N is currently listed with package reference - from Intel. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is EP2C8F256C8N currently available?

EP2C8F256C8N is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (25233), available quantity (15118), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare EP2C8F256C8N alternatives?

A mapped alternative list is not currently published for EP2C8F256C8N. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.