
IRG4BC30KPBF Transistors - IGBTs - Single by Infineon Technologies
IRG4BC30KPBF is a Transistors - IGBTs - Single from Infineon Technologies in TO-220-3 packaging. It is commonly reviewed for IGBT 600V 28A 100W TO220AB. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
IRG4BC30KPBF
- Internal code
TCE000107983
- Package
TO-220-3
- Manufacturer
- Infineon Technologies
Key specifications
- Series
-
- Min Quantity
1
- Category
- Discrete Semiconductor Products
- Sub Category
- Transistors - IGBTs - Single
- Description
IGBT 600V 28A 100W TO220AB
- key Attributes
-
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ISO 14001
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RFQ checklist
Order process
Confirm the core buying details for IRG4BC30KPBF before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: IRG4BC30KPBF
- Package to verify: TO-220-3
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped IRG4BC30KPBF parameters from Infineon Technologies, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Mounting Type
Through Hole
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Packaging
Tube
Product Attribute
Factory Lead Time
16 Weeks
| Parameter | Value |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Through Hole |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | EAR99 |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tube |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 16 Weeks |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2000 |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Infineon Technologies |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Discrete Semiconductor Products |
Transistor Element Material Specifies the semiconductor material used in the transistor's active region. This affects electrical characteristics such as switching speed and voltage rating. Verify the material against the datasheet when selecting for high-frequency or high-power applications. | SILICON |
Current Rating Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations. | 28A |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -55°C~150°C TJ |
JEDEC-95 Code Standardized package code from JEDEC-95 for semiconductor devices. This code identifies the physical package outline, pin configuration, and mounting style. Buyers and engineers use it to ensure mechanical compatibility with PCB footprints and assembly processes. Verify the exact code against the datasheet to avoid mismatches in design. | TO-220AB |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | TO-220-3 |
Max Power Dissipation Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions. | 100W |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 10.5156mm |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Through Hole |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 3 |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | SINGLE |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 3 |
Voltage - Rated DC Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability. | 600V |
Element Configuration Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality. | Dual |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 15.24mm |
Power Dissipation Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions. | 100W |
Gate-Emitter Thr Voltage-Max Maximum gate-emitter voltage at which the device begins to conduct. Important for determining drive voltage requirements and ensuring reliable turn-on. Compare with your gate driver output to avoid insufficient drive or accidental turn-on. | 6V |
Turn Off Time-Nom (Toff) Nominal time required for the device to turn off after the control signal is removed. Affects switching losses and dead-time requirements in bridge circuits. Verify against datasheet for load and temperature conditions. | 380 ns |
Case Connection Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling. | COLLECTOR |
Gate-Emitter Voltage-Max Maximum allowable voltage between gate and emitter terminals. Exceeding this rating can damage the device. Ensure your gate driver output stays within this limit, including overshoot and ringing. Check datasheet for absolute maximum ratings. | 20V |
Transistor Application Specifies the intended circuit role, such as switching, amplification, or RF. Engineers compare this to ensure the transistor's characteristics match the design's requirements. Verify against the datasheet's application section before selecting. | MOTOR CONTROL |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Insulated Gate BIP Transistors |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Transistors - IGBTs - Single |
Polarity/Channel Type Indicates whether the semiconductor is N-channel, P-channel, NPN, PNP, or other polarity type. This determines the required gate or base drive voltage and circuit configuration. Verify against the datasheet to ensure compatibility with your application's power supply and control logic. | N-CHANNEL |
Collector Emitter Breakdown Voltage Specifies the maximum voltage that can be applied between collector and emitter without causing breakdown. Critical for power transistors and switching circuits. Verify against datasheet to ensure safe operating margin under worst-case conditions. | 600V |
Additional Feature Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts. | LOW CONDUCTION LOSS |
Collector Emitter Saturation Voltage Voltage drop across collector-emitter when the device is fully on. Determines conduction losses and efficiency. Lower saturation voltage means less power dissipation. Verify against datasheet for collector current and temperature. | 2.7V |
Gate Charge Total charge required to drive the gate to a specified voltage. Determines gate drive power and switching speed. Lower gate charge enables faster switching and higher efficiency. Check datasheet for test conditions and gate voltage. | 67nC |
Collector Emitter Voltage (VCEO) Maximum allowable voltage between collector and emitter with the base terminal open. Exceeding this rating can cause breakdown or permanent damage. Verify against the datasheet for safe operating conditions in your circuit design. | 2.7V |
Vce(On) (Max) @ Vge, Ic Maximum collector-emitter saturation voltage when the IGBT is fully on, specified at a given gate-emitter voltage and collector current. Compare this value to assess conduction losses and thermal performance. Verify against the datasheet for your operating conditions. | 2.7V @ 15V, 16A |
Test Condition Specifies the environmental and electrical conditions under which the component's parameters are measured. Essential for comparing datasheet values across different manufacturers. Always check that test conditions match your application's operating environment. | 480V, 16A, 23 Ω, 15V |
Max Collector Current Maximum continuous collector current that the transistor can handle without damage. Compare this rating with your circuit's peak current demand. Always verify against the datasheet for thermal limits and derating conditions. | 28A |
Fall Time-Max (Tf) Maximum time required for the output signal to transition from high to low level. Critical for high-speed switching circuits to ensure signal integrity and minimize timing errors. Verify against datasheet for load conditions and temperature. | 170ns |
Turn On Time Time required for the device to transition from off state to fully on state. This parameter is critical for timing analysis in power supplies, drivers, and switching circuits. Verify this value against your system's timing budget and switching frequency requirements. | 54 ns |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | IRG4BC30KPBF |
Td (On/Off) @ 25°C Delay time from the input signal edge to the beginning of output transition, measured at 25°C. Critical for timing analysis in switching circuits. Verify against datasheet for load conditions and supply voltage. | 26ns/130ns |
Switching Energy Energy dissipated during each switching transition (turn-on and turn-off). Directly impacts efficiency and thermal management in power converters. Lower switching energy reduces losses and heat. Verify against datasheet for test conditions and load. | 360μJ (on), 510μJ (off) |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 14.6812mm |
| Parameter | Value |
|---|---|
Number Of Elements Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements. | 1 |
Input Type Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance. | Standard |
Rise Time Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance. | 28ns |
Current - Collector Pulsed (Icm) Maximum allowable collector current during short pulses, typically higher than continuous rating. Important for applications with transient loads or inrush currents. Check pulse duration and duty cycle in the datasheet to avoid exceeding safe operating area. | 58A |
| Parameter | Value |
|---|---|
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 1 (Unlimited) |
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | RoHS Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8541.29.0095 |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for IRG4BC30KPBF. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact IRG4BC30KPBF ordering code, packaging, stock, datasheet, and replacement path.
What does IRG4BC30KPBF mean?
IRG4BC30KPBF is the exact ordering code listed for a Transistors - IGBTs - Single component from Infineon Technologies. The current package reference is TO-220-3, with listed context including IGBT 600V 28A 100W TO220AB. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the IRG4BC30KPBF ordering code?
Treat IRG4BC30KPBF as the full ordering code during RFQ and engineering review. Confirm the listed TO-220-3 package, manufacturer documentation from Infineon Technologies, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is IRG4BC30KPBF supplied in?
IRG4BC30KPBF is currently listed with package reference TO-220-3 from Infineon Technologies. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is IRG4BC30KPBF currently available?
IRG4BC30KPBF is currently marked with stock availability on this page. Before ordering, confirm the package (TO-220-3), listed stock (33691), available quantity (11974), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare IRG4BC30KPBF alternatives?
A mapped alternative list is not currently published for IRG4BC30KPBF. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





