TrustCompo Website Logo | TrustCompo

FGA25N120ANTDTU Transistors - IGBTs - Single by ON Semiconductor

FGA25N120ANTDTU is a Transistors - IGBTs - Single from ON Semiconductor in SC-65-3 packaging. It is commonly reviewed for IGBT 1200V 50A 312W TO3P. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

Pictures are for reference only. Please contact us for the latest pictures.

FGA25N120ANTDTU Transistors - IGBTs - Single by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
  • 365-Day GuaranteeAfter-sales support helps buyers handle quality questions with a clearer return and review window.
  • Ships within 24-48 HoursAvailable items can move quickly once the quote, quantity, and delivery details are confirmed.
  • 100% Anti-Counterfeit TestedParts are checked through authenticity-focused handling and inspection before shipment.

Key specifications

Part Number

FGA25N120ANTDTU

Internal code

TCE000107198

Package

SC-65-3

Manufacturer
ON Semiconductor

Key specifications

Series

-

Min Quantity

1

Description

IGBT 1200V 50A 312W TO3P

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for FGA25N120ANTDTU before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: FGA25N120ANTDTU
  • Package to verify: SC-65-3

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped FGA25N120ANTDTU parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Mounting Type

    Through Hole

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Packaging

    Tube

FGA25N120ANTDTU Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Through Hole
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2004
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

6 Weeks
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

15.8mm
Max Junction Temperature (Tj)

Specifies the highest temperature the semiconductor junction can sustain without damage or degradation. Compare this limit with your operating conditions and thermal management to ensure reliable performance. Verify against the datasheet for derating curves and long-term reliability.

150°C
Element Configuration

Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.

Single
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Discrete Semiconductor Products
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-55°C~150°C TJ
Current Rating

Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations.

50A
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Through Hole
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

3
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

23.8mm
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

5mm
Gate-Emitter Voltage-Max

Maximum allowable voltage between gate and emitter terminals. Exceeding this rating can damage the device. Ensure your gate driver output stays within this limit, including overshoot and ringing. Check datasheet for absolute maximum ratings.

20V
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Insulated Gate BIP Transistors
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Transistors - IGBTs - Single
Polarity/Channel Type

Indicates whether the semiconductor is N-channel, P-channel, NPN, PNP, or other polarity type. This determines the required gate or base drive voltage and circuit configuration. Verify against the datasheet to ensure compatibility with your application's power supply and control logic.

N-CHANNEL
Voltage - Rated DC

Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability.

1.2kV
HTS Code

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

8541.29.00.95
Collector Emitter Breakdown Voltage

Specifies the maximum voltage that can be applied between collector and emitter without causing breakdown. Critical for power transistors and switching circuits. Verify against datasheet to ensure safe operating margin under worst-case conditions.

1.2kV
Collector Emitter Voltage (VCEO)

Maximum allowable voltage between collector and emitter with the base terminal open. Exceeding this rating can cause breakdown or permanent damage. Verify against the datasheet for safe operating conditions in your circuit design.

1.2kV
Power Dissipation

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

312mW
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

TO-3P-3, SC-65-3
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

312W
Max Collector Current

Maximum continuous collector current that the transistor can handle without damage. Compare this rating with your circuit's peak current demand. Always verify against the datasheet for thermal limits and derating conditions.

50A
Gate Charge

Total charge required to drive the gate to a specified voltage. Determines gate drive power and switching speed. Lower gate charge enables faster switching and higher efficiency. Check datasheet for test conditions and gate voltage.

200nC
Gate-Emitter Thr Voltage-Max

Maximum gate-emitter voltage at which the device begins to conduct. Important for determining drive voltage requirements and ensuring reliable turn-on. Compare with your gate driver output to avoid insufficient drive or accidental turn-on.

7.5V
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

6.40101g
Continuous Collector Current

Specifies the maximum steady DC current the transistor's collector can carry without exceeding thermal limits. Compare this value with your circuit's peak current demand to ensure reliable operation. Always verify against the datasheet's safe operating area and derating curves for your operating temperature.

50A
Switching Energy

Energy dissipated during each switching transition (turn-on and turn-off). Directly impacts efficiency and thermal management in power converters. Lower switching energy reduces losses and heat. Verify against datasheet for test conditions and load.

4.1mJ (on), 960μJ (off)
Td (On/Off) @ 25°C

Delay time from the input signal edge to the beginning of output transition, measured at 25°C. Critical for timing analysis in switching circuits. Verify against datasheet for load conditions and supply voltage.

50ns/190ns
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

FGA25N120A
Test Condition

Specifies the environmental and electrical conditions under which the component's parameters are measured. Essential for comparing datasheet values across different manufacturers. Always check that test conditions match your application's operating environment.

600V, 25A, 10 Ω, 15V
Collector Emitter Saturation Voltage

Voltage drop across collector-emitter when the device is fully on. Determines conduction losses and efficiency. Lower saturation voltage means less power dissipation. Verify against datasheet for collector current and temperature.

2.65V
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

FGA25N120ANTDTU
Vce(On) (Max) @ Vge, Ic

Maximum collector-emitter saturation voltage when the IGBT is fully on, specified at a given gate-emitter voltage and collector current. Compare this value to assess conduction losses and thermal performance. Verify against the datasheet for your operating conditions.

2.65V @ 15V, 50A
FGA25N120ANTDTU Product Parameter
ParameterValue
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

50 ns
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Rise Time

Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.

60ns
Input Type

Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.

Standard
Voltage - Collector Emitter Breakdown (Max)

This is the maximum voltage that can be applied between the collector and emitter without causing avalanche breakdown. Check the datasheet for the test conditions, as this value varies with current and temperature. Critical for ensuring the transistor operates within safe limits in your circuit.

1200V
Turn-Off Delay Time

Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.

190 ns
Current - Collector Pulsed (Icm)

Maximum allowable collector current during short pulses, typically higher than continuous rating. Important for applications with transient loads or inrush currents. Check pulse duration and duty cycle in the datasheet to avoid exceeding safe operating area.

90A
IGBT Type

Specifies the internal structure or technology variant of the insulated-gate bipolar transistor, such as trench field-stop or planar. Affects switching losses, saturation voltage, and ruggedness. Confirm the type matches your application's voltage and frequency demands.

NPT and Trench
Reverse Recovery Time

Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions.

350 ns
FGA25N120ANTDTU Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8541.29.0095
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Not Applicable

Datasheet preview

Datasheet PDF viewer

Preview the FGA25N120ANTDTU datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.

ON Semiconductor

FGA25N120ANTDTU

Page 1 of 0
/ —
Search within the PDF viewer.Try
Loading PDF viewer...

Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for FGA25N120ANTDTU. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact FGA25N120ANTDTU ordering code, packaging, stock, datasheet, and replacement path.

What does FGA25N120ANTDTU mean?

FGA25N120ANTDTU is the exact ordering code listed for a Transistors - IGBTs - Single component from ON Semiconductor. The current package reference is SC-65-3, with listed context including IGBT 1200V 50A 312W TO3P. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the FGA25N120ANTDTU ordering code?

Treat FGA25N120ANTDTU as the full ordering code during RFQ and engineering review. Confirm the listed SC-65-3 package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is FGA25N120ANTDTU supplied in?

FGA25N120ANTDTU is currently listed with package reference SC-65-3 from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is FGA25N120ANTDTU currently available?

FGA25N120ANTDTU is currently marked with stock availability on this page. Before ordering, confirm the package (SC-65-3), listed stock (22160), available quantity (22160), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare FGA25N120ANTDTU alternatives?

A mapped alternative list is not currently published for FGA25N120ANTDTU. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.