
MPC507APG4 Interface - Analog Switches, Multiplexers, Demultiplexers by Texas Instruments
MPC507APG4 is a Interface - Analog Switches, Multiplexers, Demultiplexers from Texas Instruments in DIP packaging. It is commonly reviewed for IC MULTIPLEXER DUAL 1X8 28DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
MPC507APG4
- Internal code
TCE000106444
- Package
DIP
- Manufacturer
- Texas Instruments
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Description
IC MULTIPLEXER DUAL 1X8 28DIP
- key Attributes
-
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ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for MPC507APG4 before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: MPC507APG4
- Package to verify: DIP
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for MPC507APG4 from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
OVERVIEW Electrohydraulic braking (EHB) systems are designed to allow electronic control of vehicle braking while retaining a reduced hydraulic system.
The hydraulic system functions as a reserve in the event of a failure in the electronic control.
The EHB control unit receives inputs from sensors connected to the brake pedal. In normal operation, a backup valve is closed and the controller activates the brakes of the wheel through an electric motor driven hydraulic pump. When the controller goes into a fail-safe mode, the backup valve is opened, which allows the brakes to be controlled through a conventional hydraulic circuit.KEY BENEFITS
• Reuses hydraulic system technology while incrementally building on the development of advanced electronic systems, such as electronic stability programs (ESP), traction control, and brake assist
• Uses software updates to simplify the calibration process by adjusting brake response and pedal feel
• Improves connectivity with other emerging systems, such as adaptive cruise control
• Removes the large vacuum servo to allow flexible installation
•
Features an anti-lock braking system (ABS) without feedback from the pedal
Technical parameters
Parameters
Compare grouped MPC507APG4 parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Mounting Type
Through Hole
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Packaging
Tube
Product Attribute
Part Status
Obsolete
| Parameter | Value |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Through Hole |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | EAR99 |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tube |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 37.4mm |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C TA |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Interface - Analog Switches, Multiplexers, Demultiplexers |
Max Power Dissipation Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions. | 2W |
Nominal Supply Current Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions. | 700μA |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 28-DIP (0.600, 15.24mm) |
Number Of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 28 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 28 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 28 |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 15V |
Number Of Circuits Specifies the total number of independent electrical paths or circuits within the component. This is critical for connectors, switches, and relay arrays to match the required wiring scheme. Always verify against the datasheet to ensure the circuit count meets your application's needs. | 2 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Through Hole |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 22V |
Power Dissipation Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions. | 2W |
Voltage - Supply, Dual (V±) Specifies the range of dual supply voltages required for proper operation. Check this against your power rails to ensure the device receives both positive and negative voltages within its rated limits. | ±5V~22V |
Operating Supply Current The amount of current the device draws from its power supply during normal operation. This is essential for power budget calculations, thermal management, and selecting appropriate power sources. Check datasheet for typical and maximum values under specified conditions. | 700μA |
Switch-Off Time-Max Maximum time required for the device to transition from on-state to off-state after removal of the drive signal. Critical for switching power supplies and motor drives. Verify against datasheet timing diagrams to ensure it meets your circuit's dead-time and frequency requirements. | 500ns |
Resistance Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation. | 1.5kOhm |
Switch-On Time-Max Specifies the longest interval from applying the control signal until the device conducts or switches on. Compare this value with your timing requirements, especially in power supplies or switching circuits. Verify against the datasheet under specified test conditions, as it affects efficiency and transient response. | 500ns |
Switch Time (Ton, Toff) (Max) Maximum turn-on and turn-off time for the switching device. Compare this parameter when evaluating switching speed for power supplies or converters. Verify against the datasheet under specified test conditions to ensure it meets your application's timing requirements. | 200ns, 250ns (Typ) |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | MPC507 |
Weight Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity. | 4.113913g |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | MPC507APG4 |
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 2 (1 Year) |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.39.0001 |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
| Parameter | Value |
|---|---|
Switching Describes the type or method of switching used by the component, such as latching, momentary, or break-before-make. This attribute defines how the switch or relay operates in the circuit. Check the datasheet to understand the switching mechanism and its suitability for your application. | BREAK-BEFORE-MAKE |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Nickel/Palladium/Gold (Ni/Pd/Au) |
Mux/Demux Circuit Configuration Defines the switch topology, such as 2:1, 4:1, or 8:1, indicating how many inputs are routed to outputs. Essential for selecting the correct multiplexer for signal routing in your design. Check the datasheet for channel count and switching characteristics. | 8:1 |
Logic Function Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior. | Multiplexer |
Max Dual Supply Voltage Specifies the highest voltage that can be applied between the positive and negative supply rails of a dual-supply device. Exceeding this limit may damage the component. Verify this parameter against the datasheet for proper power supply design and reliability. | 22V |
Channel Capacitance (CS(Off), CD(Off)) Capacitance between source and drain terminals when the switch is off. This parasitic capacitance affects high-frequency performance, switching speed, and signal integrity. Lower values are preferred for RF and high-speed digital applications. Verify against datasheet for voltage and frequency conditions. | 5pF 25pF |
Off-State Isolation (Nominal) Specifies the nominal resistance between isolated circuits when the component is off. Higher values indicate better isolation and lower leakage. Verify this parameter against the datasheet for applications requiring high voltage or safety isolation. | 68 dB |
Min Dual Supply Voltage Indicates the lowest dual supply voltage (positive and negative rails) at which the component operates correctly. This is critical for op-amps, ADCs, and other analog devices. Ensure your power rails meet this minimum to avoid malfunction or degraded performance. | 5V |
Negative Supply Voltage (Nominal) Specifies the nominal negative supply voltage required for proper operation of the component. Compare this value with your power design to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and tolerances. | -15V |
Number Of Inputs Defines how many input channels the component supports, such as a multiplexer, logic gate, or amplifier. This determines the maximum number of signals that can be routed or processed. Ensure the input count matches your system's channel requirements and pin configuration. | 16 |
Supply Type Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections. | Dual |
Number Of Channels Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections. | 8 |
Turn-Off Delay Time Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation. | 250 ns |
On-State Resistance (Max) Maximum resistance between the switch terminals when the device is fully on. Lower values reduce power loss and heat. Compare this parameter when selecting MOSFETs, IGBTs, or relays for high-current circuits. Always verify against the datasheet for your operating conditions. | 1.5kOhm |
Current - Leakage (IS(Off)) (Max) Maximum leakage current flowing through the switch when it is in the off state. This parameter affects power consumption and signal integrity in high-impedance circuits. Compare values to ensure the device meets your system's standby or off-state requirements, and verify against the datasheet for operating conditions. | 500pA Typ |
Turn On Delay Time Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions. | 200 ns |
| Parameter | Value |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 6.35mm |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for MPC507APG4. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact MPC507APG4 ordering code, packaging, stock, datasheet, and replacement path.
What does MPC507APG4 mean?
MPC507APG4 is the exact ordering code listed for a Interface - Analog Switches, Multiplexers, Demultiplexers component from Texas Instruments. The current package reference is DIP, with listed context including IC MULTIPLEXER DUAL 1X8 28DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the MPC507APG4 ordering code?
Treat MPC507APG4 as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is MPC507APG4 supplied in?
MPC507APG4 is currently listed with package reference DIP from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is MPC507APG4 currently available?
MPC507APG4 is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (11312), available quantity (10548), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare MPC507APG4 alternatives?
A mapped alternative list is not currently published for MPC507APG4. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





