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STM32F100RDT6B Embedded - Microcontrollers by STMicroelectronics

STM32F100RDT6B is a Embedded - Microcontrollers from STMicroelectronics in LQFP packaging. It is commonly reviewed for IC MCU 32BIT 384KB FLASH 64LQFP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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STM32F100RDT6B Embedded - Microcontrollers by STMicroelectronics | TrustCompo
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Key specifications

Part Number

STM32F100RDT6B

Internal code

TCE000098533

Package

LQFP

Key specifications

Series

STM32F1

Min Quantity

1

Description

IC MCU 32BIT 384KB FLASH 64LQFP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for STM32F100RDT6B before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: STM32F100RDT6B
  • Package to verify: LQFP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped STM32F100RDT6B parameters from STMicroelectronics, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Categories

    Integrated Circuits (ICs)

  • Product Attribute

    Package / Case

    64-LQFP

  • Product Attribute

    Sub-Categories

    Embedded - Microcontrollers

  • Product Attribute

    Manufacturer

    STMicroelectronics

  • Product Attribute

    Housing Material

    ROHS3 Compliant

  • Product Attribute

    Number Of Contacts

    No SVHC

STM32F100RDT6B Product Attribute
ParameterValue
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

64-LQFP
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - Microcontrollers
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

STMicroelectronics
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

ROHS3 Compliant
Number Of Contacts

Total number of electrical contacts in the connector, which determines the maximum number of circuits that can be connected. This is a critical parameter for matching the connector to your wire harness requirements. Ensure the contact count aligns with your signal and power needs.

No SVHC
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Number Of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

No
Driver Number Of Bits

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

Gold
Flat Flex Type

Specifies the construction style of a flat flexible cable, such as FFC or FPC. This affects flexibility, bend radius, and termination method. Verify the exact type against the datasheet to ensure compatibility with your connector and application requirements.

YES
Number Of ADC Channels

Specifies how many analog input signals the ADC can sample and convert to digital. Compare this when selecting microcontrollers or data acquisition ICs. Verify against the datasheet to ensure enough channels for your application.

16
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

-40°C~85°C TA
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

32b
Voltage - Rated

Specifies the maximum continuous voltage the component can safely withstand under normal operating conditions. Engineers compare this rating to the circuit's expected voltage to ensure reliable operation. Always verify against the datasheet for derating factors and environmental conditions.

ARM
Number Of Circuits

Specifies the total number of independent electrical paths or circuits within the component. This is critical for connectors, switches, and relay arrays to match the required wiring scheme. Always verify against the datasheet to ensure the circuit count meets your application's needs.

Yes
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Number Of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

51
Input Power-Max (CW)

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

8 Weeks
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

10mm
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

64
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

64
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

A/D 16x12b; D/A 2x12b
Voltage

Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes.

444mW
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

STM32F100
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

384kB
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

I2C, IrDA, LIN, SPI, UART, USART
Flammability Rating

UL flammability rating of the material used in the component, indicating its resistance to ignition and flame spread. This is important for safety compliance in end products. Check the rating against your application's required safety standards and environmental conditions.

DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

STM32F100RDT6B
STM32F100RDT6B Product Parameter
ParameterValue
Oscillator Type

Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.

Internal
Connectivity

Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet.

I2C, IrDA, LINbus, SPI, UART/USART
Core Size

Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application.

32-Bit
Voltage - Supply (Vcc/Vdd)

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

2V~3.6V
Core Processor

Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs.

ARM® Cortex®-M3
Program Memory Size

Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features.

384KB 384K x 8
Program Memory Type

Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet.

FLASH
Number Of I2C Channels

Specifies how many independent I2C bus interfaces the component provides. Compare this when selecting a device for multi-peripheral systems. Verify against the datasheet to ensure sufficient channels for your design.

2
Maximum Data Rate

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

0.5mm
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Active
Typical Quiescent Current (MA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

CMOS
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e4
Drain To Source Resistance

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

EAR99
Minimum Operating Supply Voltage

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

GULL WING
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

QUAD
Bit Size

Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.

32
Number Of PWM Channels

Indicates the number of pulse-width modulation output channels available. This is essential for motor control, dimming, or audio applications. Verify the resolution and frequency range of each channel in the datasheet to ensure they meet your control requirements.

6
Number Of SPI Channels

Defines the number of independent SPI interface channels available on the device. This is critical for connecting multiple peripherals or sensors. Check the datasheet to see if channels share resources or have dedicated pins, ensuring your design can accommodate all required SPI devices.

3
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tray
Number Of Timers/Counters

Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features.

11
Taper

Specifies the resistance change curve of a potentiometer, such as linear or logarithmic. This affects how the output varies with rotation. Verify the taper type against your circuit requirements and the datasheet to ensure proper volume or control response.

1.4mm
Typical Switching Frequency (KHz)

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Microcontrollers
Filter Type

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

64
Number Of Turns

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

10mm
Operating Supply Voltage (V)

Specifies the nominal or range of DC supply voltage for normal operation. Compare this with your system's power rail to ensure compatibility. Always check the absolute maximum ratings in the datasheet to avoid overvoltage damage.

24MHz
Connector Support Type

Indicates the mechanical mounting or support method for the connector, such as panel mount, board mount, or free-hanging. This affects installation, vibration resistance, and space requirements. Verify compatibility with your enclosure and PCB layout before ordering.

ACTIVE (Last Updated: 7 months ago)
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

STM32F1
Terminal Block Type

Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.

32K x 8
Number Of Logic Elements

Indicates the total count of logic elements or gates integrated in the device. This helps compare the complexity and capacity of FPGAs, CPLDs, or other programmable logic. Verify against the datasheet for exact architecture and resource distribution.

19.7mA

Datasheet preview

Datasheet PDF viewer

Preview the STM32F100RDT6B datasheet from STMicroelectronics to check package, electrical characteristics, application notes, and document evidence before RFQ.

STMicroelectronics

STM32F100RDT6B

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for STM32F100RDT6B. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact STM32F100RDT6B ordering code, packaging, stock, datasheet, and replacement path.

What does STM32F100RDT6B mean?

STM32F100RDT6B is the exact ordering code listed for a Embedded - Microcontrollers component from STMicroelectronics. The current package reference is LQFP, with listed context including IC MCU 32BIT 384KB FLASH 64LQFP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the STM32F100RDT6B ordering code?

Treat STM32F100RDT6B as the full ordering code during RFQ and engineering review. Confirm the listed LQFP package, manufacturer documentation from STMicroelectronics, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is STM32F100RDT6B supplied in?

STM32F100RDT6B is currently listed with package reference LQFP from STMicroelectronics. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is STM32F100RDT6B currently available?

STM32F100RDT6B is currently marked with stock availability on this page. Before ordering, confirm the package (LQFP), listed stock (15691), available quantity (15691), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare STM32F100RDT6B alternatives?

A mapped alternative list is not currently published for STM32F100RDT6B. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.