Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samplesAPTGT50X60T3G Transistors - IGBTs - Modules by Microsemi
APTGT50X60T3G is a Transistors - IGBTs - Modules model from Microsemi, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Discrete Semiconductor Products / Transistors - IGBTs - Modules product path. IGBT TRENCH 3PHASE BRIDGE SP3. TrustCompo combines the available model, brand, hierarchy, and specification details around APTGT50X60T3G so buyers can move faster from review to quotation.
RoHS
Datasheet
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
-
Min Quantity
1
Category
Discrete Semiconductor ProductsSub Category
Transistors - IGBTs - ModulesDescription
IGBT TRENCH 3PHASE BRIDGE SP3
key Attributes
-
Datasheet
View APTGT50X60T3G DatasheetTechnical document
Open The Official Datasheet
Review the latest datasheet for APTGT50X60T3G from Microsemi in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Product overview
Overview
IGBT TRENCH 3PHASE BRIDGE SP3
Fast scan
Popular Specs Surfaced First
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Export Classifications & Environmental
RoHS Status
RoHS Compliant
Export Classifications & Environmental
JESD-609 Code
e1
Export Classifications & Environmental
HTSUS
8541.29.0095
Export Classifications & Environmental
ECCN Code
EAR99
Export Classifications & Environmental
JESD-30 Code
R-XUFM-X25
Moisture Sensitivity Level (MSL)
1 (Unlimited)
RoHS Status
RoHS Compliant
JESD-609 Code
e1
HTSUS
8541.29.0095
ECCN Code
EAR99
JESD-30 Code
R-XUFM-X25
Turn-Off Delay Time
200 ns
Terminal Finish
TIN SILVER COPPER
Turn On Delay Time
110 ns
Number Of Elements
6
IGBT Type
Trench Field Stop
Configuration
Three Phase Inverter
Part Status
Active
REACH Status
REACH Unaffected
ECCN
EAR99
Lead Free
Lead Free
Published
2007
Factory Lead Time
36 Weeks
Height
11.5mm
Categories
Discrete Semiconductor Products
Transistor Element Material
SILICON
Mounting Type
Chassis Mount
Terminal Form
UNSPECIFIED
Terminal Position
UPPER
Radiation Hardening
No
Pbfree Code
yes
Number Of Terminations
25
Number Of Pins
32
Case Connection
ISOLATED
Gate-Emitter Voltage-Max
20V
Transistor Application
MOTOR CONTROL
Subcategory
Insulated Gate BIP Transistors
Polarity/Channel Type
N-CHANNEL
Collector Emitter Breakdown Voltage
600V
Collector Emitter Saturation Voltage
1.5V
Collector Emitter Voltage (VCEO)
600V
Manufacturer
Microsemi
Mount
Chassis Mount, Screw
Input Capacitance
3.15nF
Operating Temperature
-40°C~175°C TJ
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Max Collector Current
80A
Current - Collector Cutoff (Max)
250μA
Pin Count
25
VCEsat-Max
1.9 V
NTC Thermistor
Yes
Turn On Time
170 ns
Input
Standard
Sub-Categories
Transistors - IGBTs - Modules
Turn Off Time-Nom (Toff)
310 ns
Width
40.8mm
Length
73.4mm
Package / Case
SP3
Max Power Dissipation
176W
Vce(On) (Max) @ Vge, Ic
1.9V @ 15V, 50A
Power - Max
176W
Input Capacitance (Cies) @ Vce
3.15nF @ 25V
Manufacturer'S Part No.
APTGT50X60T3G
Common questions
Product FAQ
Quick answers for buyers reviewing APTGT50X60T3G, stock, documentation, and sourcing steps.
What is APTGT50X60T3G?
APTGT50X60T3G is a Transistors - IGBTs - Modules component from Microsemi. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for APTGT50X60T3G?
APTGT50X60T3G is listed with package reference -. The current product description is IGBT TRENCH 3PHASE BRIDGE SP3, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is APTGT50X60T3G available in stock?
This page currently shows 62002 units in stock and 24598 units available for APTGT50X60T3G. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for APTGT50X60T3G?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for APTGT50X60T3G by Microsemi. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for APTGT50X60T3G?
Yes. This page links to the datasheet for APTGT50X60T3G by Microsemi, so engineers and buyers can review package, ratings, and application details before purchase.
How should buyers verify APTGT50X60T3G before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for APTGT50X60T3G before approving the order.
Transistors - IGBTs - Modules
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around APTGT50X60T3G, Transistors - IGBTs - Modules, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC