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FDMF3035 PMIC - Full, Half-Bridge Drivers by ON Semiconductor

FDMF3035 is a PMIC - Full, Half-Bridge Drivers from ON Semiconductor in manufacturer-listed packaging. It is commonly reviewed for IC SPS HALF-BRIDGE DRVR 31PQFN. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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FDMF3035 PMIC - Full, Half-Bridge Drivers by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

FDMF3035

Internal code

TCE000091925

Package

-

Manufacturer
ON Semiconductor

Key specifications

Series

PowerTrench®, SyncFET™

Min Quantity

1

Description

IC SPS HALF-BRIDGE DRVR 31PQFN

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for FDMF3035 before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: FDMF3035
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for FDMF3035 from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.


The FDMF8704 is a fully optimized integrated Driver plus MOSFET power stage solution for high current synchronous buck DC-DC applications.
The device integrates a driver IC and two Power MOSFETs into a space saving, MLP 8x8, 56-pin package.
Features
• 7V to 20V Input Voltage Range
• Output current to 32A
• 1MHz switching frequency capable
• Internal adaptive gate drive
• Low Side FET with Integrated Schottky Diode
• Peak Efficiency >90%
• Output disable for lost phase shutdown
• Low profile SMD package
• RoHS CompliantBenefits
• Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components.
• Space savings of up to 50% PCB versus discrete solutions.
• Higher frequency of operation.
• Simpler system design and board layout. Reduced time in component selection and optimization.Applications
• Desktop and server VR11.x V-core and non V-core buck converters.
• CPU/GPU power train in game consoles and high end desktop systems.
• High-current DC-DC Point of Load (POL) converters.
• Networking and telecom microprocessor voltage regulators.
• Small form factor voltage regulator modules.

Technical parameters

Parameters

Compare grouped FDMF3035 parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Export Classifications & Environmental

    JESD-609 Code

    e3

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Export Classifications & Environmental

    RoHS Status

    ROHS3 Compliant

  • Export Classifications & Environmental

    HTSUS

    8542.39.0001

  • Export Classifications & Environmental

    ECCN Code

    EAR99

  • Export Classifications & Environmental

    JESD-30 Code

    S-PXSS-N33

FDMF3035 Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
JESD-30 Code

JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.

S-PXSS-N33
FDMF3035 Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 1 day ago)
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

16 Weeks
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
REACH Compliance Code

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

not_compliant
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.5mm
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2016
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

NO LEAD
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
HTS Code

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

8542.39.00.01
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~150°C TJ
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

5mm
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

NOT SPECIFIED
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

5mm
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - Full, Half-Bridge Drivers
Load Type

Specifies the kind of load the component is designed to drive, such as resistive, inductive, or capacitive. This affects switching performance and protection requirements. Verify compatibility with your application's load characteristics to ensure reliable operation and avoid overstress.

Inductive
Applications

Specify the typical end-use scenarios for this electronic component, such as consumer electronics, automotive, industrial, or telecommunications. This helps engineers quickly assess suitability for their design. Verify against the datasheet's application section.

Synchronous Buck Converters
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

PWM
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

UNSPECIFIED
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

PowerTrench®, SyncFET™
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

50A
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

33
Output Current Per Channel

Specifies the maximum current each output channel can source or sink continuously. Compare this value with your load requirements to ensure the driver or amplifier can handle the current without overheating or damage. Always verify against the datasheet for absolute maximum ratings and derating curves.

50A
Feature

This attribute highlights special characteristics or functions of the component, such as built-in protection, mounting style, or unique performance traits. Engineers compare these features to match specific application requirements. Always verify against the datasheet for complete specifications.

Bootstrap Circuit, Diode Emulation
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

ASLO REQUIRE PFM CONTROL TECHNIQUE
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

31
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

121.33333mg
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

31-PowerWFQFN
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

FDMF3035
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

UMOS
FDMF3035 Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Control Mode

Defines the control method used by a power management IC, such as voltage mode, current mode, or hysteretic. This affects transient response, stability, and external component selection. Ensure the mode matches your application's performance needs.

CURRENT-MODE
Control Technique

Specifies the switching regulator control method, such as PWM, PFM, or burst mode. This affects efficiency, noise, and transient response. Engineers should verify the technique against the datasheet to ensure it matches the application's power requirements and EMI constraints.

PULSE WIDTH MODULATION
Analog IC - Other Type

Select this category when the analog integrated circuit does not fit standard classifications like op-amps, comparators, or regulators. Verify the exact function and pinout in the datasheet to ensure compatibility with your circuit design and performance requirements.

SWITCHING REGULATOR
Nominal Input Voltage

Specifies the typical input voltage level for which the component is designed to operate. Compare this value with your power supply output to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and operating conditions.

5V
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

4.5V~5.5V
Rds On (Typ)

Typical drain-source on-resistance for MOSFETs. Lower values reduce conduction losses and heat. Compare this parameter when selecting power switches. Verify with datasheet under specified gate voltage and temperature.

1 Ω LS, 1 Ω HS
Output Configuration

Specifies the topology of the output stage, such as push-pull, open collector, or half-bridge. This determines how the device drives loads and interfaces with external circuitry. Verify against the datasheet to ensure compatibility with your application's requirements.

Half Bridge
Input Voltage (Min)

Specifies the lowest input voltage at which the component operates reliably. Check this against your power supply design to ensure the device starts and functions within its specified range. Critical for DC-DC converters, regulators, and modules.

4.5V
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Shoot-Through, UVLO
Maximum Switching Frequency

Specifies the highest rate at which the device can switch on and off reliably. Compare this value with your application's required switching speed to ensure efficient operation and avoid overheating. Always verify against the datasheet for derating conditions.

1500kHz
Input Voltage (Max)

Specifies the highest DC or AC voltage that can be safely applied to the input pins without causing damage or malfunction. Verify this limit against your power supply design and derating requirements to ensure reliable operation over the full temperature range.

5.5V
Voltage - Load

Specifies the voltage supplied to the load under normal operating conditions. Compare this value with your system's power supply and load requirements to ensure compatibility. Verify against the datasheet for exact tolerances and operating ranges.

4.5V~24V
FDMF3035 Package Parameter
ParameterValue
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

0.8mm

Datasheet preview

Datasheet PDF viewer

Preview the FDMF3035 datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.

ON Semiconductor

FDMF3035

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for FDMF3035. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact FDMF3035 ordering code, packaging, stock, datasheet, and replacement path.

What does FDMF3035 mean?

FDMF3035 is the exact ordering code listed for a PMIC - Full, Half-Bridge Drivers component from ON Semiconductor. The current package reference is -, with listed context including IC SPS HALF-BRIDGE DRVR 31PQFN. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the FDMF3035 ordering code?

Treat FDMF3035 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is FDMF3035 supplied in?

FDMF3035 is currently listed with package reference - from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is FDMF3035 currently available?

FDMF3035 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (94251), available quantity (94251), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare FDMF3035 alternatives?

A mapped alternative list is not currently published for FDMF3035. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.