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Alternative part analysis

MX25L25635FMI-10G replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MX25L25635FMI-10G, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
Part NumberMX25L25635FMI-10G
ManufacturerMacronix
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
PackageSOIC
SeriesMX25xxx35/36 - MXSMIO™
Key Attributes-
DescriptionIC FLASH 256M SPI 104MHZ 16SOP
Lifecycle-
Stock187,420
Available13,566
Min Order1
DatasheetAvailable
REACH StatusREACH Unaffected
Lead FreeLead Free
PackagingTube
Mounting TypeSurface Mount
Factory Lead Time16 Weeks
Published2009
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
InterfaceSPI, Serial
Qualification StatusNot Qualified
Operating Temperature-40°C~85°C TA
Supply Voltage3V
Length10.3mm
Part StatusNot For New Designs
Package / Case16-SOIC (0.295, 7.50mm Width)
Number of Functions1
Surface MountYES
Reflow Temperature-Max (s)40
Number of Terminations16
Number of Pins16
Terminal Pitch1.27mm
Reach Compliance Codeunknown
Operating Supply Voltage3.6V
Memory TypeNon-Volatile
ECCN3A991B1A
Sub-CategoriesMemory
Memory FormatFLASH
Standby Current-Max0.00002A
Width7.52mm
Endurance100000 Write/Erase Cycles
Write ProtectionHARDWARE/SOFTWARE
Memory InterfaceSPI
TechnologyFLASH - NOR
ManufacturerMacronix
Memory Width4
Additional FeatureIT ALSO CONFIGURED AS 256M X 1
Operating ModeSYNCHRONOUS
SeriesMX25xxx35/36 - MXSMIO™
Organization64MX4
Write Cycle Time - Word, Page30μs, 3ms
Clock Frequency104MHz
Manufacturer's Part No.MX25L25635FMI-10G
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.32.0071
Height Seated (Max)2.65mm
Power Supplies3/3.3V
Terminal FinishTin (Sn)
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Serial Bus TypeSPI
Programming Voltage3V
Supply Current-Max0.02mA
Memory Size256Mb 32M x 8
Density256 Mb
Alternate Memory Width2
Data Retention Time-Min10
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MX25L25635FMI-10G replacement and equivalent-part options.

What is a cross-reference page for MX25L25635FMI-10G?

This page groups mapped replacement options for MX25L25635FMI-10G so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MX25L25635FMI-10G?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MX25L25635FMI-10G alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MX25L25635FMI-10G?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MX25L25635FMI-10G obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to MX25L25635FMI-10G from Macronix is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.