BCM857DS,115 Transistors - Bipolar (BJT) - Arrays by Nexperia

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Specifies the highest temperature the semiconductor junction can sustain without damage or degradation. Compare this limit with your operating conditions and thermal management to ensure reliable performance. Verify against the datasheet for derating curves and long-term reliability.

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.

Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

Specifies the nominal reverse breakdown voltage at which the Zener diode begins conducting in the breakdown region. Compare this value with the required regulation voltage for your circuit. Always verify the exact voltage and tolerance in the datasheet, as it affects voltage reference and clamping applications.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.

Indicates the frequency at which the open-loop gain of an amplifier drops to unity. Compare this value when selecting op-amps or RF amplifiers for bandwidth-critical applications. Verify against the datasheet's typical performance curves to ensure adequate gain at your operating frequency.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Maximum voltage that can be applied between emitter and base with the collector open. Critical for BJT input stage design. Verify against datasheet to prevent reverse breakdown and ensure reliable operation.

Minimum DC current gain measured at a specified collector current and collector-emitter voltage. This parameter indicates the transistor's amplification capability. Compare it with your circuit requirements and verify the test conditions in the datasheet.

Minimum DC current gain (hFE) of a bipolar transistor at a specified collector current and voltage. This value indicates the lowest amplification the device guarantees. Engineers compare it to ensure sufficient drive for the load. Always verify against the datasheet for your operating conditions.

Maximum collector current when the transistor is in cutoff. Indicates leakage and off-state performance. Important for low-power and high-impedance circuits. Check datasheet to ensure it meets your application's leakage requirements.

Maximum continuous collector current that the transistor can handle without damage. Compare this rating with your circuit's peak current demand. Always verify against the datasheet for thermal limits and derating conditions.

Specifies the maximum continuous collector current the transistor can handle without damage. Compare with your circuit's peak current requirements. Verify against the datasheet's absolute maximum ratings and derating curves for safe operation.

Maximum voltage that can be applied between collector and base with the emitter left open. This breakdown rating is critical for circuit design. Always verify it against the datasheet to prevent damage from overvoltage conditions.

Allowable deviation from the nominal frequency for oscillators, crystals, and timing devices. This tolerance ensures accurate timing in communication and control systems. Compare this parameter to meet your system's precision requirements, and consider temperature stability and aging effects as specified in the datasheet.

Allowed deviation from the nominal value, expressed as a percentage. Determines precision of resistors, capacitors, and inductors. Choose tighter tolerance for precision circuits, but verify actual performance in the datasheet.

This is the maximum collector-emitter voltage drop when the transistor is fully on at the given base and collector currents. Lower values mean less power loss. Check the datasheet to confirm it meets your circuit's switching and efficiency requirements.

Maximum allowable voltage between collector and emitter with the base terminal open. Exceeding this rating can cause breakdown or permanent damage. Verify against the datasheet for safe operating conditions in your circuit design.

Specifies the maximum voltage that can be applied between collector and emitter without causing breakdown. Critical for power transistors and switching circuits. Verify against datasheet to ensure safe operating margin under worst-case conditions.

Voltage drop across collector-emitter when the device is fully on. Determines conduction losses and efficiency. Lower saturation voltage means less power dissipation. Verify against datasheet for collector current and temperature.

Defines the upper limit of ambient temperature for reliable operation without thermal damage or performance degradation. Ensure your system's cooling keeps the component below this threshold. Check the datasheet for derating curves and thermal resistance values.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

Specifies the capacitive load the component is designed to drive, affecting signal integrity and timing. Compare this value with your circuit's trace and input capacitance to ensure stable operation. Verify against the datasheet for optimal performance.

Maximum power the component can safely dissipate under specified conditions. Compare across parts to ensure thermal limits are not exceeded in your application. Always verify against the datasheet's derating curve and ambient temperature ratings.

Indicates the physical package type as designated by the component manufacturer, such as SOIC, QFN, or BGA. This affects PCB footprint, thermal performance, and assembly processes. Confirm compatibility with your board layout and soldering requirements before design finalization.

Equivalent series resistance indicates internal losses in capacitors and inductors. Lower ESR improves efficiency and reduces heat in power circuits. Compare ESR values when selecting components for high-frequency or high-current applications, and verify against the datasheet for your operating conditions.

Specifies the transition frequency (fT) of a transistor, where current gain drops to unity. This parameter indicates high-frequency performance and is critical for RF amplifiers, oscillators, and high-speed switching circuits. Compare fT values to ensure adequate bandwidth for your application.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

Specifies the current level applied during parameter measurement. Compare this value when evaluating test conditions across similar components. Always verify that the test current matches your application's operating point to ensure datasheet parameters are relevant.

Maximum voltage the component can withstand before breakdown occurs. Essential for ensuring safe operation in high-voltage circuits. Verify this rating against your circuit's worst-case voltage spikes to prevent failure and ensure long-term reliability.

Specifies the semiconductor technology used in the transistor, such as BJT, MOSFET, or IGBT. This determines the device's switching characteristics, drive requirements, and application suitability. Verify the exact type against the datasheet to ensure compatibility with your circuit design.

This is the maximum voltage that can be applied between the collector and emitter without causing avalanche breakdown. Check the datasheet for the test conditions, as this value varies with current and temperature. Critical for ensuring the transistor operates within safe limits in your circuit.