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NCP1012ST130T3G PMIC - AC DC Converters, Offline Switchers by ON Semiconductor

NCP1012ST130T3G is a PMIC - AC DC Converters, Offline Switchers from ON Semiconductor in SOT223 packaging. It is commonly reviewed for IC OFFLINE SWIT SMPS CM SOT223. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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NCP1012ST130T3G PMIC - AC DC Converters, Offline Switchers by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

NCP1012ST130T3G

Internal code

TCE000079629

Package

SOT223

Manufacturer
ON Semiconductor

Key specifications

Series

-

Min Quantity

1

Description

IC OFFLINE SWIT SMPS CM SOT223

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for NCP1012ST130T3G before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: NCP1012ST130T3G
  • Package to verify: SOT223

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for NCP1012ST130T3G from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.


The NCP101X series integrates a fixed--frequency current--mode controller and a 700 V MOSFET. Housed in a PDIP--7, PDIP--7 Gull Wing, or SOT--223 package, the NCP101X offers everything needed to build a rugged and low--cost power supply, including soft--start, frequency jittering, short--circuit protection, skip--cycle, a maximum peak current setpoint and a Dynamic Self--Supply (no need for an auxiliary winding).Unlike other monolithic solutions, the NCP101X is quiet by nature: during nominal load operation, the part switches at one of the available frequencies (65 -- 100 -- 130 kHz). When the current setpoint falls below a given value, e.g. the output power demand diminishes, the IC automatically enters the so--called skip--cycle mode and provides excellent efficiency at light loads. Because this occurs at typically 1/4 of the maximum peak value, no acoustic noise takes place. As a result, standby power is reduced to the minimum without acoustic noise generation.
Features
• Built--in 700 V MOSFET with Typical RDSon of 11 Ω and 22 Ω
• Large Creepage Distance Between High--Voltage Pins
• Current--Mode Fixed Frequency Operation: 65 kHz
– 100 kHz -- 130 kHz
• Skip--Cycle Operation at Low Peak Currents Only: No Acoustic Noise!
• Dynamic Self--Supply, No Need for an Auxiliary Winding
• Internal 1.0 ms Soft--Start
• Latched Overvoltage Protection with Auxiliary Winding Operation
• Frequency Jittering for Better EMI Signature
• Auto--Recovery Internal Output Short--Circuit Protection
• Below 100 mW Standby Power if Auxiliary Winding is Used
• Internal Temperature Shutdown
• Direct Optocoupler Connection
• SPICE Models Available for TRANsient Analysis

These are Pb--Free and Halide--Free DevicesTypical Applications
• Low Power AC/DC Adapters for Chargers
• Auxiliary Power Supplies (USB, Appliances,TVs, etc.)

Technical parameters

Parameters

Compare grouped NCP1012ST130T3G parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Lifecycle Status

    ACTIVE (Last Updated: 4 days ago)

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Mounting Type

    Surface Mount

NCP1012ST130T3G Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 4 days ago)
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2005
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Halogen Free

Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.

Halogen Free
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

2 Weeks
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

TO-261-4, TO-261AA
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Switching Regulator or Controllers
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - AC DC Converters, Offline Switchers
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~150°C TJ
Output Current

Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.

550mA
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

40
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

SINGLE
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

4
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

1.65mm
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3.7mm
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

6.7mm
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

4
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

4
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

2.3mm
Fall Time (Typ)

Typical time for the output signal to transition from 90% to 10% of its amplitude. This parameter indicates switching speed and affects high-frequency performance. Compare with rise time and verify against the datasheet for your specific operating conditions.

10 ns
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

19W
Power Rating

Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits.

19W
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

NCP1012ST130T3G
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

NCP1012
NCP1012ST130T3G Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Output Isolation

Describes the electrical isolation between input and output circuits in power modules or converters. This is critical for safety and noise reduction. Check the isolation voltage rating and type (basic, reinforced) in the datasheet for your application requirements.

Isolated
Frequency - Switching

Indicates the switching frequency of a power converter or regulator. Higher frequencies allow smaller magnetics but may increase losses. Compare with your design's efficiency and EMI requirements, and verify the actual range in the datasheet.

130kHz
Control Mode

Defines the control method used by a power management IC, such as voltage mode, current mode, or hysteretic. This affects transient response, stability, and external component selection. Ensure the mode matches your application's performance needs.

CURRENT-MODE
Control Technique

Specifies the switching regulator control method, such as PWM, PFM, or burst mode. This affects efficiency, noise, and transient response. Engineers should verify the technique against the datasheet to ensure it matches the application's power requirements and EMI constraints.

PULSE WIDTH MODULATION
Topology

Specifies the internal circuit architecture of the power converter, such as flyback, forward, or buck. This determines efficiency, isolation, and component stress. Engineers must verify topology against the datasheet to ensure it matches the intended application and operating conditions.

Flyback
Analog IC - Other Type

Select this category when the analog integrated circuit does not fit standard classifications like op-amps, comparators, or regulators. Verify the exact function and pinout in the datasheet to ensure compatibility with your circuit design and performance requirements.

SWITCHING REGULATOR
Number Of Channels

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

1
Switcher Configuration

Indicates the topology of the internal switching regulator, such as buck, boost, or buck-boost. This determines the input-output voltage relationship and efficiency. Verify the configuration against your power supply requirements and the datasheet to ensure correct operation.

SINGLE
Internal Switch(Es)

Indicates the number of switches integrated inside the component. This is critical for power management ICs, multiplexers, or relay drivers where the internal topology determines external wiring. Verify against the datasheet to ensure the device matches your circuit's switching requirements.

Yes
Nominal Input Voltage

Specifies the typical input voltage level for which the component is designed to operate. Compare this value with your power supply output to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and operating conditions.

8V
Rise Time

Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.

20ns
Voltage - Breakdown

Breakdown voltage is the voltage at which a component begins to conduct in reverse or fails. Compare this parameter across similar parts to ensure adequate margin for your operating conditions. Always verify against the datasheet for the specific test current and temperature.

700V
Max Duty Cycle

Specifies the highest proportion of time the output remains active within a switching period. Compare this limit when selecting power controllers or drivers to ensure stable operation and avoid excessive heat. Verify against the datasheet for your operating conditions.

72 %
Duty Cycle

Represents the ratio of on-time to the total switching period in a PWM signal. It determines the output voltage in switching converters. Check the maximum and minimum duty cycle limits in the datasheet to ensure proper operation across your input range.

67%
Voltage - Supply (Vcc/Vdd)

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

8.5V~10V
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Over Load, Over Temperature, Over Voltage
NCP1012ST130T3G Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99

Datasheet preview

Datasheet PDF viewer

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ON Semiconductor

NCP1012ST130T3G

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for NCP1012ST130T3G. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact NCP1012ST130T3G ordering code, packaging, stock, datasheet, and replacement path.

What does NCP1012ST130T3G mean?

NCP1012ST130T3G is the exact ordering code listed for a PMIC - AC DC Converters, Offline Switchers component from ON Semiconductor. The current package reference is SOT223, with listed context including IC OFFLINE SWIT SMPS CM SOT223. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the NCP1012ST130T3G ordering code?

Treat NCP1012ST130T3G as the full ordering code during RFQ and engineering review. Confirm the listed SOT223 package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is NCP1012ST130T3G supplied in?

NCP1012ST130T3G is currently listed with package reference SOT223 from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is NCP1012ST130T3G currently available?

NCP1012ST130T3G is currently marked with stock availability on this page. Before ordering, confirm the package (SOT223), listed stock (129827), available quantity (14040), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare NCP1012ST130T3G alternatives?

A mapped alternative list is not currently published for NCP1012ST130T3G. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.