ATF16LV8C-10XU Embedded - PLDs (Programmable Logic Device) by Microchip Technology

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Specifies the non-volatile memory technology used for device configuration, such as OTP, flash, or EEPROM. This determines how firmware or settings are stored and updated. Verify the programmable type against the datasheet to ensure it matches your production programming and field update requirements.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Indicates the total number of macro cells in a CPLD or FPGA, which determines the logic capacity and complexity of designs you can implement. Compare this value against your required logic functions and check the datasheet for exact architecture and routing constraints.

Internal design or topology of the component, such as the arrangement of internal circuits or blocks. This affects performance, power consumption, and functionality. Engineers compare architectures to match application requirements and verify compatibility with the datasheet.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Indicates the total number of product terms implemented in a programmable logic device. This affects logic capacity and timing. Engineers compare this value to the complexity of their design to ensure sufficient resources. Verify against the datasheet for the specific device variant.

Specifies the count of input pins reserved for dedicated functions on programmable logic devices. Compare this number when selecting FPGAs or CPLDs to ensure sufficient dedicated inputs for your design. Verify against the datasheet pinout to avoid conflicts with configurable I/O.

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Input voltage rating or range for which the component is designed to operate. Exceeding this can damage the device. Check the datasheet for absolute maximum ratings and recommended operating conditions to ensure your supply voltage is within safe limits.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

Indicates the total number of logic gates contained within the integrated circuit. This helps determine the logic capacity and complexity of the device. Compare with your design requirements to ensure sufficient logic resources for your application.

Describes the logical or electrical function performed by the output pin, such as push-pull, open-drain, or tri-state. This affects how the output interfaces with other circuits. Verify the output type and drive capability in the datasheet.

Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.