MC100EP01DG Logic - Gates and Inverters - Multi-Function, Configurable by ON Semiconductor
MC100EP01DG is a Logic - Gates and Inverters - Multi-Function, Configurable from ON Semiconductor in 8SOIC packaging. It is commonly reviewed for IC GATE OR/NOR ECL 4INPUT 8SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for MC100EP01DG before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
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Before PO release
Part confirmation
Exact MPN confirmed: MC100EP01DG
Package to verify: 8SOIC
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for MC100EP01DG from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.
The MC10EP01 is a 4-input OR/NOR gate. The device is functionally equivalent to the EL01 device, LVEL01, and E101 (a quad version). With AC performance much faster than the LVEL01 device, the EP01 is ideal for applications requiring the fastest AC performance available. The 100 Series contains temperature compensation. Features • 230 ps Typical Propagation Delay • Maximum Frequency = > 3 GHz Typical • PECL Mode Operating Range: VCC = 3.0 V to 5.5 V with VEE = 0 V • NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V • Open Input Default State • These Devices are Pb-Free, Halogen Free and are RoHS Compliant
Technical parameters
Parameters
Compare grouped MC100EP01DG parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Supply Voltage-Max (Vsup)
5.5V
Product Parameter
Number Of Inputs
4
Product Parameter
Supply Voltage-Min (Vsup)
3V
Product Parameter
Number Of Gates
1
Product Parameter
Supply Voltage
3V~5.5V
Product Parameter
Turn On Delay Time
350 ps
MC100EP01DG Product Parameter
Parameter
Value
Supply Voltage-Max (Vsup)
Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.
5.5V
Number Of Inputs
Defines how many input channels the component supports, such as a multiplexer, logic gate, or amplifier. This determines the maximum number of signals that can be routed or processed. Ensure the input count matches your system's channel requirements and pin configuration.
4
Supply Voltage-Min (Vsup)
Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.
3V
Number Of Gates
Indicates the total number of logic gates contained within the integrated circuit. This helps determine the logic capacity and complexity of the device. Compare with your design requirements to ensure sufficient logic resources for your application.
1
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
3V~5.5V
Turn On Delay Time
Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.
350 ps
Schmitt Trigger Input
Indicates whether the input has a Schmitt trigger with hysteresis for noise immunity. This helps prevent false triggering in noisy environments. Verify the threshold levels in the datasheet when designing with sensors or digital signals.
No
Propagation Delay
Time from input transition to output response in logic or signal path. Critical for timing margins in high-speed digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
0.35 ns
Logic Type
Specifies the logic family or functional type of the integrated circuit, such as AND, OR, inverter, or buffer. This determines voltage levels, speed, and compatibility with other logic families. Verify the exact type against the datasheet to ensure correct circuit operation and signal integrity.
NOR/OR Gate
Propagation Delay
Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
330 ps
Logic Function
Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.39.0001
MC100EP01DG Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tube
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
ACTIVE (Last Updated: 1 week ago)
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
4 Weeks
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
3.9878mm
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2000
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~85°C
Halogen Free
Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.
Halogen Free
Termination
Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.
SMD/SMT
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
8-SOIC (0.154, 3.90mm Width)
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
ON Semiconductor
Packing Method
Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment.
RAIL
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
4.9784mm
Number Of Functions
Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.
1
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Tin
Reflow Temperature-Max (S)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
40
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
8
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
8
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
8
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
3.3V
Number Of Outputs
Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.
2
Output Current
Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.
50mA
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
1.4986mm
Output Type
Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.
Differential
Max Output Current
Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.
50mA
Low Level Output Current
Specifies the current the device can sink when its output is driven to a low logic state. Compare this value with the input current of connected loads to ensure reliable logic levels. Verify against the datasheet for maximum ratings and temperature effects.
50mA
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Gates
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
ECL
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
100EP
High Level Output Current
Specifies the maximum current the output can source when the logic level is high. This is critical for driving loads such as LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or damage.
-50mA
Additional Feature
Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Logic - Gates and Inverters - Multi-Function, Configurable
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
100EP01
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
MC100EP01DG
Datasheet preview
Datasheet PDF viewer
Preview the MC100EP01DG datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for MC100EP01DG. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact MC100EP01DG ordering code, packaging, stock, datasheet, and replacement path.
What does MC100EP01DG mean?
MC100EP01DG is the exact ordering code listed for a Logic - Gates and Inverters - Multi-Function, Configurable component from ON Semiconductor. The current package reference is 8SOIC, with listed context including IC GATE OR/NOR ECL 4INPUT 8SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the MC100EP01DG ordering code?
Treat MC100EP01DG as the full ordering code during RFQ and engineering review. Confirm the listed 8SOIC package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is MC100EP01DG supplied in?
MC100EP01DG is currently listed with package reference 8SOIC from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is MC100EP01DG currently available?
MC100EP01DG is currently marked with stock availability on this page. Before ordering, confirm the package (8SOIC), listed stock (55124), available quantity (74612), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare MC100EP01DG alternatives?
A mapped alternative list is not currently published for MC100EP01DG. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.