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MC34262DG PMIC - PFC (Power Factor Correction) by ON Semiconductor

MC34262DG is a PMIC - PFC (Power Factor Correction) from ON Semiconductor in 8SOIC packaging. It is commonly reviewed for IC PFC CONTROLLER CRM 8SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MC34262DG PMIC - PFC (Power Factor Correction) by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

MC34262DG

Internal code

TCE000074844

Package

8SOIC

Manufacturer
ON Semiconductor

Key specifications

Series

-

Min Quantity

1

Description

IC PFC CONTROLLER CRM 8SOIC

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MC34262DG before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MC34262DG
  • Package to verify: 8SOIC

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for MC34262DG from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.


The MC34262/MC33262 are active power factor controllers specifically designed for use as a preconverter in electronic ballast and in off−line power converter applications.
These integrated circuits feature an internal startup timer for stand−alone applications, a one quadrant multiplier for near unity power factor, zero current detector to ensure critical conduction operation, transconductance error amplifier, quickstart circuit for enhanced startup, trimmed internal bandgap reference, current sensing comparator, and a totem pole output ideally suited for driving a power MOSFET.
Features
•Overvoltage Comparator Eliminates Runaway Output Voltage
•Internal Startup Timer
•One Quadrant Multiplier
•Zero Current Detector
•Trimmed 2% Internal Bandgap Reference
•Totem Pole Output with High State Clamp
•Undervoltage Lockout with 6.0 V of Hysteresis
•Low Startup and Operating Current
•Supersedes Functionality of SG3561 and TDA4817
•Pb−Free Packages are Available

Technical parameters

Parameters

Compare grouped MC34262DG parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Packaging

    Tube

  • Product Attribute

    Mounting Type

    Surface Mount

  • Product Attribute

    Published

    2005

MC34262DG Product Attribute
ParameterValue
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2005
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Halogen Free

Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.

Halogen Free
Termination

Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.

SMD/SMT
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

2 Weeks
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-SOIC (0.154, 3.90mm Width)
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

450mW
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Switching Regulator or Controllers
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

LAST SHIPMENTS (Last Updated: 1 day ago)
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

40
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

4mm
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

1.5mm
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Power Dissipation

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

450mW
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

5mm
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

BIPOLAR
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

1
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

8
Max Input Voltage

Maximum voltage that can be applied to the input without causing damage or malfunction. Exceeding this limit may lead to breakdown or reduced reliability. Always compare with your supply voltage and check the datasheet for absolute maximum ratings.

10V
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

12V
Max Output Voltage

Specifies the highest voltage the device can deliver at its output under specified conditions. Compare this limit with your application's supply and load requirements to ensure safe operation and avoid overvoltage damage.

18V
Operating Supply Current

The amount of current the device draws from its power supply during normal operation. This is essential for power budget calculations, thermal management, and selecting appropriate power sources. Check datasheet for typical and maximum values under specified conditions.

6.5mA
Output Voltage

Specifies the regulated voltage level available at the output pin under specified load and input conditions. Compare this value with your circuit requirements and verify against the datasheet's tolerance and temperature derating.

16V
Max Supply Current

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

12mA
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

500mA
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

0°C~85°C
Output Current

Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.

10μA
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - PFC (Power Factor Correction)
Mode

Operating mode of the component, such as normal, standby, or test. This defines how the device behaves under different control signals. Ensure the mode matches your application requirements. Refer to the datasheet for mode selection and timing diagrams.

Critical Conduction (CRM)
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

50kHz
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

MC34262
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MC34262DG
MC34262DG Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Control Technique

Specifies the switching regulator control method, such as PWM, PFM, or burst mode. This affects efficiency, noise, and transient response. Engineers should verify the technique against the datasheet to ensure it matches the application's power requirements and EMI constraints.

PULSE WIDTH MODULATION
Nominal Input Voltage

Specifies the typical input voltage level for which the component is designed to operate. Compare this value with your power supply output to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and operating conditions.

12V
Topology

Specifies the internal circuit architecture of the power converter, such as flyback, forward, or buck. This determines efficiency, isolation, and component stress. Engineers must verify topology against the datasheet to ensure it matches the intended application and operating conditions.

Boost
Analog IC - Other Type

Select this category when the analog integrated circuit does not fit standard classifications like op-amps, comparators, or regulators. Verify the exact function and pinout in the datasheet to ensure compatibility with your circuit design and performance requirements.

POWER FACTOR CONTROLLER
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

12V~28V
Current - Startup

Current drawn by the device during the startup or power-on phase. This transient current can affect power supply sizing and inrush protection. Check this value against your power budget and ensure your supply can handle the initial surge without voltage droop.

250μA
MC34262DG Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

RoHS Compliant
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

No SVHC
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99

Datasheet preview

Datasheet PDF viewer

Preview the MC34262DG datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.

ON Semiconductor

MC34262DG

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MC34262DG. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MC34262DG ordering code, packaging, stock, datasheet, and replacement path.

What does MC34262DG mean?

MC34262DG is the exact ordering code listed for a PMIC - PFC (Power Factor Correction) component from ON Semiconductor. The current package reference is 8SOIC, with listed context including IC PFC CONTROLLER CRM 8SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MC34262DG ordering code?

Treat MC34262DG as the full ordering code during RFQ and engineering review. Confirm the listed 8SOIC package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MC34262DG supplied in?

MC34262DG is currently listed with package reference 8SOIC from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MC34262DG currently available?

MC34262DG is currently marked with stock availability on this page. Before ordering, confirm the package (8SOIC), listed stock (30435), available quantity (61045), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MC34262DG alternatives?

A mapped alternative list is not currently published for MC34262DG. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.