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FSL117MRIN PMIC - AC DC Converters, Offline Switchers by ON Semiconductor

FSL117MRIN is a PMIC - AC DC Converters, Offline Switchers from ON Semiconductor in DIP packaging. It is commonly reviewed for IC OFF-LINE SWITCH PWM 8DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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FSL117MRIN PMIC - AC DC Converters, Offline Switchers by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

FSL117MRIN

Internal code

TCE000069860

Package

DIP

Manufacturer
ON Semiconductor

Key specifications

Series

FPS™

Min Quantity

1

Description

IC OFF-LINE SWITCH PWM 8DIP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for FSL117MRIN before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: FSL117MRIN
  • Package to verify: DIP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for FSL117MRIN from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.


Features
• 3.5A, 100V, rDS(ON) = 0.600Ω
• Total Dose - Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event - Safe Operating Area Curve for Single Event Effects - SEE Immunity for LET of 36MeV/mg/cm2 with VDS up to 80% of Rated Breakdown and VGS of 10V Off-Bias
• Dose Rate - Typically Survives 3E9 RAD (Si)/s at 80% BVDSS - Typically Survives 2E12 if Current Limited to IDM
• Photo Current - 0.3nA Per-RAD(Si)/s Typically
• Neutron - Maintain Pre-RAD Specifications for 3E13 Neutrons/cm2 - Usable to 3E14 Neutrons/cm2

Technical parameters

Parameters

Compare grouped FSL117MRIN parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Mounting Type

    Through Hole

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lifecycle Status

    ACTIVE (Last Updated: 1 day ago)

  • Product Attribute

    Packaging

    Tube

FSL117MRIN Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Through Hole
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 1 day ago)
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

11 Weeks
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Qualification Status

Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.

Not Qualified
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2016
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~125°C TJ
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Switching Regulator or Controllers
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

FPS™
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - AC DC Converters, Offline Switchers
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-DIP (0.300, 7.62mm)
Power Dissipation

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

1.5W
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Max Supply Current

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

500μA
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Through Hole
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

1
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

NOT SPECIFIED
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

NOT SPECIFIED
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

2.54mm
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

1.5W
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

3.68mm
Output Current

Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.

1A
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

6.67mm
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

1.2mA
Current

Specifies the maximum continuous electrical current the component can safely handle under specified conditions. Compare this rating with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for derating and temperature effects.

800mA
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

9.83mm
Power Rating

Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits.

10W
Resistance

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

11Ohm
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

FSL117MRIN
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

FSL117
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

815.6mg
FSL117MRIN Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Not Applicable
FSL117MRIN Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Output Isolation

Describes the electrical isolation between input and output circuits in power modules or converters. This is critical for safety and noise reduction. Check the isolation voltage rating and type (basic, reinforced) in the datasheet for your application requirements.

Isolated
Control Mode

Defines the control method used by a power management IC, such as voltage mode, current mode, or hysteretic. This affects transient response, stability, and external component selection. Ensure the mode matches your application's performance needs.

CURRENT-MODE
Analog IC - Other Type

Select this category when the analog integrated circuit does not fit standard classifications like op-amps, comparators, or regulators. Verify the exact function and pinout in the datasheet to ensure compatibility with your circuit design and performance requirements.

SWITCHING CONTROLLER
Topology

Specifies the internal circuit architecture of the power converter, such as flyback, forward, or buck. This determines efficiency, isolation, and component stress. Engineers must verify topology against the datasheet to ensure it matches the intended application and operating conditions.

Flyback
Frequency - Switching

Indicates the switching frequency of a power converter or regulator. Higher frequencies allow smaller magnetics but may increase losses. Compare with your design's efficiency and EMI requirements, and verify the actual range in the datasheet.

67kHz
Max Output Power

Maximum power the device can deliver at the output under specified conditions. Compare this rating with your application's load requirements to ensure sufficient headroom. Verify against the datasheet's test conditions, as output power may vary with input voltage, temperature, and load impedance.

10W
Turn-Off Delay Time

Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.

30 ns
Internal Switch(Es)

Indicates the number of switches integrated inside the component. This is critical for power management ICs, multiplexers, or relay drivers where the internal topology determines external wiring. Verify against the datasheet to ensure the device matches your circuit's switching requirements.

Yes
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

12 ns
Start-Up Voltage

Minimum input voltage required for the device to begin normal operation. Compare this value with your power supply's output to ensure reliable start-up. Verify against the datasheet's recommended operating conditions.

12V
Minimum Breakdown Voltage

Specifies the lowest voltage at which the component begins to conduct in reverse or breakdown mode. Compare this value with the operating voltage to ensure sufficient margin. Verify against the datasheet for temperature and tolerance effects.

700V
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Current Limiting, Over Load, Over Temperature, Over Voltage, Short Circuit
Voltage - Supply (Vcc/Vdd)

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

7.5V~26V
Duty Cycle

Represents the ratio of on-time to the total switching period in a PWM signal. It determines the output voltage in switching converters. Check the maximum and minimum duty cycle limits in the datasheet to ensure proper operation across your input range.

67%
Max Duty Cycle

Specifies the highest proportion of time the output remains active within a switching period. Compare this limit when selecting power controllers or drivers to ensure stable operation and avoid excessive heat. Verify against the datasheet for your operating conditions.

73 %
Power (Watts)

Maximum continuous power dissipation or output power the component can handle under specified conditions. Compare this rating with your application's power requirements to ensure reliable operation. Always verify against the datasheet for thermal limits and derating.

15W

Datasheet preview

Datasheet PDF viewer

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FSL117MRIN

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for FSL117MRIN. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact FSL117MRIN ordering code, packaging, stock, datasheet, and replacement path.

What does FSL117MRIN mean?

FSL117MRIN is the exact ordering code listed for a PMIC - AC DC Converters, Offline Switchers component from ON Semiconductor. The current package reference is DIP, with listed context including IC OFF-LINE SWITCH PWM 8DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the FSL117MRIN ordering code?

Treat FSL117MRIN as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is FSL117MRIN supplied in?

FSL117MRIN is currently listed with package reference DIP from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is FSL117MRIN currently available?

FSL117MRIN is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (167625), available quantity (47097), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare FSL117MRIN alternatives?

A mapped alternative list is not currently published for FSL117MRIN. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.