AT91SAM9G20B-CU Embedded - Microprocessors by Microchip Technology
AT91SAM9G20B-CU is a Embedded - Microprocessors from Microchip Technology in manufacturer-listed packaging. It is commonly reviewed for IC MCU 32BIT 64KB ROM 217BGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for AT91SAM9G20B-CU before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: AT91SAM9G20B-CU
Package to verify: -
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped AT91SAM9G20B-CU parameters from Microchip Technology, including package, series, key attributes, and technical values used for engineering and sourcing review.
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
AT91SAM9G20B-CU Product Parameter
Parameter
Value
Oscillator Type
Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.
Internal
UPs/UCs/Peripheral ICs Type
Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements.
MICROCONTROLLER, RISC
ROM (Words)
Indicates the read-only memory capacity in words, representing the number of addressable storage units for firmware or fixed data. Compare sizes to ensure sufficient code space for your application. Check the datasheet for exact word width.
65536
Peripherals
Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.
DMA, POR, PWM, WDT
Has ADC
Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements.
YES
Number Of PWM Channels
Indicates the number of pulse-width modulation output channels available. This is essential for motor control, dimming, or audio applications. Verify the resolution and frequency range of each channel in the datasheet to ensure they meet your control requirements.
1
Bit Size
Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.
32
Data Bus Width
Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.
32b
Number Of Timers/Counters
Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features.
7
RAM (Words)
Specifies the random access memory capacity expressed in words, a common unit for microcontrollers and digital signal processors. Compare this value when selecting devices for data buffering or real-time processing. Verify against the datasheet to ensure sufficient memory for your application.
4
RAM Size
Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.
32kB
Peak Reflow Temperature-Max (S)
Specifies the maximum duration in seconds that a component can withstand at its peak reflow temperature during soldering. Critical for PCB assembly process control to prevent thermal damage. Verify against the datasheet for your specific soldering profile.
ARM
Tim
Thermal interface material used between a component and heatsink to improve heat transfer. Type and thickness affect thermal resistance. Choose based on application and mounting pressure. Confirm compatibility with component package.
Yes
Voltage - Supply (Vcc/Vdd)
Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.
64kB
Number Of Ethernet Channels
Indicates how many independent Ethernet interfaces the component supports. Compare this with your system's networking requirements to ensure sufficient connectivity. Verify against the datasheet for exact port configurations and supported protocols.
10/100Mbps
Manufacturer
Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity.
ARM926EJ-S
Ti
Ti is a specific parameter value for this component. Engineers compare it to datasheet specifications to ensure the part meets design requirements. Verify Ti against the manufacturer's datasheet for your application.
EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Standby Voltage-Min
Specifies the minimum supply voltage required for the device to maintain standby operation. This is crucial for low-power designs where the component must retain state or wake-up capability. Check this value against your power rail to ensure reliable standby performance and avoid unintended shutdown.
No
AT91SAM9G20B-CU Parameter
Parameter
Value
Supply Voltage - Max
Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the application's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings, as exceeding this limit may cause permanent failure.
USB 2.0 (2)
AT91SAM9G20B-CU Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tray
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
1997
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
10 Weeks
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
15mm
Termination
Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.
SMD/SMT
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.8mm
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~85°C TA
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Microcontrollers
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
1.05mm
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Microchip Technology
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
BALL
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Copper, Silver, Tin
Number Of Cores/Bus Width
Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility.
1 Core 32-Bit
Voltage - I/O
I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation.
1.8V 3.3V
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - Microprocessors
Memory Type
Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.
ROM
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
217
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
217-LFBGA
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
BOTTOM
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
15mm
Max Supply Voltage
Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.
3.6V
Internal Bus Architecture
Indicates the internal data bus structure of the component, such as Harvard or Von Neumann. This affects instruction throughput and memory access efficiency. Engineers should verify this against the datasheet when optimizing firmware for performance or power consumption.
FLASH
Number Of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
96
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
SAM9G
Minimum Supply Voltage
Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.
900mV
Frequency
Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.
400MHz
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
1V
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
217
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
AT91SAM9G20
Connector Type
Specifies the connector series or family, such as USB, RJ45, or D-Sub. This determines mechanical compatibility, pin layout, and mating standards. Verify against the datasheet to ensure the connector matches your board design and mating counterpart.
SDRAM, SRAM
Barrel Shifter
Indicates the presence of a hardware circuit that can shift or rotate data bits by any number of positions in a single clock cycle. This is important for digital signal processing and arithmetic operations. Verify the shift range and performance in the datasheet.
2
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
AT91SAM9G20B-CU
Interface
Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.
Preview the AT91SAM9G20B-CU datasheet from Microchip Technology to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for AT91SAM9G20B-CU. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact AT91SAM9G20B-CU ordering code, packaging, stock, datasheet, and replacement path.
What does AT91SAM9G20B-CU mean?
AT91SAM9G20B-CU is the exact ordering code listed for a Embedded - Microprocessors component from Microchip Technology. The current package reference is -, with listed context including IC MCU 32BIT 64KB ROM 217BGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the AT91SAM9G20B-CU ordering code?
Treat AT91SAM9G20B-CU as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Microchip Technology, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is AT91SAM9G20B-CU supplied in?
AT91SAM9G20B-CU is currently listed with package reference - from Microchip Technology. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is AT91SAM9G20B-CU currently available?
AT91SAM9G20B-CU is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (68733), available quantity (10587), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare AT91SAM9G20B-CU alternatives?
A mapped alternative list is not currently published for AT91SAM9G20B-CU. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.