BYM07-200-E3/98 Diodes - Rectifiers - Single by Vishay
BYM07-200-E3/98 is a Diodes - Rectifiers - Single from Vishay in DO213 packaging. It is commonly reviewed for DIODE GEN PURP 200V 500MA DO213. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for BYM07-200-E3/98 before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: BYM07-200-E3/98
Package to verify: DO213
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped BYM07-200-E3/98 parameters from Vishay, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Part Status
Active
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Factory Lead Time
19 Weeks
Product Attribute
Minimum Operating Temperature
-65°C
Product Attribute
Mounting Type
Surface Mount
BYM07-200-E3/98 Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
19 Weeks
Minimum Operating Temperature
Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.
-65°C
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tape & Reel (TR)
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2009
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Element Configuration
Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.
Single
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Vishay
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Discrete Semiconductor Products
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Rectifier Diodes
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Diodes - Rectifiers - Single
HTS Code
Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.
8541.10.00.70
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
WRAP AROUND
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
END
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Tin
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Reflow Temperature-Max (S)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
40
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
2
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
2
Current
Specifies the maximum continuous electrical current the component can safely handle under specified conditions. Compare this rating with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for derating and temperature effects.
5A
Max Operating Temperature
Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.
175°C
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
2
Case Connection
Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling.
ISOLATED
Recovery Time
Recovery time is the interval a semiconductor device needs to return to its blocking state after conducting. It affects switching losses and high-frequency performance. Compare this parameter across diodes and transistors to ensure your circuit meets timing requirements. Always verify against the datasheet for your operating conditions.
50 ns
Voltage
Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes.
200V
Capacitance @ Vr, F
Junction capacitance measured at a specified reverse voltage and frequency. This value affects switching speed and high-frequency performance. Compare it with your circuit's requirements and verify against the datasheet for accurate operation.
7pF @ 4V 1MHz
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
SUPERECTIFIER®
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
1.68mm
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
1.68mm
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
3.68mm
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
DO-213AA (Glass)
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
BYM07-200-E3/98
Additional Feature
Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.
HIGH RELIABILITY; FREE WHEELING DIODE
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8541.10.0070
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
BYM07-200-E3/98 Product Parameter
Parameter
Value
Speed
Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed.
Fast Recovery =< 500ns, > 200mA (Io)
Operating Temperature - Junction
Specifies the allowable junction temperature range for a semiconductor device. Exceeding this range can degrade performance or cause failure. Engineers should verify this parameter against the datasheet for thermal management and reliability assessment in their application.
-65°C~175°C
Current - Reverse Leakage @ Vr
Small current flowing through a semiconductor junction when reverse voltage is applied. Lower leakage is preferred for precision and low-power circuits. Check this parameter at the specified reverse voltage to ensure it meets your application's requirements.
5μA @ 200V
Number Of Elements
Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.
1
Diode Element Material
Semiconductor material used in the diode, such as silicon, germanium, or gallium arsenide. Affects forward voltage, speed, and temperature behavior. Choose based on your application's voltage, current, and switching requirements. Verify with datasheet specifications.
SILICON
Forward Voltage
Forward voltage is the voltage drop across a diode or LED when it conducts current in the forward direction. It affects power dissipation and efficiency. Compare this value with your circuit's supply voltage and check the datasheet for the specified test current.
1.25V
Diode Type
Select the diode classification such as Schottky, Zener, or standard rectifier. This defines the device's electrical behavior and typical applications. Verify the exact type against the datasheet to ensure it meets your circuit requirements for voltage, current, and switching speed.
Standard
Reverse Voltage
Maximum voltage a diode or rectifier can withstand in the reverse direction without breakdown. Compare this rating with your circuit's peak reverse voltage to ensure reliable operation. Always verify against the datasheet's absolute maximum ratings.
200V
Peak Reverse Current
Specifies the highest reverse current that flows through the component when the rated reverse voltage is applied. Compare this value across diodes and rectifiers to ensure minimal leakage and stable operation. Verify against the datasheet for your operating temperature and voltage conditions.
5μA
Max Repetitive Reverse Voltage (Vrrm)
Indicates the highest repetitive reverse voltage the diode can withstand in blocking mode. Engineers compare this to the circuit's peak reverse stress to ensure reliable operation. Always verify against the datasheet for your specific application.
200V
Max Reverse Voltage (DC)
Specifies the maximum continuous DC voltage that can be applied in the reverse direction without causing breakdown. Critical for rectifier and protection diodes. Verify against datasheet to ensure safe operating margin in your circuit.
200V
Max Surge Current
Highest current the device can handle for a brief surge, such as inrush or lightning. Essential for power supply and protection circuits. Always compare with your system's surge profile and check the datasheet for duration and repetition rate.
10A
Reverse Recovery Time
Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions.
50 ns
Forward Current
Specifies the maximum continuous forward current the component can handle without damage. Compare this rating with your circuit's operating current to ensure reliable performance. Always verify against the datasheet for derating curves and temperature conditions.
500mA
Average Rectified Current
Average value of the rectified current that the device can handle continuously. Compare this rating with your circuit's average load current to ensure reliable operation. Verify against the datasheet's thermal and derating curves for safe design.
500mA
Max Forward Surge Current (Ifsm)
Specifies the maximum non-repetitive forward surge current the diode can handle for a short duration, typically during inrush or fault conditions. Compare with your circuit's worst-case surge to prevent damage. Check the datasheet for pulse duration and waveform.
10A
Peak Non-Repetitive Surge Current
Maximum allowable surge current for a short duration, typically specified for diodes and thyristors. This value indicates the device's ability to withstand transient overcurrents without damage. Verify against datasheet for reliability in surge-prone applications.
10A
Forward Voltage (Vf) Max @ If
This is the maximum voltage drop across the diode or LED when conducting the specified forward current. It affects power dissipation and efficiency. Compare this value with your circuit's supply voltage and current to ensure proper operation. Always verify against the datasheet for your specific part.
1.25V @ 500mA
Datasheet preview
Datasheet PDF viewer
Preview the BYM07-200-E3/98 datasheet from Vishay to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for BYM07-200-E3/98. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact BYM07-200-E3/98 ordering code, packaging, stock, datasheet, and replacement path.
What does BYM07-200-E3/98 mean?
BYM07-200-E3/98 is the exact ordering code listed for a Diodes - Rectifiers - Single component from Vishay. The current package reference is DO213, with listed context including DIODE GEN PURP 200V 500MA DO213. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the BYM07-200-E3/98 ordering code?
Treat BYM07-200-E3/98 as the full ordering code during RFQ and engineering review. Confirm the listed DO213 package, manufacturer documentation from Vishay, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is BYM07-200-E3/98 supplied in?
BYM07-200-E3/98 is currently listed with package reference DO213 from Vishay. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is BYM07-200-E3/98 currently available?
BYM07-200-E3/98 is currently marked with stock availability on this page. Before ordering, confirm the package (DO213), listed stock (116734), available quantity (69351), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare BYM07-200-E3/98 alternatives?
A mapped alternative list is not currently published for BYM07-200-E3/98. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.