Supply original 28-6554-10, Sockets for ICs, Transistors, by Aries Electronics, Inc.

CONN IC DIP SOCKET ZIF 28POS TIN

RoHS
Datasheet
Supply original 28-6554-10, Sockets for ICs, Transistors, by Aries Electronics, Inc. | TrustCompo

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Part Number

28-6554-10

Internal code

TCE000058275

Package

DIP

Key specifications

Serise

55

Min Quantity

1

Description

CONN IC DIP SOCKET ZIF 28POS TIN

key Attributes

-

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4 certifications

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Product overview

Overview

CONN IC DIP SOCKET ZIF 28POS TIN

Full technical breakdown

Detailed Specifications

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Popular Specs Surfaced First

Product Attribute

Insulation Resistance

1GOhm

Product Attribute

Part Status

Active

Product Attribute

Flammability Rating

UL94 V-0

Product Attribute

Number Of Rows

2

Product Attribute

Categories

Connectors, Interconnects

Product Attribute

PCB Contact Pattern

RECTANGULAR

Insulation Resistance
1GOhm
Part Status
Active
Flammability Rating
UL94 V-0
Number Of Rows
2
Categories
Connectors, Interconnects
PCB Contact Pattern
RECTANGULAR
Mounting Type
Through Hole
REACH Status
REACH Unaffected
ECCN
EAR99
Pitch - Mating
0.100 2.54mm
Lead Pitch
2.54mm
Lead Free
Lead Free
Packaging
Bulk
Max Operating Temperature
105°C
Mating Contact Pitch
0.1 inch
Dielectric Withstanding Voltage
1000VAC V
Contact Material
Copper
Contact Style
BELLOWED TYPE
Factory Lead Time
4 Weeks
Contact Finish Thickness - Mating
200.0μin 5.08μm
Additional Feature
STANDARD: UL 94V-0
Published
1996
Number Of Pins
28
Pbfree Code
yes
Mount
Through Hole
Contact Finish - Mating
Tin
Material Flammability Rating
UL94 V-0
Termination
Solder
Orientation
Straight
Current Rating
1A
Gender
Female
Max Current Rating
1A
Max Voltage Rating (AC)
1kV
Contact Finish Thickness - Post
200.0μin 5.08μm
Sub-Categories
Sockets for ICs, Transistors
Pitch - Post
0.100 2.54mm
Row Spacing
15.24 mm
Number Of Contacts
28
Contact Material - Mating
Beryllium Copper
Feature
Closed Frame
Length
50.55mm
Termination Post Length
0.110 2.78mm
Contact Material - Post
Beryllium Copper
Depth
22.86mm
Life (Cycles)
25000 cycles
Body Breadth
0.9 inch
Height
11.94mm
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Type
DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Insulation Material
Polyphenylene
Width
22.9mm
Series
55
Manufacturer
Aries Electronics, Inc.
Number Of Positions Or Pins (Grid)
28 (2 x 14)
Manufacturer'S Part No.
28-6554-10
Connector Type
DIP
JESD-609 Code
e3
Moisture Sensitivity Level (MSL)
1 (Unlimited)
HTSUS
8536.69.4040
RoHS Status
ROHS3 Compliant
REACH SVHC
No SVHC
ECCN Code
EAR99

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What is 28-6554-10?

28-6554-10 is a Sockets for ICs, Transistors component from Aries Electronics, Inc.. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.

What package and description are listed for 28-6554-10?

28-6554-10 is listed with package reference DIP. The current product description is CONN IC DIP SOCKET ZIF 28POS TIN, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.

Is 28-6554-10 available in stock?

This page currently shows 16043 units in stock and 10766 units available for 28-6554-10. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.

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Is a datasheet available for 28-6554-10?

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