
Spartan-3AN FPGA with 50K system gates, 108 I/O, and industrial temperature grade in TQFP-144.
XC3S50AN-5TQG144C is a FPGAs (Field Programmable Gate Array) from AMD in TQFP-144 packaging. It is commonly reviewed for Spartan-3AN FPGA with 50K system gates, 108 I/O, and commercial temperature grade in TQFP-144. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

XC3S50AN-5TQG144C
TCE000056771
TQFP-144
Spartan-3AN
1
Spartan-3AN FPGA with 50K system gates, 108 I/O, and commercial temperature grade in TQFP-144.
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RFQ checklist
Confirm the core buying details for XC3S50AN-5TQG144C before RFQ, PO release, and shipment planning.
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
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Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
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Before PO release
Product overview
Review the sourcing context for XC3S50AN-5TQG144C from AMD, including product identity, application fit, package notes, and purchasing considerations.
XC3S50AN-5TQG144C is a Spartan-3AN family FPGA for legacy embedded control, industrial interface, and programmable glue-logic designs that still rely on mature Xilinx architectures. This variant provides 50K system gates, 55,296 RAM bits, 108 user I/O, and a commercial temperature range in a fine-pitch 144-pin TQFP package.
Technical parameters
Compare grouped XC3S50AN-5TQG144C parameters from AMD, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Temperature Grade
COMMERCIAL
Product Attribute
Package / Case
TQFP-144
Product Parameter
Speed Grade
-5
Parameter
RAM Bits
55296
Parameter
I/O Count
108
| Parameter | Value |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Temperature Grade Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements. | COMMERCIAL |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | TQFP-144 |
| Parameter | Value |
|---|---|
Speed Grade Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements. | -5 |
| Parameter | Value |
|---|---|
RAM Bits Indicates the total amount of random-access memory available on the device, expressed in bits. This is a key resource for data buffering, program execution, and state storage. Compare RAM size when selecting microcontrollers, FPGAs, or SoCs for memory-intensive applications. Check the datasheet for memory organization and speed. | 55296 |
I/O Count Specifies the number of input/output pins or lines available for interfacing with external devices. This determines how many peripherals, sensors, or actuators you can connect directly. Ensure the I/O count meets your system's connectivity needs. Check the datasheet for pin multiplexing and electrical characteristics. | 108 |
Device Family Identifies the product family or series to which the component belongs. This groups devices with similar architecture, features, and design tools. It helps engineers select compatible components and leverage shared software libraries. Verify the family's roadmap and support when planning long-term production. | Spartan-3AN FPGA |
System Gates Represents the number of logic gates available in a programmable logic device, such as an FPGA or CPLD. This gives an estimate of the digital logic capacity for implementing your design. Compare gate counts to ensure sufficient resources for your logic, memory, and I/O requirements. Check the datasheet for utilization details. | 50000 |
Datasheet preview
Preview the XC3S50AN-5TQG144C datasheet from AMD to check package, electrical characteristics, application notes, and document evidence before RFQ.
Notice documents
No public product notice document is currently displayed for XC3S50AN-5TQG144C. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Explore related FPGAs (Field Programmable Gate Array) products to compare fit, stock status, datasheets, and sourcing options.

Spartan-3AN FPGA with 50K system gates, 108 I/O, and industrial temperature grade in TQFP-144.





Common questions
Targeted answers for buyers verifying the exact XC3S50AN-5TQG144C ordering code, packaging, stock, datasheet, and replacement path.
XC3S50AN-5TQG144C is the exact ordering code listed for a FPGAs (Field Programmable Gate Array) component from AMD. The current package reference is TQFP-144, with listed context including Spartan-3AN FPGA with 50K system gates, 108 I/O, and commercial temperature grade in TQFP-144.. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
Treat XC3S50AN-5TQG144C as the full ordering code during RFQ and engineering review. Confirm the listed TQFP-144 package, manufacturer documentation from AMD, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
XC3S50AN-5TQG144C is currently listed with package reference TQFP-144 from AMD. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
XC3S50AN-5TQG144C is currently marked with stock availability on this page. Before ordering, confirm the package (TQFP-144), listed stock (42694), available quantity (62032), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
A mapped alternative list is not currently published for XC3S50AN-5TQG144C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.