
OMAPL138BZWT4 Embedded - Microprocessors by Texas Instruments
OMAPL138BZWT4 is a Embedded - Microprocessors from Texas Instruments in manufacturer-listed packaging. It is commonly reviewed for IC MPU OMAP-L1X 456MHZ 361NFBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
OMAPL138BZWT4
- Internal code
TCE000056584
- Package
-
- Manufacturer
- Texas Instruments
Key specifications
- Series
OMAP-L1x
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Embedded - Microprocessors
- Description
IC MPU OMAP-L1X 456MHZ 361NFBGA
- key Attributes
-
Trust signals
Quality and trust signals
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ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for OMAPL138BZWT4 before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: OMAPL138BZWT4
- Package to verify: -
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped OMAPL138BZWT4 parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Memory Size
32kB
Product Parameter
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Product Parameter
Core Architecture
ARM
Product Parameter
UPs/UCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
Product Parameter
Core Processor
ARM926EJ-S
Product Parameter
Format
FLOATING POINT
| Parameter | Value |
|---|---|
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 32kB |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Silver/Copper (Sn/Ag/Cu) |
Core Architecture Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements. | ARM |
UPs/UCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | DIGITAL SIGNAL PROCESSOR, OTHER |
Core Processor Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs. | ARM926EJ-S |
Format Specifies the data format or package type of the component. This helps identify the physical or logical configuration, such as tape and reel, tray, or specific file format. Verify against the datasheet to ensure compatibility with your assembly process. | FLOATING POINT |
Low Power Mode Specifies the available low power modes for the component, such as sleep, standby, or shutdown. Compare modes to match your system's power budget and wake-up requirements. Verify supported modes and current consumption in the datasheet. | YES |
Number Of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 4 |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | 3 |
SATA Interface Indicates the SATA interface support on the component. Verify the SATA revision and port configuration against the datasheet to ensure compatibility with your storage devices and system design. | SATA 3Gbps (1) |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 40kB |
| Parameter | Value |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 16mm |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.8mm |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 3A991A2 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Copper, Silver, Tin |
Internal Bus Architecture Indicates the internal data bus structure of the component, such as Harvard or Von Neumann. This affects instruction throughput and memory access efficiency. Engineers should verify this against the datasheet when optimizing firmware for performance or power consumption. | MULTIPLE |
Number Of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | Cache, RAM, ROM |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.3V |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | 0°C~90°C TJ |
Display & Interface Controllers Specifies the type of controller IC used to drive displays or manage communication interfaces. Verify compatibility with your display panel or bus protocol. Compare power consumption, supported resolutions, and interface standards before selecting a part for your design. | LCD |
Ethernet Ethernet interface support on microcontrollers, processors, or modules. Specifies the presence and type of Ethernet connectivity (10/100/1000 Mbps, MAC/PHY). Critical for networked applications; verify speed and physical layer requirements in datasheet. | 10/100Mbps (1) |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Barrel Shifter Indicates the presence of a hardware circuit that can shift or rotate data bits by any number of positions in a single clock cycle. This is important for digital signal processing and arithmetic operations. Verify the shift range and performance in the datasheet. | NO |
RAM Controllers Supported RAM controller types for microprocessors and system-on-chip devices. Indicates which memory standards (DDR, LPDDR, etc.) are integrated. Essential for selecting a processor that matches your memory design and performance requirements. | SDRAM |
Graphics Acceleration Indicates whether the component integrates hardware acceleration for graphics processing. This is critical for embedded systems, SoCs, and display controllers. Verify the supported APIs and performance levels in the datasheet to ensure it meets your application's rendering requirements. | No |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1V |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 1.35V |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Other uPs/uCs/Peripheral ICs |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | OMAP-L1x |
USB Indicates the USB standard or version supported by the component, such as USB 2.0 or USB 3.2. Determines data transfer rates and power delivery capabilities. Verify compatibility with your host controller and cable. | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.35V |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 456MHz |
Co-Processors/DSP Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements. | Signal Processing; C674x, System Control; CP15 |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 361 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 361 |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 1.25V |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 361-LFBGA |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | OMAPL138 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 361 |
Security Features Hardware-level security features integrated into the component, such as secure boot, cryptographic acceleration, or tamper detection. Compare these capabilities when selecting devices for secure applications. Verify the specific security features and their implementation against the datasheet to ensure they meet your system's requirements. | Boot Security, Cryptography |
Additional Interfaces Specifies other communication or control interfaces beyond the primary ones. Helps engineers verify compatibility with system peripherals and protocols. Check the datasheet for exact interface types and electrical characteristics. | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | Ethernet, MMC, SATA, SD, UART, USB |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | OMAPL138BZWT4 |
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.31.0001 |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e1 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for OMAPL138BZWT4. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact OMAPL138BZWT4 ordering code, packaging, stock, datasheet, and replacement path.
What does OMAPL138BZWT4 mean?
OMAPL138BZWT4 is the exact ordering code listed for a Embedded - Microprocessors component from Texas Instruments. The current package reference is -, with listed context including IC MPU OMAP-L1X 456MHZ 361NFBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the OMAPL138BZWT4 ordering code?
Treat OMAPL138BZWT4 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is OMAPL138BZWT4 supplied in?
OMAPL138BZWT4 is currently listed with package reference - from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is OMAPL138BZWT4 currently available?
OMAPL138BZWT4 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (113088), available quantity (72668), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare OMAPL138BZWT4 alternatives?
A mapped alternative list is not currently published for OMAPL138BZWT4. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





