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MSC1213Y5PAGR Data Acquisition - ADCs/DACs - Special Purpose by Texas Instruments

MSC1213Y5PAGR is a Data Acquisition - ADCs/DACs - Special Purpose from Texas Instruments in TQFP packaging. It is commonly reviewed for IC 8051 PREC ADC/DAC 64-TQFP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MSC1213Y5PAGR Data Acquisition - ADCs/DACs - Special Purpose by Texas Instruments | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

MSC1213Y5PAGR

Internal code

TCE000055954

Package

TQFP

Manufacturer
Texas Instruments

Key specifications

Series

-

Min Quantity

1

Description

IC 8051 PREC ADC/DAC 64-TQFP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MSC1213Y5PAGR before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MSC1213Y5PAGR
  • Package to verify: TQFP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for MSC1213Y5PAGR from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.

GENERAL
The MSC1212-01 is a driver IC for VFD implemented in BiCMOS technology.
The circuit consists of a 48-bit shift register and a 48-bit latch; they control display data, which is output from the display drivers.Since a 64-pin plastic QFP package is used, the display unit size can be reduced.
FEATURES
• Logic supply voltage (VCC) : 4.5 to 5.5 V
• Driver supply voltage (VDISP) : 8 to 18 V
• Operating temperature range : –40 to +105°C
• Driver output current : IO2-1 = –6 mA (for only one driver on state) IO2-2 = –50 mA (total current for all drivers on state) IO2-3 = 0.2 mA
• Built-in 48-bit output Driver (with latch)
• Built-in 48-bit shift register
• Clock frequency : 0.5 MHz
• Package: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name: MSC1212-01GS-BK)

Technical parameters

Parameters

Compare grouped MSC1213Y5PAGR parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Parameter

    Terminal Finish

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Product Parameter

    Power Supplies

    3/5V

  • Product Parameter

    Supply Type

    Analog, Digital

  • Product Parameter

    RAM Size

    1.3kB

  • Product Parameter

    Sampling Rate

    1k

  • Product Parameter

    Supply Source Type

    Analog Digital

MSC1213Y5PAGR Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Nickel/Palladium/Gold (Ni/Pd/Au)
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

3/5V
Supply Type

Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections.

Analog, Digital
RAM Size

Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.

1.3kB
Sampling Rate

Indicates how many times per second the device captures an analog signal. Higher rates capture faster changes but increase data volume. Verify against your application's bandwidth needs and the datasheet's maximum rating.

1k
Supply Source Type

Defines whether the component is powered by a single, dual, or multiple supply rails, or by a specific source like a battery or regulator. This helps designers plan power distribution and avoid incorrect biasing. Check the datasheet for recommended supply configurations.

Analog Digital
Core Architecture

Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements.

8051
Power Consumption

Typical power consumption of the component under normal operating conditions. This is important for power budget calculations and thermal management. Check the datasheet for maximum ratings and test conditions to ensure your design stays within safe limits.

4mW
Bit Size

Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.

8
DMA Channels

Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features.

NO
Has ADC

Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements.

YES
PWM Channels

Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations.

YES
Number Of A/D Converters

Indicates how many analog-to-digital converters are integrated in the component. Compare this when selecting devices for multi-channel data acquisition or mixed-signal processing. Verify the exact number and channel configuration in the datasheet.

1
DAC Channels

Number of digital-to-analog converter channels integrated in the device. Compare this to the number of analog outputs you need in your system. Verify against the datasheet to ensure the DAC resolution and output drive capability match your application requirements.

YES
Number Of Channels

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

8
Number Of D/A Converters

Specifies how many digital-to-analog converter channels are integrated in the component. Engineers compare this to the number of analog output signals required in the system, and should verify the resolution and output range in the datasheet.

2
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

2.7V~5.25V
ROM Programmability

Indicates whether the read-only memory can be programmed or is factory-fixed. Buyers should verify if the device supports one-time or field programming, and check the datasheet for programming voltage and timing requirements.

FLASH
MSC1213Y5PAGR Product Attribute
ParameterValue
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~125°C
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

5V
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Texas
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

QUAD
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.5mm
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Microcontrollers
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

274.706879mg
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

64-TQFP
Sampling Rate

Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs.

1 ksps
Resolution

Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions.

3 B
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

14.8mA
Data Interface

Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design.

Serial, Parallel
Type

Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.

ADC and DAC: MCU Based
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Data Acquisition - ADCs/DACs - Special Purpose
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

Parallel, Serial
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

MSC1213Y5
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

64
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

64
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

64
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Address Bus Width

Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design.

16
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

40MHz
Number Of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

32
Number Of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

24
Conversion Rate

Indicates how many analog-to-digital or digital-to-analog conversions the device completes per second. Compare this rate with your system's sampling requirements to ensure real-time data acquisition. Verify the specified rate under the datasheet's operating conditions, as it may vary with clock frequency and supply voltage.

1 ksps
Settling Time

Settling time is the duration for an output to reach and stay within a specified accuracy band after a step change. Engineers compare this to ensure fast, stable response in control loops, data acquisition, and precision circuits. Verify against datasheet conditions.

8 μs
External Data Bus Width

Number of parallel data lines on the external bus. Determines data transfer rate and interface complexity. Important for microcontrollers, DSPs, and memory devices. Verify with datasheet to match your system's bus architecture and timing requirements.

8
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MSC1213Y5PAGR
MSC1213Y5PAGR Export Classifications & Environmental
ParameterValue
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e4
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

4 (72 Hours)
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99

Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MSC1213Y5PAGR. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MSC1213Y5PAGR ordering code, packaging, stock, datasheet, and replacement path.

What does MSC1213Y5PAGR mean?

MSC1213Y5PAGR is the exact ordering code listed for a Data Acquisition - ADCs/DACs - Special Purpose component from Texas Instruments. The current package reference is TQFP, with listed context including IC 8051 PREC ADC/DAC 64-TQFP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MSC1213Y5PAGR ordering code?

Treat MSC1213Y5PAGR as the full ordering code during RFQ and engineering review. Confirm the listed TQFP package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MSC1213Y5PAGR supplied in?

MSC1213Y5PAGR is currently listed with package reference TQFP from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MSC1213Y5PAGR currently available?

MSC1213Y5PAGR is currently marked with stock availability on this page. Before ordering, confirm the package (TQFP), listed stock (149261), available quantity (79809), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MSC1213Y5PAGR alternatives?

A mapped alternative list is not currently published for MSC1213Y5PAGR. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.