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SST49LF008A-33-4C-WHE Memory by Microchip Technology

SST49LF008A-33-4C-WHE is a Memory from Microchip Technology in manufacturer-listed packaging. It is commonly reviewed for IC FLASH 8M PARALLEL 32TSOP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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SST49LF008A-33-4C-WHE Memory by Microchip Technology | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

SST49LF008A-33-4C-WHE

Internal code

TCE000053301

Package

-

Key specifications

Series

SST49

Min Quantity

1

Sub Category
Memory
Description

IC FLASH 8M PARALLEL 32TSOP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for SST49LF008A-33-4C-WHE before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: SST49LF008A-33-4C-WHE
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped SST49LF008A-33-4C-WHE parameters from Microchip Technology, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Parameter

    Supply Voltage-Max (Vsup)

    3.6V

  • Product Parameter

    Terminal Finish

    Matte Tin (Sn) - annealed

  • Product Parameter

    Data Bus Width

    8b

  • Product Parameter

    Time At Peak Reflow Temperature (Max)

    40

  • Product Parameter

    Supply Voltage-Min (Vsup)

    3V

  • Product Parameter

    Supply Voltage

    3V~3.6V

SST49LF008A-33-4C-WHE Product Parameter
ParameterValue
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

3.6V
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Matte Tin (Sn) - annealed
Data Bus Width

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

8b
Time At Peak Reflow Temperature (Max)

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

40
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

3V
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

3V~3.6V
Programming Voltage

Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure.

3V
Integrated Cache

Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet.

8 Mb
Voltage - Supply (Vcc/Vdd)

Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.

8Mb 1M x 8
Number Of Serial I/Os

Indicates the total count of serial input/output lines available on the component. Compare this specification when selecting microcontrollers, FPGAs, or interface ICs to ensure sufficient connectivity for your communication peripherals. Verify against the datasheet pinout and alternate function mappings.

120ns
SST49LF008A-33-4C-WHE Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tray
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

7 Weeks
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.5mm
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2016
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

1.05mm
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Microchip Technology
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

Parallel, SPI, Serial
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

8.1mm
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

3.3V
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3.3V
Memory Type

Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.

Non-Volatile
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

32
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

32
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

32
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

12.5mm
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

12mA
Max Supply Current

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

12mA
Boot Block

Specifies the memory region reserved for boot code in microcontrollers, flash, or EEPROM devices. This block is protected to ensure reliable startup. Verify its size and protection features against the datasheet when selecting parts for firmware updates or secure boot applications.

TOP
Data Polling

Data polling is a method used in memory devices to verify that a write operation has completed. It involves reading a specific data bit until it matches the expected value. Engineers compare this feature to ensure reliable programming and to avoid premature read operations.

YES
Memory Interface

Specifies the protocol or bus standard used to connect the component to external memory. Common types include SPI, I2C, parallel, and DDR. Verify compatibility with your host controller and memory device to ensure proper communication and data transfer rates.

Parallel
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory
Sync/Async

Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.

Asynchronous
Toggle Bit

A status bit that toggles state to indicate a change in device condition, such as program completion or error. It is used for polling or interrupt generation. Engineers monitor this bit to track device status. Check the datasheet for its behavior and timing.

YES
Sector Size

Specifies the smallest erasable block size in memory devices. Compare sector sizes when selecting flash or EEPROM for firmware updates or data storage. Verify against the datasheet to ensure compatibility with your file system and wear-leveling requirements.

4K
Memory Format

Specifies the internal organization of the memory device, such as DRAM, SRAM, or Flash. This affects how data is accessed and stored. Verify the format against your application requirements and the datasheet to ensure compatibility with your system's memory controller.

FLASH
Word Size

Specifies the number of bits in a single data word for memory or processor components. Compare word sizes when selecting devices for data throughput and processing capability. Verify the exact word size in the datasheet to ensure compatibility with your system architecture.

8b
Write Cycle Time - Word, Page

Specifies the duration needed to program a single word or a page in non-volatile memory. Compare this timing when selecting EEPROM or flash devices for write-intensive applications. Verify against the datasheet to ensure your system meets the required write throughput.

20μs
Standby Current-Max

Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.

0.0001A
Clock Frequency

Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.

33MHz
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

32-TFSOP (0.488, 12.40mm Width)
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

SST49LF008A-33-4C-WHE
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

0°C~85°C TA
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

SST49
Memory Organization

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

1MX8
Number Of Sectors/Size

Specifies the number of sectors and their individual size for rotary switches or encoders. This attribute helps engineers determine the number of positions and the angular spacing between them. Verify against the datasheet to ensure compatibility with your control panel or circuit design.

256
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

SST49LF008A
Address Bus Width

Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design.

11b
SST49LF008A-33-4C-WHE Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

No SVHC
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

3 (168 Hours)
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

3A991.B.1.A

Datasheet preview

Datasheet PDF viewer

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Microchip Technology

SST49LF008A-33-4C-WHE

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for SST49LF008A-33-4C-WHE. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact SST49LF008A-33-4C-WHE ordering code, packaging, stock, datasheet, and replacement path.

What does SST49LF008A-33-4C-WHE mean?

SST49LF008A-33-4C-WHE is the exact ordering code listed for a Memory component from Microchip Technology. The current package reference is -, with listed context including IC FLASH 8M PARALLEL 32TSOP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the SST49LF008A-33-4C-WHE ordering code?

Treat SST49LF008A-33-4C-WHE as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Microchip Technology, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is SST49LF008A-33-4C-WHE supplied in?

SST49LF008A-33-4C-WHE is currently listed with package reference - from Microchip Technology. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is SST49LF008A-33-4C-WHE currently available?

SST49LF008A-33-4C-WHE is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (177632), available quantity (71872), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare SST49LF008A-33-4C-WHE alternatives?

A mapped alternative list is not currently published for SST49LF008A-33-4C-WHE. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.