
TLV5616IDGKR Data Acquisition - Digital to Analog Converters (DAC) by Texas Instruments
TLV5616IDGKR is a Data Acquisition - Digital to Analog Converters (DAC) from Texas Instruments in TSSOP packaging. It is commonly reviewed for IC 12 BIT 3US DAC S/O 8VSSOP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
TLV5616IDGKR
- Internal code
TCE000050356
- Package
TSSOP
- Manufacturer
- Texas Instruments
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Description
IC 12 BIT 3US DAC S/O 8VSSOP
- key Attributes
-
Trust signals
Quality and trust signals
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ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for TLV5616IDGKR before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: TLV5616IDGKR
- Package to verify: TSSOP
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for TLV5616IDGKR from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
105℃ Long Life, Low Impedance, Lead Free Reflow Soldering.◆
FEATURES
• Load Life 105℃ 5000 hours.
• Reflow soldering is available.
• Large can-size SMD.
• RoHS compliance.
Technical parameters
Parameters
Compare grouped TLV5616IDGKR parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Product Parameter
Power Supplies
3/5V
Product Parameter
Signal To Noise Ratio (SNR)
74 dB
Product Parameter
Supply Type
Single
Product Parameter
Differential Nonlinearity
1 LSB
Product Parameter
Special Feature
SPI
| Parameter | Value |
|---|---|
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Nickel/Palladium/Gold (Ni/Pd/Au) |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 3/5V |
Signal To Noise Ratio (SNR) The ratio of signal power to noise power, expressed in decibels. Higher SNR indicates better signal quality and less noise interference. Compare this value when selecting components for high-fidelity or precision applications, and verify it under specified test conditions. | 74 dB |
Supply Type Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections. | Single |
Differential Nonlinearity Indicates the maximum deviation of an actual code step from the ideal one-step size in an ADC or DAC. Compare this parameter across converters to assess linearity and potential distortion. Verify the specified value in the datasheet for your operating conditions. | 1 LSB |
Special Feature Highlight any distinctive capabilities or design aspects that set this component apart, such as integrated protection, low power consumption, or high-speed switching. Compare these features against your application requirements and verify them in the datasheet to ensure compatibility. | SPI |
Total Dose Total ionizing dose tolerance for radiation-hardened components. Indicates maximum cumulative radiation exposure before performance degrades. Critical for aerospace, nuclear, and medical applications. Verify against datasheet for mission-specific radiation requirements. | 970μm |
Number Of Lines Specifies the number of signal lines or channels supported by the component. Compare this value with your circuit's required data or power paths. Always verify against the datasheet to ensure the part matches your design's channel count and pinout. | String DAC |
Low-Bias Indicates that the amplifier is designed with low input bias current, minimizing errors in high-impedance circuits. This is critical for precision applications like sensor interfaces and integrators. Check the datasheet for typical and maximum bias current values to confirm suitability. | BINARY |
Power (Typ) @ Conditions Typical power dissipation under specified conditions | 0.0977% |
Spurious-Free Dynamic Range (SFDR) SFDR measures the difference between the fundamental signal and the largest spurious tone in the output spectrum. It indicates signal purity and linearity, crucial for high-performance ADCs, DACs, and RF systems. Compare values across devices and verify against datasheet conditions. | 70 dB |
Micropower Indicates the component is optimized for extremely low power consumption, often in microampere range. Ideal for battery-powered and energy-harvesting devices. Verify quiescent current and supply voltage range in the datasheet to ensure they meet your system's power budget. | SERIAL |
Analog Output Voltage-Max Specifies the highest voltage the analog output can deliver under specified conditions. Compare this limit with your input range and supply rails to avoid clipping or damage. Verify against the datasheet's absolute maximum ratings and recommended operating conditions for reliable performance. | 3.2V |
| Parameter | Value |
|---|---|
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Active |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Lifecycle Status Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime. | ACTIVE (Last Updated: 2 days ago) |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 6 Weeks |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C |
Output Type Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches. | Voltage - Buffered |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Other Converters |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | DUAL |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Data Acquisition - Digital to Analog Converters (DAC) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Converter Type Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part. | D/A CONVERTER |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3V |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.65mm |
Resolution Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions. | 1.5 B |
Integral Nonlinearity (INL) Indicates the maximum deviation of the ADC or DAC transfer function from an ideal straight line. Compare this value to ensure conversion accuracy for precision measurement and control applications. Verify against the datasheet's specified conditions, such as temperature and supply voltage. | 4 LSB |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 1.07mm |
Nominal Supply Current Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions. | 900μA |
Voltage - Supply, Analog Specifies the acceptable range for the analog supply voltage input. This rail powers internal analog circuitry and affects accuracy and noise performance. Ensure your power design stays within this range to maintain specified operation. | 2.7V~3.3V 5V |
Number Of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 2.7V |
Number Of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 12 |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 8 |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 8 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 8 |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 5.5V |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 3mm |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 3mm |
Differential Output Indicates if the output is differential, meaning it provides two complementary signals. This is important for noise immunity and long-distance transmission. Engineers select differential outputs for high-speed or precision applications and verify the output type in the datasheet. | No |
Number Of Converters Indicates how many independent converter channels or units are integrated in the component. Use this to match the required number of output rails or isolated sections in your power design, and verify channel-to-channel isolation and load sharing in the datasheet. | 1 |
Receiver Hysteresis This attribute specifies the voltage difference between the input thresholds of a receiver, ensuring noise immunity and stable switching. Engineers compare this value to match signal integrity requirements and to prevent false triggering in noisy environments. Always verify against the datasheet for the specific operating conditions. | External |
Settling Time Settling time is the duration for an output to reach and stay within a specified accuracy band after a step change. Engineers compare this to ensure fast, stable response in control loops, data acquisition, and precision circuits. Verify against datasheet conditions. | 20μs |
Digital Supply Voltage Specifies the voltage level required for the digital core or interface circuitry of the component. Verify this parameter against the datasheet to ensure compatibility with your system's power rails and avoid damage or malfunction. | 2.7V~3.3V 5V |
Weight Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity. | 23.303308mg |
Max Power Dissipation Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions. | 2.1mW |
Conversion Rate Indicates how many analog-to-digital or digital-to-analog conversions the device completes per second. Compare this rate with your system's sampling requirements to ensure real-time data acquisition. Verify the specified rate under the datasheet's operating conditions, as it may vary with clock frequency and supply voltage. | 102 ksps |
Sampling Rate Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs. | 102 ksps |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | TLV5616 |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | TLV5616IDGKR |
INL/DNL (LSB) Integral and differential nonlinearity in LSB units indicate how closely the ADC or DAC output matches an ideal transfer function. Compare these values to ensure conversion accuracy for your application. Verify against the datasheet for guaranteed limits. | ±1.9, ±0.5 |
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 1 (Unlimited) |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for TLV5616IDGKR. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact TLV5616IDGKR ordering code, packaging, stock, datasheet, and replacement path.
What does TLV5616IDGKR mean?
TLV5616IDGKR is the exact ordering code listed for a Data Acquisition - Digital to Analog Converters (DAC) component from Texas Instruments. The current package reference is TSSOP, with listed context including IC 12 BIT 3US DAC S/O 8VSSOP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the TLV5616IDGKR ordering code?
Treat TLV5616IDGKR as the full ordering code during RFQ and engineering review. Confirm the listed TSSOP package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is TLV5616IDGKR supplied in?
TLV5616IDGKR is currently listed with package reference TSSOP from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is TLV5616IDGKR currently available?
TLV5616IDGKR is currently marked with stock availability on this page. Before ordering, confirm the package (TSSOP), listed stock (62177), available quantity (92242), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare TLV5616IDGKR alternatives?
A mapped alternative list is not currently published for TLV5616IDGKR. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





