
DAC5670IGDJ Data Acquisition - Digital to Analog Converters (DAC) by Texas Instruments
DAC5670IGDJ is a Data Acquisition - Digital to Analog Converters (DAC) from Texas Instruments in BGA packaging. It is commonly reviewed for IC DAC 14BIT 2.4GSPS 252BGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
DAC5670IGDJ
- Internal code
TCE000050167
- Package
BGA
- Manufacturer
- Texas Instruments
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Description
IC DAC 14BIT 2.4GSPS 252BGA
- key Attributes
-
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Quality and trust signals
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ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for DAC5670IGDJ before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: DAC5670IGDJ
- Package to verify: BGA
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for DAC5670IGDJ from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
FEATURES
• Access Times of 90, 120, 150ns
• Packaging:
• 56 lead, Hermetic Ceramic, 0.520" CSOP (Package 207). Fits standard 56 SSOP footprint.
• 44 pin Ceramic SOJ (Package 102)
• 44 lead Ceramic Flatpack (Package 208)
• Sector Architecture
• 32 equal size sectors of 64KBytes each
• Any combination of sectors can be erased. Also supports full chip erase.
• Minimum 100,000 Write/Erase Cycles Minimum
• Organized as 2Mx16; User Configurable as 2 x 2Mx8
• Commercial, Industrial, and Military Temperature Ranges
• 5 Volt Read and Write. 5V ± 10% Supply.
• Low Power CMOS
• Data# Polling and Toggle Bit feature for detection of program or erase cycle completion.
• Supports reading or programming data to a sector not being erased.
• Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation.
• RESET# pin resets internal state machine to the read mode.
• Ready/Busy (RY#/BY#) output for detection of program or erase cycle completion.
• Multiple Ground Pins for Low Noise Operation
Technical parameters
Parameters
Compare grouped DAC5670IGDJ parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
JESD-609 Code
e0
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Export Classifications & Environmental
ECCN Code
EAR99
Product Parameter
Spurious-Free Dynamic Range (SFDR)
55 dB
Product Parameter
Terminal Finish
Tin/Lead (Sn/Pb)
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e0 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 4 (72 Hours) |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
| Parameter | Value |
|---|---|
Spurious-Free Dynamic Range (SFDR) SFDR measures the difference between the fundamental signal and the largest spurious tone in the output spectrum. It indicates signal purity and linearity, crucial for high-performance ADCs, DACs, and RF systems. Compare values across devices and verify against datasheet conditions. | 55 dB |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Lead (Sn/Pb) |
Signal To Noise Ratio (SNR) The ratio of signal power to noise power, expressed in decibels. Higher SNR indicates better signal quality and less noise interference. Compare this value when selecting components for high-fidelity or precision applications, and verify it under specified test conditions. | 70 dB |
Supply Type Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections. | Single |
Time At Peak Reflow Temperature (Max) Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly. | NOT SPECIFIED |
Special Feature Highlight any distinctive capabilities or design aspects that set this component apart, such as integrated protection, low power consumption, or high-speed switching. Compare these features against your application requirements and verify them in the datasheet to ensure compatibility. | Parallel |
Analog Output Voltage-Min Minimum voltage level that the analog output can provide under specified conditions. Important for matching input ranges of downstream circuits. Check the datasheet for load and supply dependencies to ensure the output meets your design requirements. | 2.5V |
Differential Nonlinearity Indicates the maximum deviation of an actual code step from the ideal one-step size in an ADC or DAC. Compare this parameter across converters to assess linearity and potential distortion. Verify the specified value in the datasheet for your operating conditions. | 1.75 LSB |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 650mA |
Power Consumption Typical power consumption of the component under normal operating conditions. This is important for power budget calculations and thermal management. Check the datasheet for maximum ratings and test conditions to ensure your design stays within safe limits. | 2W |
Power (Typ) @ Conditions Typical power dissipation under specified conditions | 0.0458% |
Number Of Lines Specifies the number of signal lines or channels supported by the component. Compare this value with your circuit's required data or power paths. Always verify against the datasheet to ensure the part matches your design's channel count and pinout. | Current Sink |
Total Dose Total ionizing dose tolerance for radiation-hardened components. Indicates maximum cumulative radiation exposure before performance degrades. Critical for aerospace, nuclear, and medical applications. Verify against datasheet for mission-specific radiation requirements. | 1.21mm |
Low-Bias Indicates that the amplifier is designed with low input bias current, minimizing errors in high-impedance circuits. This is critical for precision applications like sensor interfaces and integrators. Check the datasheet for typical and maximum bias current values to confirm suitability. | COMPLEMENTARY BINARY |
| Parameter | Value |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Other Converters |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Data Acquisition - Digital to Analog Converters (DAC) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Converter Type Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part. | D/A CONVERTER |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Resolution Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions. | 1.75 B |
Polarity Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation. | Unipolar |
Digital Supply Voltage Specifies the voltage level required for the digital core or interface circuitry of the component. Verify this parameter against the datasheet to ensure compatibility with your system's power rails and avoid damage or malfunction. | 3V~3.6V |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | LVDS, Parallel |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Copper, Silver, Tin |
Output Type Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches. | Current - Unbuffered |
Max Power Dissipation Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions. | 2.35W |
Number Of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 3.3V |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3.3V |
Number Of Converters Indicates how many independent converter channels or units are integrated in the component. Use this to match the required number of output rails or isolated sections in your power design, and verify channel-to-channel isolation and load sharing in the datasheet. | 1 |
Number Of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 14 |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 3.6V |
Voltage - Supply, Analog Specifies the acceptable range for the analog supply voltage input. This rail powers internal analog circuitry and affects accuracy and noise performance. Ensure your power design stays within this range to maintain specified operation. | 3V~3.6V |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 3V |
Receiver Hysteresis This attribute specifies the voltage difference between the input thresholds of a receiver, ensuring noise immunity and stable switching. Engineers compare this value to match signal integrity requirements and to prevent false triggering in noisy environments. Always verify against the datasheet for the specific operating conditions. | External, Internal |
Differential Output Indicates if the output is differential, meaning it provides two complementary signals. This is important for noise immunity and long-distance transmission. Engineers select differential outputs for high-speed or precision applications and verify the output type in the datasheet. | YES |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 17mm |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 17mm |
Conversion Rate Indicates how many analog-to-digital or digital-to-analog conversions the device completes per second. Compare this rate with your system's sampling requirements to ensure real-time data acquisition. Verify the specified rate under the datasheet's operating conditions, as it may vary with clock frequency and supply voltage. | 2.4 Gsps |
Sampling Rate Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs. | 2.4 Gsps |
Integral Nonlinearity (INL) Indicates the maximum deviation of the ADC or DAC transfer function from an ideal straight line. Compare this value to ensure conversion accuracy for precision measurement and control applications. Verify against the datasheet's specified conditions, such as temperature and supply voltage. | 7.5 LSB |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | DAC5670IGDJ |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | DAC5670 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 252 |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 252 |
Settling Time Settling time is the duration for an output to reach and stay within a specified accuracy band after a step change. Engineers compare this to ensure fast, stable response in control loops, data acquisition, and precision circuits. Verify against datasheet conditions. | 3.5ns (Typ) |
INL/DNL (LSB) Integral and differential nonlinearity in LSB units indicate how closely the ADC or DAC output matches an ideal transfer function. Compare these values to ensure conversion accuracy for your application. Verify against the datasheet for guaranteed limits. | ±1.5, ±0.8 |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 252-BGA |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 2.02mm |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 252 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for DAC5670IGDJ. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact DAC5670IGDJ ordering code, packaging, stock, datasheet, and replacement path.
What does DAC5670IGDJ mean?
DAC5670IGDJ is the exact ordering code listed for a Data Acquisition - Digital to Analog Converters (DAC) component from Texas Instruments. The current package reference is BGA, with listed context including IC DAC 14BIT 2.4GSPS 252BGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the DAC5670IGDJ ordering code?
Treat DAC5670IGDJ as the full ordering code during RFQ and engineering review. Confirm the listed BGA package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is DAC5670IGDJ supplied in?
DAC5670IGDJ is currently listed with package reference BGA from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is DAC5670IGDJ currently available?
DAC5670IGDJ is currently marked with stock availability on this page. Before ordering, confirm the package (BGA), listed stock (50585), available quantity (16387), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare DAC5670IGDJ alternatives?
A mapped alternative list is not currently published for DAC5670IGDJ. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





