
AM3892BCYG120 Embedded - Microprocessors by Texas Instruments
AM3892BCYG120 is a Embedded - Microprocessors from Texas Instruments in manufacturer-listed packaging. It is commonly reviewed for IC MPU SITARA 1.2GHZ 1031FCBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Pictures are for reference only. Please contact us for the latest pictures.

- 365-Day GuaranteeAfter-sales support helps buyers handle quality questions with a clearer return and review window.
- Ships within 24-48 HoursAvailable items can move quickly once the quote, quantity, and delivery details are confirmed.
- 100% Anti-Counterfeit TestedParts are checked through authenticity-focused handling and inspection before shipment.
Key specifications
- Part Number
AM3892BCYG120
- Internal code
TCE000049722
- Package
-
- Manufacturer
- Texas Instruments
Key specifications
- Series
Sitara™
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Embedded - Microprocessors
- Description
IC MPU SITARA 1.2GHZ 1031FCBGA
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for AM3892BCYG120 before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: AM3892BCYG120
- Package to verify: -
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped AM3892BCYG120 parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
HTSUS
8542.31.0001
Export Classifications & Environmental
JESD-609 Code
e1
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Export Classifications & Environmental
ECCN Code
3A991.A.2
Product Parameter
Data Bus Width
16b
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.31.0001 |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e1 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 4 (72 Hours) |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | 3A991.A.2 |
| Parameter | Value |
|---|---|
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 16b |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Silver/Copper (Sn/Ag/Cu) |
Core Architecture Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements. | ARM |
Core Processor Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs. | ARM® Cortex®-A8 |
UPs/UCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | MICROPROCESSOR, RISC |
Format Specifies the data format or package type of the component. This helps identify the physical or logical configuration, such as tape and reel, tray, or specific file format. Verify against the datasheet to ensure compatibility with your assembly process. | FLOATING POINT |
Low Power Mode Specifies the available low power modes for the component, such as sleep, standby, or shutdown. Compare modes to match your system's power budget and wake-up requirements. Verify supported modes and current consumption in the datasheet. | YES |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 32 |
Number Of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 7 |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
Integrated Cache Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet. | YES |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 64kB |
SATA Interface Indicates the SATA interface support on the component. Verify the SATA revision and port configuration against the datasheet to ensure compatibility with your storage devices and system design. | SATA 3Gbps (1) |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 1V |
Speed Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed. | 1200 MHz |
| Parameter | Value |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 3.31mm |
| Parameter | Value |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 25mm |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.65mm |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8542.31.00.01 |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 245 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Copper, Silver, Tin |
Co-Processors/DSP Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements. | Multimedia; NEON™ SIMD |
Number Of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.3V |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microprocessors |
Ethernet Ethernet interface support on microcontrollers, processors, or modules. Specifies the presence and type of Ethernet connectivity (10/100/1000 Mbps, MAC/PHY). Critical for networked applications; verify speed and physical layer requirements in datasheet. | 10/100/1000Mbps (2) |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Sitara™ |
USB Indicates the USB standard or version supported by the component, such as USB 2.0 or USB 3.2. Determines data transfer rates and power delivery capabilities. Verify compatibility with your host controller and cable. | USB 2.0 + PHY (2) |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 16 |
Number Of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 64 |
Graphics Acceleration Indicates whether the component integrates hardware acceleration for graphics processing. This is critical for embedded systems, SoCs, and display controllers. Verify the supported APIs and performance levels in the datasheet to ensure it meets your application's rendering requirements. | Yes |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 5A002A1 TI |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1V |
Display & Interface Controllers Specifies the type of controller IC used to drive displays or manage communication interfaces. Verify compatibility with your display panel or bus protocol. Compare power consumption, supported resolutions, and interface standards before selecting a part for your design. | HDMI, HDVPSS |
RAM Controllers Supported RAM controller types for microprocessors and system-on-chip devices. Indicates which memory standards (DDR, LPDDR, etc.) are integrated. Essential for selecting a processor that matches your memory design and performance requirements. | DDR2, DDR3 |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | 0°C~95°C TJ |
Additional Interfaces Specifies other communication or control interfaces beyond the primary ones. Helps engineers verify compatibility with system peripherals and protocols. Check the datasheet for exact interface types and electrical characteristics. | I2C, McASP, McBSP, SPI, SD/SDIO, UART |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 1031 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | AM3892 |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 1031-BFBGA, FCBGA |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 1.2GHz |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 1.05V |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.05V |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 950mV |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | I2C, SPI, Serial, UART |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | AM3892BCYG120 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for AM3892BCYG120. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
Explore related Embedded - Microprocessors products to compare fit, stock status, datasheets, and sourcing options.
Common questions
Product FAQ
Targeted answers for buyers verifying the exact AM3892BCYG120 ordering code, packaging, stock, datasheet, and replacement path.
What does AM3892BCYG120 mean?
AM3892BCYG120 is the exact ordering code listed for a Embedded - Microprocessors component from Texas Instruments. The current package reference is -, with listed context including IC MPU SITARA 1.2GHZ 1031FCBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the AM3892BCYG120 ordering code?
Treat AM3892BCYG120 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is AM3892BCYG120 supplied in?
AM3892BCYG120 is currently listed with package reference - from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is AM3892BCYG120 currently available?
AM3892BCYG120 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (88137), available quantity (70388), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare AM3892BCYG120 alternatives?
A mapped alternative list is not currently published for AM3892BCYG120. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





