TrustCompo Website Logo | TrustCompo

ISO1H802G PMIC - Power Distribution Switches, Load Drivers by Infineon Technologies

ISO1H802G is a PMIC - Power Distribution Switches, Load Drivers from Infineon Technologies in manufacturer-listed packaging. It is commonly reviewed for IC SWITCH HISIDE 8CH DSO-36. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

Pictures are for reference only. Please contact us for the latest pictures.

ISO1H802G PMIC - Power Distribution Switches, Load Drivers by Infineon Technologies | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
  • 365-Day GuaranteeAfter-sales support helps buyers handle quality questions with a clearer return and review window.
  • Ships within 24-48 HoursAvailable items can move quickly once the quote, quantity, and delivery details are confirmed.
  • 100% Anti-Counterfeit TestedParts are checked through authenticity-focused handling and inspection before shipment.

Key specifications

Part Number

ISO1H802G

Internal code

TCE000044529

Package

-

Key specifications

Series

ISOFACE™

Min Quantity

1

Description

IC SWITCH HISIDE 8CH DSO-36

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for ISO1H802G before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: ISO1H802G
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for ISO1H802G from Infineon Technologies, including product identity, application fit, package notes, and purchasing considerations.


The COMLINEAR CLC2011 (dual) and CLC4011 (quad) are ultra-low cost, low power, voltage feedback amplifers. At 2.7V, the CLCx011 family uses only 136μA of supply current per amplifer and are designed to operate from a supply range of 2.5V to 5.5V (±1.25 to ±2.75).
The input voltage range exceeds the negative and positive rails.
The CLCx011 family of amplifers offer high bipolar performance at a low CMOS prices.
They offer superior dynamic performance with 4.9MHz small signal bandwidths and 5.3V/μs slew rates.
The combination of low power, high bandwidth, and rail-to-rail performance make the CLCx011 amplifers well suited for battery-powered communication/computing systems.
FEATURES
• 136μA supply current
• 4.9MHz bandwidth
• Output swings to within 20mV of either rail
• Input voltage range exceeds the rail by >250mV
• 5.3V/μs slew rate
• 21nV/√Hz input voltage noise
• 16mA output current
• Fully specifed at 2.7V and 5V suppliesAPPLICATIONS
• Portable/battery-powered applications
• PCMCIA, USB
• Mobile communications, cell phones, pagers
• ADC buffer
• Active flters
• Portable test instruments
• Notebooks and PDA’s
• Signal conditioning
• Medical Equipment
• Portable medical instrumentation

Technical parameters

Parameters

Compare grouped ISO1H802G parameters from Infineon Technologies, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Mounting Type

    Surface Mount

  • Product Attribute

    Factory Lead Time

    12 Weeks

  • Product Attribute

    Published

    1999

  • Product Attribute

    Packaging

    Tape & Reel (TR)

ISO1H802G Product Attribute
ParameterValue
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

12 Weeks
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

1999
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

5V
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.65mm
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Infineon Technologies
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - Power Distribution Switches, Load Drivers
Switch Type

Specifies the mechanical construction or actuation method of the switch, such as toggle, pushbutton, or slide. This determines how the switch is operated and its suitability for your application. Verify the exact type against the datasheet to ensure proper fit and function.

Relay, Solenoid Driver
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Peripheral Drivers
Feature

This attribute highlights special characteristics or functions of the component, such as built-in protection, mounting style, or unique performance traits. Engineers compare these features to match specific application requirements. Always verify against the datasheet for complete specifications.

Auto Restart
Resistance

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

150mOhm
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

40
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

SPI
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

38
Output Type

Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.

N-Channel
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

4.5mA
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

8
Max Supply Current

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

4.5mA
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

36
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

36
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

3.3W
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

11mm
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

15.9mm
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

36-BSSOP (0.433, 11.00mm Width) Exposed Pad
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

ISOFACE™
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-25°C~125°C TJ
Turn On Time

Time required for the device to transition from off state to fully on state. This parameter is critical for timing analysis in power supplies, drivers, and switching circuits. Verify this value against your system's timing budget and switching frequency requirements.

120 µs
Driver Number Of Bits

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

8
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

ISO1H802
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

ISO1H802G
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

625mA
ISO1H802G Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

RoHS Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
JESD-30 Code

JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.

R-PDSO-G36
ISO1H802G Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

MATTE TIN
Output Configuration

Specifies the topology of the output stage, such as push-pull, open collector, or half-bridge. This determines how the device drives loads and interfaces with external circuitry. Verify against the datasheet to ensure compatibility with your application's requirements.

High Side
Built-In Protections

Indicates protection features integrated into the component, such as overcurrent, overvoltage, or thermal shutdown. These safeguards help prevent damage during fault conditions. Verify which protections are included and their thresholds in the datasheet to ensure they meet your application's safety requirements.

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

5.5V
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

4.5V
Voltage - Supply (Vcc/Vdd)

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

4.5V~5.5V
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Current Limiting (Fixed), Over Temperature, Over Voltage
Rds On (Typ)

Typical drain-source on-resistance for MOSFETs. Lower values reduce conduction losses and heat. Compare this parameter when selecting power switches. Verify with datasheet under specified gate voltage and temperature.

150m Ω
Supply Voltage 1 - Max

Specifies the highest allowable voltage for the first power supply input. Exceeding this limit can damage the component. Engineers compare this value with the operating range to ensure reliable performance. Always verify against the datasheet for absolute maximum ratings.

30V
Supply Voltage1-Min

Minimum supply voltage required for the first power supply pin to ensure proper operation of the IC. Operating below this level may cause malfunction or failure. Check the datasheet for recommended operating conditions and ensure your power design meets this threshold.

15V
Turn Off Time

Time required for the device to transition from the on state to the off state. Critical for switching applications, power converters, and drivers. Verify against the datasheet to ensure it meets your timing requirements.

170 µs
Output Current Flow Direction

Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.

SINK
Voltage - Load

Specifies the voltage supplied to the load under normal operating conditions. Compare this value with your system's power supply and load requirements to ensure compatibility. Verify against the datasheet for exact tolerances and operating ranges.

15V~30V
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

515/30V
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

2.2A
ISO1H802G Package Parameter
ParameterValue
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

3.5mm

Datasheet preview

Datasheet PDF viewer

Preview the ISO1H802G datasheet from Infineon Technologies to check package, electrical characteristics, application notes, and document evidence before RFQ.

Infineon Technologies

ISO1H802G

Page 1 of 0
/ —
Search within the PDF viewer.Try
Loading PDF viewer...

Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for ISO1H802G. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact ISO1H802G ordering code, packaging, stock, datasheet, and replacement path.

What does ISO1H802G mean?

ISO1H802G is the exact ordering code listed for a PMIC - Power Distribution Switches, Load Drivers component from Infineon Technologies. The current package reference is -, with listed context including IC SWITCH HISIDE 8CH DSO-36. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the ISO1H802G ordering code?

Treat ISO1H802G as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Infineon Technologies, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is ISO1H802G supplied in?

ISO1H802G is currently listed with package reference - from Infineon Technologies. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is ISO1H802G currently available?

ISO1H802G is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (162897), available quantity (19473), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare ISO1H802G alternatives?

A mapped alternative list is not currently published for ISO1H802G. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.