
ADS58B18IRGZR Data Acquisition - Analog to Digital Converters (ADC) by Texas Instruments
ADS58B18IRGZR is a Data Acquisition - Analog to Digital Converters (ADC) from Texas Instruments in manufacturer-listed packaging. It is commonly reviewed for IC ADC 11BIT 200MSPS 48VQFN. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
ADS58B18IRGZR
- Internal code
TCE000044235
- Package
-
- Manufacturer
- Texas Instruments
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Description
IC ADC 11BIT 200MSPS 48VQFN
- key Attributes
-
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Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
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- 1
Confirm MPN
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- 2
Check stock and price
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- 3
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- 4
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Part confirmation
- Exact MPN confirmed: ADS58B18IRGZR
- Package to verify: -
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Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for ADS58B18IRGZR from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
The ADS58B18IRGZR is a high-performance analog-to-digital converter (ADC) manufactured by Texas Instruments. This device is designed for applications requiring high-speed data conversion, such as communications, instrumentation, and medical imaging.
Key Features:
- Resolution: The ADS58B18IRGZR offers a 16-bit resolution, which allows for precise representation of analog signals in digital form. This high resolution is crucial for applications where signal fidelity is paramount.
- Sampling Rate: It supports a maximum sampling rate of 1.0 GSPS (giga-samples per second), enabling the capture of fast-changing signals with minimal distortion. This high sampling rate is particularly beneficial in wideband applications.
- Input Bandwidth: The device features a wide input bandwidth, accommodating signals up to 1 GHz. This makes it suitable for high-frequency applications, including RF and microwave systems.
- Dynamic Range: The ADS58B18IRGZR boasts an impressive dynamic range, which is essential for distinguishing between small and large signals in the presence of noise. This characteristic is vital for maintaining signal integrity in complex environments.
- Power Consumption: The ADC is designed to be power-efficient, making it suitable for battery-operated devices and systems where thermal management is a concern. It typically operates at a supply voltage of 1.8V, which contributes to its low power consumption.
- Interface: The device features a high-speed serial interface, allowing for easy integration with digital signal processors (DSPs) and field-programmable gate arrays (FPGAs). This interface facilitates the transfer of digitized data to downstream processing units.
- Package Type: The ADS58B18IRGZR is housed in a compact, thermally efficient package, which aids in managing heat dissipation and allows for easier integration into various circuit designs.
- Applications: This ADC is ideal for a range of applications, including:
- Wireless communication systems (e.g., 5G)
- Medical imaging equipment (e.g., ultrasound)
- Test and measurement devices
- Radar and electronic warfare systems
Performance Characteristics:
- Signal-to-Noise Ratio (SNR): The device typically exhibits a high SNR, which is critical for ensuring that the digital representation of the analog signal is as accurate as possible.
- Total Harmonic Distortion (THD): The ADS58B18IRGZR maintains low THD levels, ensuring that the output signal remains clean and free from unwanted harmonics.
Conclusion:
The ADS58B18IRGZR from Texas Instruments is a robust and versatile ADC that meets the demands of high-speed, high-resolution applications. Its combination of performance, efficiency, and ease of integration makes it a preferred choice for engineers and designers working in advanced electronic systems.
Technical parameters
Parameters
Compare grouped ADS58B18IRGZR parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Sample And Hold / Track And Hold
SAMPLE
Product Parameter
Configuration
S/H-ADC
Product Parameter
Input Type
Differential
Product Parameter
Output Format
PARALLEL, WORD
Product Parameter
Supply Type
Analog, Digital
Product Parameter
Output Bit Code
OFFSET BINARY, 2'S COMPLEMENT BINARY
| Parameter | Value |
|---|---|
Sample And Hold / Track And Hold Specifies the sampling technique in an ADC, affecting how the analog input is captured and held during conversion. Engineers compare this to ensure the ADC meets the required signal acquisition speed and accuracy for their application. | SAMPLE |
Configuration Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application. | S/H-ADC |
Input Type Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance. | Differential |
Output Format Specifies the electrical or digital format of the output signal, such as analog voltage, current loop, or digital protocol. Engineers compare this to ensure compatibility with downstream circuitry or controllers. Verify the exact format and levels in the datasheet before integration. | PARALLEL, WORD |
Supply Type Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections. | Analog, Digital |
Output Bit Code Specifies the binary representation of the digital output signal. This code defines how the device encodes its output state. Engineers compare this to the datasheet to ensure compatibility with the receiving logic and to verify correct decoding of the output data. | OFFSET BINARY, 2'S COMPLEMENT BINARY |
Sampling Rate Indicates how many times per second the device captures an analog signal. Higher rates capture faster changes but increase data volume. Verify against your application's bandwidth needs and the datasheet's maximum rating. | 200M |
Number Of Analog Input Channels Indicates how many analog input channels the device supports. Compare this with your system's sensor or signal requirements. Verify against the datasheet to ensure the device has enough inputs for your application and that input voltage ranges match your signals. | 1 |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 250mA |
Power Consumption Typical power consumption of the component under normal operating conditions. This is important for power budget calculations and thermal management. Check the datasheet for maximum ratings and test conditions to ensure your design stays within safe limits. | 310mW |
| Parameter | Value |
|---|---|
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Active |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Lifecycle Status Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime. | ACTIVE (Last Updated: 5 days ago) |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 6 Weeks |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Data Acquisition - Analog to Digital Converters (ADC) |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Analog to Digital Converters |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | QUAD |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.5mm |
Thickness Thickness of the component, a critical dimension for PCB clearance, enclosure fit, and thermal performance. This measurement is especially important for capacitors, inductors, and connectors. Ensure the thickness meets your design constraints and does not interfere with adjacent components. Check the datasheet for tolerance and recommended mounting height. | 900μm |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 48-VFQFN Exposed Pad |
Architecture Internal design or topology of the component, such as the arrangement of internal circuits or blocks. This affects performance, power consumption, and functionality. Engineers compare architectures to match application requirements and verify compatibility with the datasheet. | Pipelined |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | NO LEAD |
Integral Nonlinearity (INL) Indicates the maximum deviation of the ADC or DAC transfer function from an ideal straight line. Compare this value to ensure conversion accuracy for precision measurement and control applications. Verify against the datasheet's specified conditions, such as temperature and supply voltage. | 2.5 LSB |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | LVDS, Parallel |
Digital Supply Voltage Specifies the voltage level required for the digital core or interface circuitry of the component. Verify this parameter against the datasheet to ensure compatibility with your system's power rails and avoid damage or malfunction. | 1.7V~1.9V |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.9V |
Data Interface Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design. | LVDS - Parallel, Parallel |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 3A991C1 |
Resolution Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions. | 1.375 B |
Power Dissipation Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions. | 260mW |
Sampling Rate Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs. | 200 Msps |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Gold |
Number Of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Reference Type Describes the internal or external voltage reference architecture, such as bandgap, shunt, or series. This affects temperature stability and initial accuracy. Choose a reference type that meets your precision and drift requirements for the application. | Internal |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Reflow Temperature-Max (S) Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions. | NOT SPECIFIED |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 1mm |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 7mm |
Number Of Converters Indicates how many independent converter channels or units are integrated in the component. Use this to match the required number of output rails or isolated sections in your power design, and verify channel-to-channel isolation and load sharing in the datasheet. | 1 |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1.8V |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 1.7V |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 1.8V |
Voltage - Supply, Analog Specifies the acceptable range for the analog supply voltage input. This rail powers internal analog circuitry and affects accuracy and noise performance. Ensure your power design stays within this range to maintain specified operation. | 1.7V~1.9V |
Number Of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 11 |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 7mm |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 48 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 48 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 48 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | ADS58B18 |
Converter Type Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part. | ADC, ONE BIT COMPARATOR |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | ADS58B18IRGZR |
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.39.0001 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for ADS58B18IRGZR. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact ADS58B18IRGZR ordering code, packaging, stock, datasheet, and replacement path.
What does ADS58B18IRGZR mean?
ADS58B18IRGZR is the exact ordering code listed for a Data Acquisition - Analog to Digital Converters (ADC) component from Texas Instruments. The current package reference is -, with listed context including IC ADC 11BIT 200MSPS 48VQFN. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the ADS58B18IRGZR ordering code?
Treat ADS58B18IRGZR as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is ADS58B18IRGZR supplied in?
ADS58B18IRGZR is currently listed with package reference - from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is ADS58B18IRGZR currently available?
ADS58B18IRGZR is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (16034), available quantity (95417), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare ADS58B18IRGZR alternatives?
A mapped alternative list is not currently published for ADS58B18IRGZR. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





