PSMN4R5-60YS Power MOSFETs by Nexperia

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Specifies the semiconductor technology used in the transistor, such as BJT, MOSFET, or IGBT. This determines the device's switching characteristics, drive requirements, and application suitability. Verify the exact type against the datasheet to ensure compatibility with your circuit design.

Select the package family that groups similar physical outlines, such as DIP, SOP, or BGA. This helps narrow down components by mounting style and footprint. Verify the exact package code in the datasheet to ensure compatibility with your PCB layout and assembly process.

Maximum voltage that can be applied between drain and source terminals of a MOSFET without breakdown. Critical for power switching circuits to prevent overvoltage damage. Verify this rating exceeds your maximum operating voltage with adequate margin, considering transients and spikes.

Maximum on-state resistance between drain and source when the MOSFET is fully enhanced. Lower values reduce conduction losses and heat generation. Compare this parameter for efficiency in power supplies and motor drivers. Check the datasheet for variation with gate voltage and temperature.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.