Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samples5-1571552-2 Sockets for ICs, Transistors by TE Connectivity
5-1571552-2 is a Sockets for ICs, Transistors model from TE Connectivity, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Connectors, Interconnects / Sockets for ICs, Transistors product path. Known package information currently points to DIP under the TE Connectivity brand listing. CONN IC DIP SOCKET 40POS GOLD. TrustCompo combines the available model, brand, hierarchy, and specification details around 5-1571552-2 so buyers can move faster from review to quotation.
RoHS
Datasheet
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
800
Min Quantity
1
Category
Connectors, InterconnectsSub Category
Sockets for ICs, TransistorsDescription
CONN IC DIP SOCKET 40POS GOLD
key Attributes
-
Datasheet
View 5-1571552-2 DatasheetTechnical document
Open The Official Datasheet
Review the latest datasheet for 5-1571552-2 from TE Connectivity in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Product overview
Overview
CONN IC DIP SOCKET 40POS GOLD
Fast scan
Popular Specs Surfaced First
Export Classifications & Environmental
JESD-609 Code
e3
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Export Classifications & Environmental
RoHS Status
RoHS Compliant
Export Classifications & Environmental
HTSUS
8536.69.4040
Export Classifications & Environmental
ECCN Code
EAR99
Product Attribute
Part Status
Active
JESD-609 Code
e3
Moisture Sensitivity Level (MSL)
1 (Unlimited)
RoHS Status
RoHS Compliant
HTSUS
8536.69.4040
REACH SVHC
Unknown
ECCN Code
EAR99
Part Status
Active
Contact Finish - Mating
Gold
Manufacturer
TE Connectivity
Flammability Rating
UL94 V-0
Number Of Rows
2
Categories
Connectors, Interconnects
PCB Contact Pattern
RECTANGULAR
Mounting Type
Through Hole
ELV
Compliant
REACH Status
REACH Unaffected
Circuit Application
Signal
ECCN
EAR99
Operating Temperature
-55°C~105°C
Pitch - Mating
0.100 2.54mm
Lead Free
Lead Free
Contact Finish - Post
Tin-Lead
Current Rating
3A
Packaging
Tube
Contact Plating
Gold, Tin
Mating Contact Pitch
0.1 inch
Insulation Resistance
5GOhm
Dielectric Withstanding Voltage
1000VAC V
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Resistance
10mOhm
Housing Material
Polyester
Published
2006
Contact Material
Copper
Factory Lead Time
13 Weeks
Number Of Positions
40
Length
50.8mm
Additional Feature
STANDARD: UL 94V-0
Color
Black
Radiation Hardening
No
Pbfree Code
yes
Mount
Through Hole
Terminal Pitch
2.54mm
Material Flammability Rating
UL94 V-0
Termination
Solder
Contact Current Rating
3A
Lead Length
3.175mm
Orientation
Straight
Gender
Female
Body Material
Thermoplastic
Body Breadth
0.7 inch
Number Of Contacts
40
Width
4.57mm
Insulation Material
Polychlorinated
Sub-Categories
Sockets for ICs, Transistors
Contact Material - Mating
Copper Alloy
Type
DIP, 0.6 (15.24mm) Row Spacing
Series
800
Pitch - Post
0.100 2.54mm
Depth
17.78mm
Manufacturer'S Part No.
5-1571552-2
Contact Material - Post
Copper Alloy
Connector Type
Pin
Feature
Open Frame
Plating Thickness
508 nm
Contact Finish Thickness - Mating
20.0μin 0.51μm
Row Spacing
15.24 mm
Number Of Positions Or Pins (Grid)
40 (2 x 20)
Termination Post Length
0.125 3.18mm
Common questions
Product FAQ
Quick answers for buyers reviewing 5-1571552-2, stock, documentation, and sourcing steps.
What is 5-1571552-2?
5-1571552-2 is a Sockets for ICs, Transistors component from TE Connectivity. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for 5-1571552-2?
5-1571552-2 is listed with package reference DIP. The current product description is CONN IC DIP SOCKET 40POS GOLD, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is 5-1571552-2 available in stock?
This page currently shows 168323 units in stock and 98864 units available for 5-1571552-2. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for 5-1571552-2?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for 5-1571552-2 by TE Connectivity. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for 5-1571552-2?
Yes. This page links to the datasheet for 5-1571552-2 by TE Connectivity, so engineers and buyers can review package, ratings, and application details before purchase.
How should buyers verify 5-1571552-2 before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for 5-1571552-2 before approving the order.
Sockets for ICs, Transistors
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around 5-1571552-2, Sockets for ICs, Transistors, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC