GD32F130C6T6 Embedded - Microcontrollers by GigaDevice
GD32F130C6T6 is a Embedded - Microcontrollers from GigaDevice in LQFP-48 packaging. It is commonly reviewed for 32-bit Cortex-M3 MCU, 32KB Flash, 4KB SRAM, LQFP-48. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for GD32F130C6T6 before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: GD32F130C6T6
Package to verify: LQFP-48
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for GD32F130C6T6 from GigaDevice, including product identity, application fit, package notes, and purchasing considerations.
GD32F130C6T6 is a value-oriented GigaDevice Arm Cortex-M3 microcontroller running at up to 48 MHz with 32KB Flash and 4KB SRAM in an LQFP-48 package. It integrates ADC, timer, SPI, I2C, and USART resources for cost-sensitive embedded control designs and is often reviewed as a migration candidate for entry-level STM32F030-class applications. Confirm peripheral allocation, flash size, package code, and firmware timing before final approval.
Technical parameters
Parameters
Compare grouped GD32F130C6T6 parameters from GigaDevice, including package, series, key attributes, and technical values used for engineering and sourcing review.
Contact Basics
Operating Voltage
2.6V to 3.6V
Procurement Checks
Source Basis
Official GigaDevice product selector page reviewed 2026-06-03; local quote history reviewed in sibling repos
Product Parameter
Core Material
ARM Cortex-M3
Product Parameter
Flash Memory Size
32KB
Product Parameter
Max Speed
48 MHz
Product Parameter
SRAM Size
4KB
GD32F130C6T6 Contact Basics
Parameter
Value
Operating Voltage
Specifies the voltage range within which the component reliably functions. Compare this with your circuit's supply voltage to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and derating conditions.
2.6V to 3.6V
GD32F130C6T6 Procurement Checks
Parameter
Value
Source Basis
Indicates whether the component is original, aftermarket, or from another sourcing category. Buyers should verify this attribute to ensure supply chain authenticity and avoid counterfeit parts. Always cross-check with the datasheet and supplier documentation.
Official GigaDevice product selector page reviewed 2026-06-03; local quote history reviewed in sibling repos
GD32F130C6T6 Product Parameter
Parameter
Value
Core Material
Material used for the magnetic core in inductors, transformers, or ferrite beads. Affects permeability, saturation current, and frequency characteristics. Choose the right core material for your application's operating frequency and power level to optimize efficiency and avoid saturation.
ARM Cortex-M3
Flash Memory Size
Storage capacity of the integrated flash memory in microcontrollers, memory chips, or modules. Determines how much firmware or data can be stored. Ensure sufficient size for your application code and future updates. Check the datasheet for endurance and retention specifications.
32KB
Max Speed
Specifies the highest rotational or operational speed the component can sustain reliably. Compare this value with your application's required speed to ensure safe operation. Always verify against the datasheet's absolute maximum ratings and derating curves.
48 MHz
SRAM Size
Specifies the static random-access memory capacity available on the component. Compare this value when selecting microcontrollers, DSPs, or SoCs for applications requiring buffering or data storage. Always verify against the datasheet for exact memory organization and availability.
4KB
Supported Interfaces
Communication protocols or buses that the component supports, such as I2C, SPI, UART, USB, or Ethernet. Essential for integration with microcontrollers and system design. Verify compatibility with your host controller and required data rates.
USART, I2C, SPI, 12-bit ADC
GD32F130C6T6 Package Parameter
Parameter
Value
GPIO
Number of general-purpose input/output pins available on the component. Compare this count to your design's requirements for interfacing with peripherals, sensors, or LEDs. Verify the exact pin functions and electrical characteristics in the datasheet.
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
RoHS
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
Confirm before export
GD32F130C6T6 Product Attribute
Parameter
Value
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C to 85°C
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
LQFP-48
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
Confirm before export
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
GigaDevice
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
GD32F130
Manufacturer Part Number
Unique alphanumeric identifier assigned by the original manufacturer to specify a particular component version. Use this number to cross-reference datasheets, verify exact specifications, and ensure compatibility with your design. Always confirm it matches the part you intend to order.
GD32F130C6T6
Datasheet preview
Datasheet PDF viewer
Preview the GD32F130C6T6 datasheet from GigaDevice to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for GD32F130C6T6. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Targeted answers for buyers verifying the exact GD32F130C6T6 ordering code, packaging, stock, datasheet, and replacement path.
What does GD32F130C6T6 mean?
GD32F130C6T6 is the exact ordering code listed for a Embedded - Microcontrollers component from GigaDevice. The current package reference is LQFP-48, with listed context including 32-bit Cortex-M3 MCU, 32KB Flash, 4KB SRAM, LQFP-48.. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the GD32F130C6T6 ordering code?
Treat GD32F130C6T6 as the full ordering code during RFQ and engineering review. Confirm the listed LQFP-48 package, manufacturer documentation from GigaDevice, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is GD32F130C6T6 supplied in?
GD32F130C6T6 is currently listed with package reference LQFP-48 from GigaDevice. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is GD32F130C6T6 currently available?
GD32F130C6T6 is currently marked with stock availability on this page. Before ordering, confirm the package (LQFP-48), listed stock (101528), available quantity (88980), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare GD32F130C6T6 alternatives?
A mapped alternative list is not currently published for GD32F130C6T6. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.