NX138AK Small Signal MOSFETs by Nexperia

Lifecycle status of the product, such as active, obsolete, or end-of-life. This affects long-term availability and design reliability. For production, choose active products to ensure supply continuity. Check the datasheet or manufacturer for lifecycle details.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Typical input capacitance of a MOSFET, measured in picofarads. It affects gate drive requirements and switching speed. Compare this value with the datasheet to ensure your driver can handle the charge and to optimize switching performance.

Specifies the total count of individual transistor die or chips integrated within a single component package. This is critical for multi-transistor arrays, Darlington pairs, or modules. Verify against the datasheet to ensure the package meets your circuit design requirements for channel count and configuration.

Typical output capacitance (Coss) of a power semiconductor, measured between drain and source. It affects switching losses and high-frequency behavior. Compare values when designing snubbers or resonant converters. Always verify against the datasheet for your operating conditions.

Maximum gate-source voltage rating for a MOSFET. This is the absolute maximum voltage that can be applied between gate and source without damaging the oxide layer. Ensure your gate drive circuit never exceeds this limit, including transients and ringing.

Typical gate-source threshold voltage at which the MOSFET begins to conduct. Check this value to ensure proper gate drive voltage levels in your switching application. Compare with min and max values from datasheet.

Maximum drain-source voltage rating for MOSFETs. This is the highest voltage that can be applied between drain and source without causing breakdown. Check the datasheet for absolute maximum ratings and ensure your circuit operates well below this limit for reliability.

Typical gate-drain charge (Qgd) in nanocoulombs, indicating the charge required to switch the MOSFET's drain during turn-off. Lower values enable faster switching and reduced losses. Verify against datasheet for your operating conditions.

Maximum continuous drain current that the MOSFET can handle at a case temperature of 100 °C. This value is lower than at 25 °C due to thermal limits. Compare it with your operating current and verify against the datasheet for safe design.

Identifies the physical package type or designator, such as SOIC, QFN, or DIP. This determines PCB footprint, thermal performance, and assembly compatibility. Verify the package matches your board layout and manufacturing capabilities. Check the datasheet for exact dimensions.

Maximum gate-source threshold voltage at 25°C. This is the highest gate-source voltage at which the MOSFET starts to conduct. Ensure your drive voltage exceeds this threshold to fully turn on the device, especially in low-voltage gate drive designs.

Maximum junction temperature is the highest allowable operating temperature of the semiconductor die. Exceeding it can cause thermal damage or reduced reliability. Compare this limit with your application's worst-case thermal conditions and verify against the datasheet's thermal specifications.

Voltage level for electrostatic discharge immunity, indicating the device's ability to withstand ESD events without failure. Higher values mean better robustness in handling. Verify this rating against your application's ESD requirements to ensure reliable operation in harsh environments.

Typical drain-source on-resistance when the gate-source voltage is 10 V. Lower values reduce conduction losses and heat. Compare this parameter across MOSFETs for switching and power applications, and verify it against the datasheet's test conditions.

Indicates whether ESD protection diodes are built-in between gate and source. This feature helps protect the MOSFET from electrostatic discharge during handling and operation. Confirm this attribute when designing for high-reliability applications or when external protection is not desired.

Indicates the component meets AEC-Q or other automotive reliability standards. Verify the specific qualification level in the datasheet. Essential for designs targeting automotive applications where extended temperature ranges and high vibration resistance are critical.

Minimum gate-source threshold voltage at 25°C. This is the lowest gate-source voltage at which the MOSFET begins to turn on. Use this value to ensure your gate drive voltage is sufficiently above it to guarantee conduction under all operating conditions.

This is the maximum drain-source on-resistance when the gate-source voltage is 10 V. Lower values mean less conduction loss. Check this against your thermal and efficiency requirements, and verify it in the datasheet for your operating conditions.

Typical drain-source on-resistance when the gate-source voltage is 2.5 V. This low-voltage drive condition is common in battery-powered or logic-level applications. Lower resistance improves efficiency, but verify that the MOSFET is fully enhanced at this voltage per the datasheet.

Maximum drain-source on-resistance when the gate-source voltage is 5 V. Lower values reduce conduction losses. Compare this parameter across MOSFETs for your switching or linear application, and verify it against the datasheet's test conditions.

Typical drain-source on-resistance when the gate-source voltage is 5 V. Lower values mean less conduction loss. Compare this parameter across MOSFETs for your switching or load application, and always verify against the datasheet's test conditions.

Total gate charge required to switch the MOSFET at a gate-source voltage of 10 V. Lower values reduce switching losses and improve efficiency. Compare this parameter when designing gate drivers or high-frequency circuits, and verify against the datasheet for your operating conditions.

Maximum continuous drain current for a MOSFET or transistor. This is the highest current the device can handle continuously without exceeding thermal limits. Verify against the datasheet for your operating conditions, including heatsinking and ambient temperature.

Maximum drain-source on-resistance at a gate-source voltage of 2.5 V. This worst-case value is essential for calculating conduction losses in low-voltage drive circuits. Ensure your design accounts for this limit, especially when operating near the threshold voltage, as specified in the datasheet.

Maximum total power the component can dissipate without damage. Compare across parts to ensure adequate thermal margin for your application. Verify against datasheet conditions, as derating may apply at high temperatures.

Maximum pulsed drain current for MOSFETs. This value indicates the highest current the device can handle during a short pulse. Compare with continuous drain current and verify against the datasheet for pulse width and duty cycle limitations.

Indicates when the component was first introduced to the market. Useful for assessing product maturity, lifecycle stage, and availability. Check the datasheet for the exact release date and compare with similar parts to ensure long-term supply.

Specifies the electrical channel configuration, such as unidirectional or bidirectional, for signal or power routing. This attribute is critical for selecting components like multiplexers, isolators, or level shifters. Verify the channel type against your application requirements and the datasheet to ensure correct signal flow and compatibility.