NXU0104PW Voltage translators (level-shifters) by Nexperia

Specifies the logical or operational function of the component, such as switching, amplification, or regulation. This attribute helps identify the device's role in a circuit. Verify the function against the datasheet to ensure it matches your application requirements.

Total pin count of the component, including power, ground, and signal pins. This determines the package footprint and PCB layout requirements. Verify the pinout and mechanical dimensions in the datasheet to ensure compatibility with your design.

Rth junction-to-case is the thermal resistance from the semiconductor junction to the case surface. It is essential for calculating heatsink requirements and junction temperature. Lower values mean better heat transfer to the case. Verify this parameter when designing thermal management.

Lifecycle status of the product, such as active, obsolete, or end-of-life. This affects long-term availability and design reliability. For production, choose active products to ensure supply continuity. Check the datasheet or manufacturer for lifecycle details.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Ambient temperature is the air temperature around the component during operation. It affects thermal performance and reliability. Verify the maximum ambient temperature rating in the datasheet to ensure proper derating and avoid overheating in your application.

Specifies the voltage thresholds that define logic high and low states for digital inputs and outputs. Compare these levels with your driver and receiver voltages to ensure reliable signal integrity. Verify against the datasheet for exact values and noise margins.

Identifies the physical package type or designator, such as SOIC, QFN, or DIP. This determines PCB footprint, thermal performance, and assembly compatibility. Verify the package matches your board layout and manufacturing capabilities. Check the datasheet for exact dimensions.

Outlines thermal design factors for managing heat generated during operation. Consider junction-to-ambient thermal resistance, PCB layout, and airflow to prevent overheating. Check the datasheet for maximum ratings and derating curves to ensure reliable performance.

Select the product category that best matches the component type, such as capacitor, resistor, connector, or integrated circuit. This helps filter the catalog and ensures you compare similar parts. Verify the category against the manufacturer's classification if needed.

Specifies the width of the digital data word processed by the component. Critical for ADCs, DACs, and digital interfaces. Verify against the datasheet to ensure compatibility with your system's resolution and data handling requirements.

Output drive capability is the maximum current the device can source or sink at its output pin. It determines the ability to drive loads such as LEDs, relays, or logic inputs. Ensure this rating exceeds your load requirements to avoid output voltage drops or damage.

Specifies the capacitive load applied to the output pin, affecting switching speed and stability. Compare this value with the datasheet's recommended range to ensure proper operation in your circuit design.

Supply voltage for the analog section of the component. This is critical for proper biasing and signal integrity. Verify that your power supply meets this voltage requirement to avoid performance degradation or damage. Check the datasheet for tolerances.

Supply voltage for the digital section of a mixed-signal or multi-rail device. Ensure this rail meets the specified range for proper logic operation. Check the datasheet for the relationship between VCC(B) and other supply voltages to avoid latch-up or logic errors.

Psi th junction-to-top is the thermal resistance from the semiconductor junction to the top of the package. It helps estimate junction temperature based on heat flow through the top. Use this value for thermal design when cooling is applied to the top surface.

Time from input transition to corresponding output change. Critical for timing analysis in logic circuits, signal paths, and high-speed designs. Compare values across devices to ensure your system meets setup and hold requirements. Always verify against the datasheet for exact conditions.

Rth junction-to-ambient is the thermal resistance from the semiconductor junction to the surrounding air. It is used to estimate junction temperature under natural convection. Lower values indicate better heat dissipation. Verify this parameter for your PCB layout and airflow conditions.