Supply original MSP430F6734IPZ, Embedded - Microcontrollers, by texas
Pictures are for reference only. Please contact us for the latest pictures.
Availability
Price Range
| Quality | Unit Price |
|---|---|
| 1 | |
| 10 | |
| 30 | |
| 100 | |
| 500 | |
| 1,000 |
Due to different local policies, please contact us for the latest quotation.
We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.
Overview
The MSP430F6736AIPZ is a 16-bit microcontroller from Texas Instruments' MSP430F6xx series. It has a maximum operating temperature of +85°C and is packaged in a 100-LQFP package. It has 72 I/O pins, a 25MHz speed, and a 16-bit data bus width. It features FLASH program memory, I2C, IrDA, LIN, SCI, SPI, UART/USART connectivity, 8x10b and 3x24b A/D data converters, Brown-out Detect/Reset, DMA, LCD, POR, PWM, and WDT peripherals.
Features:
• 16-bit microcontroller from Texas Instruments' MSP430F6xx series
• Maximum operating temperature of +85°C
• Packaged in a 100-LQFP package
• 72 I/O pins
• 25MHz speed
• 16-bit data bus width
• FLASH program memory
• I2C, IrDA, LIN, SCI, SPI, UART/USART connectivity
• 8x10b and 3x24b A/D data converters
• Brown-out Detect/Reset, DMA, LCD, POR, PWM, and WDT peripheralsApplications:
The MSP430F6736AIPZ is suitable for a wide range of applications, including industrial automation, consumer electronics, medical devices, and automotive applications. It is also suitable for applications that require low power consumption, such as battery-powered devices.
Product Attribute
Product Parameter
Export Classifications & Environmental
Articles
This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.
The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.
With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.
Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.