Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samples5120615-1 Memory Connectors - PC Card Sockets by TE Connectivity
5120615-1 is a Memory Connectors - PC Card Sockets model from TE Connectivity, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Connectors, Interconnects / Memory Connectors - PC Card Sockets product path. CONN COMPACT FLASH CARD R/A SMD. TrustCompo combines the available model, brand, hierarchy, and specification details around 5120615-1 so buyers can move faster from review to quotation.
RoHS
Datasheet
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
-
Min Quantity
1
Category
Connectors, InterconnectsSub Category
Memory Connectors - PC Card SocketsDescription
CONN COMPACT FLASH CARD R/A SMD
key Attributes
-
Datasheet
View 5120615-1 DatasheetTechnical document
Open The Official Datasheet
Review the latest datasheet for 5120615-1 from TE Connectivity in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Fast scan
Popular Specs Surfaced First
Product Attribute
Contact Finish Thickness
30.0μin 0.76μm
Product Attribute
Option
GENERAL PURPOSE
Product Attribute
Termination
SOLDER
Product Attribute
Part Status
Active
Product Attribute
DIN Conformance
NO
Product Attribute
IEC Conformance
NO
Contact Finish Thickness
30.0μin 0.76μm
Option
GENERAL PURPOSE
Termination
SOLDER
Part Status
Active
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Sealable
NO
Mixed Contacts
NO
MIL Conformance
NO
Contact Finish
Gold
Manufacturer
TE Connectivity
Flammability Rating
UL94 V-0
Number Of Rows
2
Number Of PCB Rows
2
Categories
Connectors, Interconnects
Contact Pattern
RECTANGULAR
Color
BLACK
Gender
MALE
Reliability
COMMERCIAL
Plating Thickness
30μin
REACH Status
REACH Unaffected
Underplate Material
Nickel
Circuit Application
Signal
ECCN
EAR99
Orientation
Right Angle
HTS Code
8536.69.40.40
Contact Plating
Gold, Tin
Body/Shell Style
Receptacle
Reference Standard
UL
Mount
Surface Mount
Housing Material
Polymer
Contact Material
Copper
Number Of Positions
50
Total Number Of Contacts
50
Lead Pitch
1.27mm
Pitch
1.27mm
Mating Contact Row Spacing
0.05 inch
Lifecycle Status
ACTIVE (Last Updated: 5 months ago)
Feature
Board Guide
Published
2005
Insulation Resistance
1000000000Ohm
Packaging
Tape & Reel (TR)
PCB Contact Pattern
STAGGERED
Factory Lead Time
17 Weeks
Mounting Type
Surface Mount, Right Angle
Min Operating Temperature
-67°C
Current Rating
500mA
Contact Current Rating
500mA
Rated Current (Signal)
0.5A
Shielding
Unshielded
Series
-
PCB Contact Row Spacing
1.905 mm
Width
5.2mm
Contact Resistance
40mOhm
Length
45.57mm
Height Above Board
0.205 5.20mm
Height
21.4mm
Max Operating Temperature
185°C
Contact Style
RND PIN-SKT
Mounting Feature
Normal, Standard - Top
Connector Type
Connector
Insertion, Removal Method
Push In, Pull Out
Sub-Categories
Memory Connectors - PC Card Sockets
Card Type
CompactFlash® - Type I
Manufacturer'S Part No.
5120615-1
Depth
21.36mm
JESD-609 Code
e3
Moisture Sensitivity Level (MSL)
1 (Unlimited)
RoHS Status
RoHS Compliant
ECCN Code
EAR99
HTSUS
8536.69.4040
REACH SVHC
No SVHC
Common questions
Product FAQ
Quick answers for buyers reviewing 5120615-1, stock, documentation, and sourcing steps.
What is 5120615-1?
5120615-1 is a Memory Connectors - PC Card Sockets component from TE Connectivity. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for 5120615-1?
5120615-1 is listed with package reference -. The current product description is CONN COMPACT FLASH CARD R/A SMD, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is 5120615-1 available in stock?
This page currently shows 153231 units in stock and 99745 units available for 5120615-1. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for 5120615-1?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for 5120615-1 by TE Connectivity. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for 5120615-1?
Yes. This page links to the datasheet for 5120615-1 by TE Connectivity, so engineers and buyers can review package, ratings, and application details before purchase.
How should buyers verify 5120615-1 before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for 5120615-1 before approving the order.
Memory Connectors - PC Card Sockets
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around 5120615-1, Memory Connectors - PC Card Sockets, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC