Package and footprint review
Clarify package fit, mechanical references, and footprint-related questions before design or sourcing moves forward.
Read the manufacturer datasheet for 74HC112PW,118 by Nexperia. Search the PDF, review the main part details, and request pricing for this Logic - Flip Flops component without leaving the page.
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Technical summary
74HC112PW,118 from Nexperia is a Logic - Flip Flops device in TSSOP-16 package. Use this manufacturer datasheet to review its electrical, mechanical, and ordering information.
Supply Voltage
2 V to 6 V
Mounting Type
Surface Mount
Manufacturer
Nexperia
Use the 74HC112PW,118 datasheet from Nexperia to verify the ratings, package details, operating limits, and ordering information that apply to your design or sourcing decision.
Embedded PDF
Engineering support
If your team is stuck on package interpretation, pin-level review, missing electrical details, or qualification questions around 74HC112PW,118 from Nexperia, contact our engineering-friendly team for a more technical discussion.
You can email our engineering support contact at [email protected], or use the contact page if your question needs a broader handoff.
Clarify package fit, mechanical references, and footprint-related questions before design or sourcing moves forward.
Work through pin naming, signal mapping, interface expectations, and other datasheet interpretation issues.
Surface the missing specs, compliance documents, or qualification details your team still needs before approval.
74HC112PW,118 cross reference and alternatives
Review mapped alternatives for 74HC112PW,118 from Nexperia. Compare replacement type, package, lifecycle, stock, and sourcing context before RFQ or engineering approval.
74HC112PW,118 is a HC112 P2P-review candidate for MC74HC112ADTG; choose SOIC or TSSOP package to match the board and verify temperature/timing.
Replacement Type
Pin-to-pin option
Lifecycle status
5
key Attributes
-
Available Quantity
12,000
74HC112PW,118 is a HC112 P2P-review candidate for MC74HC112ADTR2G; choose SOIC or TSSOP package to match the board and verify temperature/timing.
Replacement Type
Pin-to-pin option
Lifecycle status
5
key Attributes
-
Available Quantity
12,000
74HC112PW,118 is a HC112 P2P-review candidate for MC74HC112ADR2G; choose SOIC or TSSOP package to match the board and verify temperature/timing.
Replacement Type
Pin-to-pin option
Lifecycle status
5
key Attributes
-
Available Quantity
12,000
Logic - Flip Flops
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Common questions
74HC112PW,118 is a Logic - Flip Flops component from Nexperia. This page provides the manufacturer datasheet together with the core part information needed for review and sourcing.
Use the PDF search field above the viewer. Search runs inside the PDF.js reader so you can review matches without leaving the document.
Yes. Use the Request Quote action on this page to submit your email, quantity, and target price for 74HC112PW,118 from Nexperia.
This datasheet page lists 74HC112PW,118 with package reference TSSOP-16. Engineers should use the PDF to verify footprint, pin layout, and mechanical details before design or replacement decisions.
Start with the sections covering key ratings, electrical limits, interface behavior, and the attribute group beginning with Product Attribute. Those areas usually confirm whether 74HC112PW,118 fits the intended design constraints.
Yes. This page provides a direct download for the 74HC112PW,118 manufacturer datasheet PDF from Nexperia, while keeping the HTML datasheet page available for search and review.
