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Alternative part analysis

CY14B108K-ZS45XI replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for CY14B108K-ZS45XI, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.

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Parameter Comparison Chart
Current part
CY14B108K-ZS45XI

Cypress Semiconductor

Part NumberCY14B108K-ZS45XI
ManufacturerCypress Semiconductor
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
PackageTSOP
Series*
Key Attributes-
DescriptionIC NVSRAM 8M PARALLEL 44TSOP II
Lifecycle-
Stock60,094
Available54,530
Min Order1
DatasheetAvailable
Supply Voltage-Max (Vsup)3.6V
Terminal FinishMatte Tin (Sn)
Density8 Mb
Data Bus Width8b
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Memory Size8Mb 1M x 8
Logic FunctionClock
Time FormatHH:MM:SS
Part StatusActive
PackagingTray
REACH StatusREACH Unaffected
Lead FreeLead Free
Contact PlatingGold, Tin
Mounting TypeSurface Mount
Factory Lead Time8 Weeks
Published2005
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
Terminal Pitch0.8mm
Operating Temperature-40°C~85°C TA
Supply Voltage3V
Series*
Number of Functions1
Reflow Temperature-Max (s)30
Radiation HardeningNo
Number of Pins44
Number of Terminations44
MountSurface Mount
ManufacturerCypress Semiconductor
Operating Supply Voltage3V
Pin Count44
Memory TypeNon-Volatile
Memory InterfaceParallel
Sub-CategoriesMemory
Word Size8b
Memory Width8
Nominal Supply Current57mA
Access Time (Max)45 ns
Write Cycle Time - Word, Page45ns
Organization1MX8
Length18.415mm
ECCN3A991B2A
SubcategorySRAMs
TechnologyNVSRAM (Non-Volatile SRAM)
Memory FormatNVSRAM
HTS Code8542.32.00.41
Package / Case44-TSOP (0.400, 10.16mm Width)
Standby Current-Max0.01A
Base Part NumberCY14B108
Manufacturer's Part No.CY14B108K-ZS45XI
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.32.0041
ECCN Code3A991.B.2.A
Height Seated (Max)1.194mm
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing CY14B108K-ZS45XI replacement and equivalent-part options.

What is a cross-reference page for CY14B108K-ZS45XI?

This page groups mapped replacement options for CY14B108K-ZS45XI so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for CY14B108K-ZS45XI?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for CY14B108K-ZS45XI alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to CY14B108K-ZS45XI?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is CY14B108K-ZS45XI obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to CY14B108K-ZS45XI from Cypress Semiconductor is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.