What is a cross-reference page for PIC32MX170F256B-I/SP?
This page groups mapped replacement options for PIC32MX170F256B-I/SP so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.
Alternative part analysis
PIC32MX170F256B-I/SP replacements, alternatives, and cross reference
Compare mapped replacement and alternative options for PIC32MX170F256B-I/SP, then verify package, specifications, and application fit before approval.
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Specification view
Parameter Comparison Chart
A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.
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| Parameter Comparison Chart | Current part PIC32MX170F256B-I/SP Microchip Technology |
|---|---|
| Part Number | PIC32MX170F256B-I/SP |
| Manufacturer | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Subcategory | Embedded - Microcontrollers |
| Package | DIP |
| Series | PIC® 32MX |
| Key Attributes | - |
| Description | IC MCU 32BIT 256KB FLASH 28SDIP |
| Lifecycle | - |
| Stock | 79,355 |
| Available | 76,827 |
| Min Order | 1 |
| Datasheet | Available |
| Part Status | Active |
| Mounting Type | Through Hole |
| REACH Status | REACH Unaffected |
| Packaging | Tube |
| Factory Lead Time | 9 Weeks |
| Published | 2014 |
| Categories | Integrated Circuits (ICs) |
| Terminal Position | DUAL |
| Technology | CMOS |
| Length | 35.56mm |
| Operating Temperature | -40°C~85°C TA |
| Sub-Categories | Embedded - Microcontrollers |
| ECCN | 3A991A2 |
| Manufacturer | Microchip Technology |
| Screening Level | TS 16949 |
| Package / Case | 28-DIP (0.300, 7.62mm) |
| Number of Terminations | 28 |
| Number of Pins | 28 |
| Mount | Through Hole |
| Height | 3.81mm |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reflow Temperature-Max (s) | NOT SPECIFIED |
| Supply Voltage | 3.3V |
| Frequency | 40MHz |
| Number of ADC Channels | 10 |
| Operating Supply Voltage | 3.6V |
| Interface | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB |
| Series | PIC® 32MX |
| Width | 7.493mm |
| Number of I/O | 21 |
| Weight | 4.190003g |
| Base Part Number | PIC32MX170F256B |
| Manufacturer's Part No. | PIC32MX170F256B-I/SP |
| Oscillator Type | Internal |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Memory Size | 256kB |
| Connectivity | I2C, IrDA, LINbus, SPI, UART/USART |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Core Size | 32-Bit |
| Program Memory Size | 256KB 256K x 8 |
| Data Converter | A/D 10x10b |
| RAM Size | 64K x 8 |
| Program Memory Type | FLASH |
| Watchdog Timer | Yes |
| Has ADC | YES |
| Number of I2C Channels | 2 |
| DMA Channels | YES |
| Bit Size | 32 |
| Data Bus Width | 32b |
| Voltage - Supply (Vcc/Vdd) | 2.3V~3.6V |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| Core Architecture | PIC |
| Core Processor | MIPS32® M4K™ |
| Number of PWM Channels | 5 |
| JESD-609 Code | e3 |
| RoHS Status | ROHS3 Compliant |
| HTSUS | 8542.31.0001 |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Actions |
Cross-reference FAQ
Replacement Part Questions
Short answers for teams reviewing PIC32MX170F256B-I/SP replacement and equivalent-part options.
Does a mapped alternative mean a guaranteed drop-in replacement for PIC32MX170F256B-I/SP?
Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.
Which parameters should teams compare first for PIC32MX170F256B-I/SP alternatives?
Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.
Can I request a quote for an alternative to PIC32MX170F256B-I/SP?
Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.
Is PIC32MX170F256B-I/SP obsolete, and what replacement should buyers review first?
Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.
Engineering support
Need help validating the replacement path?
If your team is unsure whether a mapped alternative to PIC32MX170F256B-I/SP from Microchip Technology is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.
Contact a hardware engineer
Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.
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Package and pin compatibility
Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.
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Parameter and function gaps
Surface the electrical, interface, or application-fit questions that still need confirmation before approval.
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Qualification and approval prep
Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.