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Alternative part analysis

PIC32MX150F128B-V/SP replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for PIC32MX150F128B-V/SP, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
PIC32MX150F128B-V/SP

Microchip Technology

Part NumberPIC32MX150F128B-V/SP
ManufacturerMicrochip Technology
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
PackageDIP
SeriesAutomotive, AEC-Q100, PIC® 32MX
Key Attributes-
DescriptionIC MCU 32BIT 128KB FLASH 28SDIP
Lifecycle-
Stock12,692
Available44,533
Min Order1
DatasheetAvailable
Supply Voltage-Max (Vsup)3.6V
Oscillator TypeInternal
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Program Memory Size128KB 128K x 8
Memory Size128kB
Terminal FinishMatte Tin (Sn) - annealed
Core Size32-Bit
RAM Size32K x 8
Data ConverterA/D 10x10b
CPU FamilyPIC
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
DAC ChannelsNO
Number of Timers/Counters5
DMA ChannelsYES
Number of UART Channels2
Bit Size32
Data Bus Width32b
Voltage - Supply (Vcc/Vdd)2.3V~3.6V
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Core ArchitecturePIC
ConnectivityI2C, IrDA, LINbus, PMP, SPI, UART/USART
Core ProcessorMIPS32® M4K™
Supply Current-Max30mA
Part StatusActive
Mounting TypeThrough Hole
Published2008
REACH StatusREACH Unaffected
PackagingTube
Factory Lead Time15 Weeks
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
TechnologyCMOS
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
Operating Temperature-40°C~105°C TA
ECCN3A991A2
ManufacturerMicrochip Technology
Package / Case28-DIP (0.300, 7.62mm)
Radiation HardeningNo
Number of Terminations28
Number of Pins28
Pin Count28
MountThrough Hole
Supply Voltage3.3V
Frequency40MHz
Number of I/O21
InterfaceI2C, I2S, IrDA, LIN, SPI, UART, USART
Length34.671mm
SeriesAutomotive, AEC-Q100, PIC® 32MX
Base Part NumberPIC32MX150F128B
Manufacturer's Part No.PIC32MX150F128B-V/SP
JESD-609 Codee3
Moisture Sensitivity Level (MSL)1 (Unlimited)
RoHS StatusROHS3 Compliant
HTSUS8542.31.0001
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing PIC32MX150F128B-V/SP replacement and equivalent-part options.

What is a cross-reference page for PIC32MX150F128B-V/SP?

This page groups mapped replacement options for PIC32MX150F128B-V/SP so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for PIC32MX150F128B-V/SP?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for PIC32MX150F128B-V/SP alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to PIC32MX150F128B-V/SP?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is PIC32MX150F128B-V/SP obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to PIC32MX150F128B-V/SP from Microchip Technology is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.