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Alternative part analysis

PIC32MX170F512H-V/MR replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for PIC32MX170F512H-V/MR, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
PIC32MX170F512H-V/MR

Microchip Technology

Part NumberPIC32MX170F512H-V/MR
ManufacturerMicrochip Technology
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesAutomotive, AEC-Q100, PIC® 32MX
Key Attributes-
DescriptionIC MCU 32BIT 512KB FLASH 64QFN
Lifecycle-
Stock60,524
Available60,614
Min Order1
DatasheetAvailable
Part StatusActive
REACH StatusREACH Unaffected
PackagingTube
Mounting TypeSurface Mount
Factory Lead Time14 Weeks
Published2014
CategoriesIntegrated Circuits (ICs)
TechnologyCMOS
Terminal PositionQUAD
Sub-CategoriesEmbedded - Microcontrollers
Operating Temperature-40°C~105°C TA
Package / Case64-VFQFN Exposed Pad
Weight206.29948mg
ECCN3A991A2
ManufacturerMicrochip Technology
Screening LevelAEC-Q100; TS 16949
Surface MountYES
Radiation HardeningNo
Number of Terminations64
Address Bus Width16
Supply Voltage3.3V
Frequency40MHz
Operating Supply Voltage3.6V
Length9mm
InterfaceI2C, I2S, IrDA, LIN, SPI, UART, USART, USB
On Chip Program ROM Width8
Number of I/O53
Base Part NumberPIC32MX170F512H
SeriesAutomotive, AEC-Q100, PIC® 32MX
Manufacturer's Part No.PIC32MX170F512H-V/MR
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
JESD-30 CodeS-PQCC-N64
Oscillator TypeInternal
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Terminal FinishMatte Tin (Sn) - annealed
Memory Size512kB
Core Size32-Bit
RAM Size64K x 8
Program Memory Size512KB 512K x 8
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
DAC ChannelsNO
Number of Timers/Counters5
DMA ChannelsYES
Bit Size32
Data Bus Width32b
Voltage - Supply (Vcc/Vdd)2.3V~3.6V
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Core ArchitecturePIC
ConnectivityI2C, IrDA, LINbus, PMP, SPI, UART/USART
Core ProcessorMIPS32® M4K™
Data ConverterA/D 28x10b
Height Seated (Max)1mm
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing PIC32MX170F512H-V/MR replacement and equivalent-part options.

What is a cross-reference page for PIC32MX170F512H-V/MR?

This page groups mapped replacement options for PIC32MX170F512H-V/MR so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for PIC32MX170F512H-V/MR?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for PIC32MX170F512H-V/MR alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to PIC32MX170F512H-V/MR?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is PIC32MX170F512H-V/MR obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to PIC32MX170F512H-V/MR from Microchip Technology is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.