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Alternative part analysis

S29PL127J60TFI130 replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for S29PL127J60TFI130, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.

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Parameter Comparison Chart
Current part
S29PL127J60TFI130

Cypress Semiconductor

Part NumberS29PL127J60TFI130
ManufacturerCypress Semiconductor
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
Package-
SeriesPL-J
Key Attributes-
DescriptionIC FLASH 128M PARALLEL 56TSOP
Lifecycle-
Stock75,671
Available66,364
Min Order1
DatasheetAvailable
PackagingTray
Mounting TypeSurface Mount
Published2003
Factory Lead Time6 Weeks
Part StatusObsolete
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
Terminal Pitch0.5mm
Operating Temperature-40°C~85°C TA
Supply Voltage3V
Number of Functions1
Radiation HardeningNo
Reflow Temperature-Max (s)40
MountSurface Mount
ManufacturerCypress Semiconductor
Memory TypeNon-Volatile
Number of Terminations56
Number of Pins56
Length18.4mm
Common Flash InterfaceYES
HTS Code8542.32.00.51
Data PollingYES
Memory InterfaceParallel
Sub-CategoriesMemory
Ready/BusyYES
Command User InterfaceYES
Sync/AsyncAsynchronous
Toggle BitYES
Word Size16b
Memory FormatFLASH
Memory Width16
Nominal Supply Current55mA
Sector Size4K32K
Standby Current-Max0.000005A
TechnologyFLASH - NOR
Organization8MX16
Package / Case56-TFSOP (0.724, 18.40mm Width)
Boot BlockBOTTOM/TOP
Write Cycle Time - Word, Page60ns
Address Bus Width23b
Additional FeatureTOP AND BOTTOM BOOT BLOCK
SeriesPL-J
Access Time (Max)60 ns
Manufacturer's Part No.S29PL127J60TFI130
Number of Sectors/Size16254
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Height Seated (Max)1.2mm
Supply Voltage-Max (Vsup)3.6V
Terminal FinishMatte Tin (Sn)
Power Supplies3/3.3V
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Programming Voltage3V
Density128 Mb
Memory Size128Mb 8M x 16
Page Size8words
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing S29PL127J60TFI130 replacement and equivalent-part options.

What is a cross-reference page for S29PL127J60TFI130?

This page groups mapped replacement options for S29PL127J60TFI130 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for S29PL127J60TFI130?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for S29PL127J60TFI130 alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to S29PL127J60TFI130?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is S29PL127J60TFI130 obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to S29PL127J60TFI130 from Cypress Semiconductor is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.