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Alternative part analysis

DSPIC33EP64MC502-I/SP replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for DSPIC33EP64MC502-I/SP, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
DSPIC33EP64MC502-I/SP

Microchip Technology

Part NumberDSPIC33EP64MC502-I/SP
ManufacturerMicrochip Technology
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
PackageDIP
SeriesdsPIC™ 33EP
Key Attributes-
DescriptionIC MCU 16BIT 64KB FLASH 28SDIP
Lifecycle-
Stock154,001
Available61,588
Min Order1
DatasheetAvailable
Part StatusActive
Mounting TypeThrough Hole
REACH StatusREACH Unaffected
PackagingTube
Published2011
Factory Lead Time21 Weeks
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
TechnologyCMOS
Operating Temperature-40°C~85°C TA
Sub-CategoriesEmbedded - Microcontrollers
ECCN3A991A2
ManufacturerMicrochip Technology
SubcategoryDigital Signal Processors
Package / Case28-DIP (0.300, 7.62mm)
InterfaceCAN, I2C, IrDA, LIN, SPI, UART, USART
SeriesdsPIC™ 33EP
Radiation HardeningNo
Number of Terminations28
Number of Pins28
Pin Count28
Operating Supply Voltage3.3V
Surface MountNO
On Chip Program ROM Width24
Supply Voltage3.3V
Number of I/O21
Frequency70MHz
Length34.671mm
Base Part NumberDSPIC33EP64MC502
Manufacturer's Part No.DSPIC33EP64MC502-I/SP
Data Bus Width16b
Supply Voltage-Max (Vsup)3.6V
Oscillator TypeInternal
Core Size16-Bit
FormatFLOATING-POINT
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER
Data ConverterA/D 6x10b/12b
Terminal FinishMatte Tin (Sn) - annealed
Core ProcessordsPIC
Memory Size64kB
ConnectivityCANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
DAC ChannelsNO
Bit Size16
Number of Timers/Counters5
DMA ChannelsYES
Voltage - Supply (Vcc/Vdd)3V~3.6V
RAM (words)4096
Program Memory Size64KB 22K x 24
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
RAM Size4K x 16
JESD-609 Codee3
Moisture Sensitivity Level (MSL)1 (Unlimited)
RoHS StatusROHS3 Compliant
HTSUS8542.31.0001
ECCN Code3A991.A.2
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing DSPIC33EP64MC502-I/SP replacement and equivalent-part options.

What is a cross-reference page for DSPIC33EP64MC502-I/SP?

This page groups mapped replacement options for DSPIC33EP64MC502-I/SP so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for DSPIC33EP64MC502-I/SP?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for DSPIC33EP64MC502-I/SP alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to DSPIC33EP64MC502-I/SP?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is DSPIC33EP64MC502-I/SP obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to DSPIC33EP64MC502-I/SP from Microchip Technology is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.