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Alternative part analysis

LM3S6637-IBZ50-A2 replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for LM3S6637-IBZ50-A2, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
LM3S6637-IBZ50-A2

Texas Instruments

Part NumberLM3S6637-IBZ50-A2
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesStellaris® ARM® Cortex®-M3S 6000
Key Attributes-
DescriptionIC MCU 32BIT 128KB FLASH 108BGA
Lifecycle-
Stock112,106
Available82,677
Min Order1
DatasheetRequest
RoHS StatusROHS3 Compliant
HTSUS8542.31.0001
JESD-609 Codee1
Moisture Sensitivity Level (MSL)3 (168 Hours)
Oscillator TypeInternal
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Core ArchitectureARM
Program Memory Size128KB 128K x 8
Memory Size128kB
Core Size32-Bit
RAM Size32K x 8
Data ConverterA/D 4x10b
Voltage - Supply (Vcc/Vdd)2.25V~2.75V
Core ProcessorARM® Cortex®-M3
ConnectivityEthernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Program Memory TypeFLASH
DMA ChannelsNO
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
Number of A/D Converters1
DAC ChannelsNO
Number of UART Channels2
Bit Size32
Data Bus Width32b
Number of Timers/Counters6
PackagingTray
Lead FreeLead Free
Mounting TypeSurface Mount
Part StatusObsolete
Length10mm
CategoriesIntegrated Circuits (ICs)
Frequency50MHz
Peak Reflow Temperature (Cel)260
TechnologyCMOS
Terminal Pitch0.8mm
ManufacturerTexas
Operating Temperature-40°C~85°C TA
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
ECCN3A991A2
Terminal FormBALL
InterfaceEthernet, I2C, IrDA, SPI, UART, USART
Package / Case108-LFBGA
SeriesStellaris® ARM® Cortex®-M3S 6000
Radiation HardeningNo
Supply Voltage2.5V
MountSurface Mount
Operating Supply Voltage3.3V
Terminal PositionBOTTOM
Number of Bits10
Number of Terminations108
Number of Pins108
Pin Count108
Number of I/O41
Base Part NumberLM3S6637
Manufacturer's Part No.LM3S6637-IBZ50-A2
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing LM3S6637-IBZ50-A2 replacement and equivalent-part options.

What is a cross-reference page for LM3S6637-IBZ50-A2?

This page groups mapped replacement options for LM3S6637-IBZ50-A2 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for LM3S6637-IBZ50-A2?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for LM3S6637-IBZ50-A2 alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to LM3S6637-IBZ50-A2?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is LM3S6637-IBZ50-A2 obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to LM3S6637-IBZ50-A2 from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.