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Alternative part analysis

MX29GL128FHT2I-70G replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MX29GL128FHT2I-70G, then verify package, specifications, and application fit before approval.

Compare MX29GL128FHT2I-70G against mapped replacement options
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This product currently does not show a published cross-reference list. Use RFQ support if your team needs an alternative part review.

Specification view

Parameter Comparison Chart

A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.

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The left column stays visible so buyers can keep the spec label in view while scanning multiple alternatives.

Parameter Comparison Chart
Current part
Part NumberMX29GL128FHT2I-70G
ManufacturerMacronix
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
Package-
SeriesMX29GL
Key Attributes-
DescriptionIC FLASH 128M PARALLEL 56TSOP
Lifecycle-
Stock163,845
Available96,739
Min Order1
DatasheetAvailable
Height Seated (Max)1.2mm
Power Supplies3/3.3V
Terminal FinishMATTE TIN
Supply Current-Max0.1mA
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Programming Voltage3V
Alternate Memory Width8
Density128 Mb
Memory Size128Mb 16M x 8
Page Size8/16words
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.32.0071
JESD-30 CodeR-PDSO-G56
Part StatusActive
PackagingTray
REACH StatusREACH Unaffected
Lead FreeLead Free
Mounting TypeSurface Mount
Factory Lead Time10 Weeks
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Terminal Pitch0.5mm
Operating Temperature-40°C~85°C TA
Supply Voltage3V
Number of Functions1
Surface MountYES
Reflow Temperature-Max (s)40
Operating Supply Voltage3.6V
Memory TypeNon-Volatile
Number of Terminations56
Width14mm
ECCN3A991B1A
Length18.4mm
Common Flash InterfaceYES
Data PollingYES
Memory InterfaceParallel
Sub-CategoriesMemory
Ready/BusyYES
Command User InterfaceYES
Toggle BitYES
Standby Current-Max0.00003A
Memory FormatFLASH
Memory Width16
Number of Sectors/Size128
Write Cycle Time - Word, Page70ns
Access Time (Max)70 ns
Operating ModeASYNCHRONOUS
TechnologyFLASH - NOR
ManufacturerMacronix
SeriesMX29GL
Organization8MX16
Package / Case56-TFSOP (0.724, 18.40mm Width)
Sector Size128K
Manufacturer's Part No.MX29GL128FHT2I-70G
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MX29GL128FHT2I-70G replacement and equivalent-part options.

What is a cross-reference page for MX29GL128FHT2I-70G?

This page groups mapped replacement options for MX29GL128FHT2I-70G so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MX29GL128FHT2I-70G?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MX29GL128FHT2I-70G alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MX29GL128FHT2I-70G?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MX29GL128FHT2I-70G obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to MX29GL128FHT2I-70G from Macronix is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.