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Alternative part analysis

MX25L1606EZNI-12G replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MX25L1606EZNI-12G, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.

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Parameter Comparison Chart
Current part
Part NumberMX25L1606EZNI-12G
ManufacturerMacronix
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
Package-
SeriesMX25xxx05/06
Key Attributes-
DescriptionIC FLASH 16M SPI 86MHZ 8WSON
Lifecycle-
Stock78,852
Available86,643
Min Order1
DatasheetAvailable
PackagingTray
REACH StatusREACH Unaffected
ECCNEAR99
Lead FreeLead Free
Mounting TypeSurface Mount
Factory Lead Time16 Weeks
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
InterfaceSPI, Serial
Published2013
Qualification StatusNot Qualified
Operating Temperature-40°C~85°C TA
Supply Voltage3V
Part StatusNot For New Designs
Number of Functions1
Surface MountYES
Terminal Pitch1.27mm
Number of Terminations8
Pin Count8
Peak Reflow Temperature (Cel)NOT SPECIFIED
Reflow Temperature-Max (s)NOT SPECIFIED
Operating Supply Voltage3.6V
Memory TypeNon-Volatile
Width5mm
Length6mm
HTS Code8542.32.00.51
Sub-CategoriesMemory
Memory FormatFLASH
Standby Current-Max0.00002A
Endurance100000 Write/Erase Cycles
Write ProtectionHARDWARE/SOFTWARE
Memory InterfaceSPI
Package / Case8-WDFN Exposed Pad
TechnologyFLASH - NOR
ManufacturerMacronix
Operating ModeSYNCHRONOUS
SeriesMX25xxx05/06
Memory Width2
Write Cycle Time - Word, Page50μs, 3ms
Clock Frequency86MHz
Manufacturer's Part No.MX25L1606EZNI-12G
Organization8MX2
Power Supplies3/3.3V
Terminal FinishTin (Sn)
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Density16 Mb
Programming Voltage2.7V
Serial Bus TypeSPI
Memory Size16Mb 2M x 8
Alternate Memory Width1
Supply Current-Max0.025mA
Height Seated (Max)0.8mm
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
ECCN CodeEAR99
HTSUS8542.32.0071
JESD-30 CodeR-PDSO-N8
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MX25L1606EZNI-12G replacement and equivalent-part options.

What is a cross-reference page for MX25L1606EZNI-12G?

This page groups mapped replacement options for MX25L1606EZNI-12G so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MX25L1606EZNI-12G?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MX25L1606EZNI-12G alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MX25L1606EZNI-12G?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MX25L1606EZNI-12G obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to MX25L1606EZNI-12G from Macronix is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.