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Alternative part analysis

SPC560P50L5BEFBY replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for SPC560P50L5BEFBY, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
SPC560P50L5BEFBY

STMicroelectronics

Part NumberSPC560P50L5BEFBY
ManufacturerSTMicroelectronics
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
PackageLQFP
SeriesSPC56
Key Attributes-
DescriptionIC MCU 32BIT 512KB FLASH 144LQFP
Lifecycle-
Stock120,257
Available38,764
Min Order1
DatasheetAvailable
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
ECCN Code3A991.A.2
Oscillator TypeInternal
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Terminal FinishMatte Tin (Sn) - annealed
Memory Size512kB
Core Size32-Bit
Program Memory Size512KB 512K x 8
ROM (words)524288
PeripheralsDMA, POR, PWM, WDT
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
DMA ChannelsYES
Voltage - Supply (Vcc/Vdd)3V~3.6V
Bit Size32
Data Bus Width32b
Number of Programmable I/O80
Number of Timers/Counters6
RAM Size40K x 8
Core Processore200z0h
ConnectivityCANbus, LINbus, SPI, UART/USART
Data ConverterA/D 26x10b
Supply Current-Max89mA
Part StatusActive
PackagingTray
REACH StatusREACH Unaffected
Mounting TypeSurface Mount
Factory Lead Time23 Weeks
Length22mm
CategoriesIntegrated Circuits (ICs)
Terminal FormGULL WING
TechnologyCMOS
Terminal PositionQUAD
Terminal Pitch0.5mm
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
Operating Temperature-40°C~105°C TA
ECCN3A991A2
Package / Case144-LQFP
ManufacturerSTMicroelectronics
Frequency64MHz
Surface MountYES
Radiation HardeningNo
Operating Supply Voltage3.3V
Supply Voltage3.3V
Number of Pins144
Number of Terminations144
EEPROM Size64K x 8
Address Bus Width32
InterfaceCAN, LIN, SPI, UART, USART
Base Part NumberSPC560P
Number of I/O107
SeriesSPC56
Manufacturer's Part No.SPC560P50L5BEFBY
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing SPC560P50L5BEFBY replacement and equivalent-part options.

What is a cross-reference page for SPC560P50L5BEFBY?

This page groups mapped replacement options for SPC560P50L5BEFBY so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for SPC560P50L5BEFBY?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for SPC560P50L5BEFBY alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to SPC560P50L5BEFBY?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is SPC560P50L5BEFBY obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to SPC560P50L5BEFBY from STMicroelectronics is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.