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Alternative part analysis

LM3S5737-IQC50-A0 replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for LM3S5737-IQC50-A0, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
LM3S5737-IQC50-A0

Texas Instruments

Part NumberLM3S5737-IQC50-A0
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
PackageLQFP
SeriesStellaris® ARM® Cortex®-M3S 5000
Key Attributes-
DescriptionIC MCU 32BIT 128KB FLASH 100LQFP
Lifecycle-
Stock40,322
Available69,715
Min Order1
DatasheetRequest
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
PackagingTray
REACH StatusREACH Unaffected
Lead FreeLead Free
Mounting TypeSurface Mount
CategoriesIntegrated Circuits (ICs)
Frequency50MHz
Peak Reflow Temperature (Cel)260
Terminal FormGULL WING
TechnologyCMOS
ManufacturerTexas
Terminal PositionQUAD
Operating Temperature-40°C~85°C TA
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
Package / Case100-LQFP
ECCN3A991A2
Part StatusNot For New Designs
InterfaceCAN, I2C, IrDA, SPI, UART, USART, USB
Number of I/O61
SeriesStellaris® ARM® Cortex®-M3S 5000
Radiation HardeningNo
Supply Voltage2.5V
MountSurface Mount
Operating Supply Voltage3.3V
Number of Bits10
Number of Pins100
Pin Count100
Number of Terminations100
Length14mm
Address Bus Width8
Base Part NumberLM3S5737
Manufacturer's Part No.LM3S5737-IQC50-A0
Oscillator TypeInternal
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Data ConverterA/D 8x10b
Core ArchitectureARM
Program Memory Size128KB 128K x 8
Memory Size128kB
Core Size32-Bit
RAM Size64K x 8
Voltage - Supply (Vcc/Vdd)2.25V~2.75V
Core ProcessorARM® Cortex®-M3
ConnectivityCANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
Number of A/D Converters1
DAC ChannelsNO
Number of Timers/Counters5
DMA ChannelsYES
Bit Size32
Data Bus Width32b
Terminal FinishTIN
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing LM3S5737-IQC50-A0 replacement and equivalent-part options.

What is a cross-reference page for LM3S5737-IQC50-A0?

This page groups mapped replacement options for LM3S5737-IQC50-A0 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for LM3S5737-IQC50-A0?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for LM3S5737-IQC50-A0 alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to LM3S5737-IQC50-A0?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is LM3S5737-IQC50-A0 obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to LM3S5737-IQC50-A0 from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.