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Alternative part analysis

LM3S1B21-IBZ80-C3 replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for LM3S1B21-IBZ80-C3, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
LM3S1B21-IBZ80-C3

Texas Instruments

Part NumberLM3S1B21-IBZ80-C3
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesStellaris® ARM® Cortex®-M3S 1000
Key Attributes-
DescriptionIC MCU 32BIT 256KB FLASH 108BGA
Lifecycle-
Stock183,334
Available51,494
Min Order1
DatasheetRequest
Oscillator TypeInternal
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Data ConverterA/D 8x10b
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Core ArchitectureARM
Memory Size256kB
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER
Core Size32-Bit
Program Memory Size256KB 256K x 8
Core ProcessorARM® Cortex®-M3
Program Memory TypeFLASH
Watchdog TimerYes
Has ADCYES
PWM ChannelsYES
Number of Timers/Counters4
DMA ChannelsYES
Bit Size32
Data Bus Width32b
Number of A/D Converters8
Number of UART Channels3
RAM Size96K x 8
Voltage - Supply (Vcc/Vdd)1.08V~3.6V
ConnectivityEBI/EMI, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
PackagingTray
REACH StatusREACH Unaffected
Lead FreeLead Free
Mounting TypeSurface Mount
Part StatusObsolete
CategoriesIntegrated Circuits (ICs)
Peak Reflow Temperature (Cel)260
TechnologyCMOS
ManufacturerTexas
Operating Temperature-40°C~85°C TA
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
ECCN3A991A2
Terminal FormBALL
Number of I/O67
SeriesStellaris® ARM® Cortex®-M3S 1000
Package / Case108-LFBGA
Radiation HardeningNo
MountSurface Mount
Pbfree Codeyes
Operating Supply Voltage3.3V
Terminal PositionBOTTOM
Supply Voltage3.3V
Number of Bits10
Number of ADC Channels1
Frequency80MHz
Number of Terminations108
Number of Pins108
Pin Count108
InterfaceEBI/EMI, I2C, IrDA, LIN, SPI, UART, USART
Base Part NumberLM3S1B21
Manufacturer's Part No.LM3S1B21-IBZ80-C3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
JESD-609 Codee1
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing LM3S1B21-IBZ80-C3 replacement and equivalent-part options.

What is a cross-reference page for LM3S1B21-IBZ80-C3?

This page groups mapped replacement options for LM3S1B21-IBZ80-C3 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for LM3S1B21-IBZ80-C3?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for LM3S1B21-IBZ80-C3 alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to LM3S1B21-IBZ80-C3?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is LM3S1B21-IBZ80-C3 obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to LM3S1B21-IBZ80-C3 from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.